TQ Systems has released a COM Express Compact Type 6 module TQMx80UC based on the 8th generation Intel Core Mobile Processors code named “Whiskey-Lake U”. This module is well suited for industrial controllers, robotics applications, medical devices and point-of-sales. Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 W TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).
The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 GB and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s.
Four high-speed interfaces are available for this purpose. In addition, eMMC flash in sizes between 8 GB and 128 GB is available for the first time on the module. The COM Express Compact Module TQMx80UC with its dimensions of 95 mm x 95 mm and Type 6 pinout conforms to PICMG COM.0 R3.0. It is supported by the new TQ mainboard MB-COME6-3. Together with a 11 mm high heatspreader and a heatsink, the combination of boards results in an effective evaluation platform.
TQ Systems | www.tq-group.com
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