By Eric Brown
In April, Qualcomm announced its QCS605 SoC, calling it “the first 10nm FinFET fabricated SoC purpose built for the Internet of Things.” The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit with a 12V power supply is open for pre-orders at $429. The products will ship in early December.
Open-Q 605, front and back
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The QCS605 can run Linux or Android, but Intrinsyc supports its Open-Q 605 board only with Android 8.1.
Intrinsyc also recently launched an Open-Q 624A Development Kit based on a new Open-Q 624A SOM (see farther below).
Qualcomm QCS605 and Vision Intelligence Platform
The QCS605 SoC features 8x Kryo 300 CPU cores, two of which are 2.5GHz “gold” cores that are equivalent to Cortex-A75. The other six are 1.7GHz “silver” cores like the Cortex-A55 — Arm’s more powerful follow-on to Cortex-A53.
The QCS605 also integrates an Adreno 615 GPU, a Hexagon 685 DSP with Hexagon vector extensions (“HVX”), and a Spectra 270 ISP that supports dual 16-megapixel image sensors. Qualcomm also sells a QCS603 model that is identical except that it offers only 2x of the 1.7GHz “Silver” cores instead of six.
Qualcomm sells the QCS605 as part of a Vision Intelligence Platform — a combination of software and hardware starting with a Qualcomm AI Engine built around the Qualcomm Snapdragon Neural Processing Engine (NPE) software framework. The NPE provides analysis, optimization, and debugging tools for developing with Tensorflow, Caffe, and Caffe2 frameworks. The AI Engine also includes the Open Neural Network Exchange interchange format, the Android Neural Networks API, and the Qualcomm Hexagon Neural Network library, which together enable the porting of trained networks.
The Vision Intelligence Platform running on the QCS605 delivers up to 2.1 TOPS (trillion operations per second) of compute performance for deep neural network inferences, claims Qualcomm. The platform also supports up to 4K60 resolution or 5.7K at 30fps and supports multiple concurrent video streams at lower resolutions.
Other features include “staggered” HDR to prevent ghost effects in high-dynamic range video. You also get advanced electronic image stabilization, de-warp, de-noise, chromatic aberration correction, and motion compensated temporal filters in hardware.
Inside the Open-Q 605 SBC
Along with the Snapdragon 600 based Open-Q 600, the Open-Q 605 is the only Open-Q development board that Intrinsyc refers to as an SBC. Most Open-Q kits are compute modules or sandwich-style carrier board starter kits based on Intrinsyc modules equipped with Snapdragon SoCs, such as the recent, Snapdragon 670 based Open-Q 670 HDK.
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The only real-world coastline port is a USB Type-C that supports DisplayPort 1.4 with [email protected] support. If you’d rather use the Type-C port for USB or charging a user-supplied Li-Ion battery, you can turn to an HD-ready MIPI DSI interface with touch support. You also get 2x MIPI-CSI for dual cameras, as well as 2x analog audio.
The Open-Q 605 has a 76-pin expansion header for other interfaces, including an I2S/SLIMBus digital audio interface. The board runs on a 5-15V DC input and offers an extended -25 to 60°C operating range.
Specifications listed for the Open-Q 605 SBC include:
- Processor — Qualcomm QCS605 with Vision Intelligence Platform (2x up to 2.5GHz and 6x up to 1.7GHz Krait 300 cores); Adreno 615 GPU; Hexagon 685 DSP; Spectra 270 ISP; Qualcomm AI Engine and other VIP components
- Memory/storage — 4GB LPDDR4X and 32GB eMMC flash in combo eMCP package; microSD slot.
- 802.11b/g/n/ac 2×2 dual-band WiFi (Qualcomm WCN3990) with planned FCC/IC/CE certification
- Bluetooth 5.x
- Qualcomm GNSS (SDR660G) receiver with Qualcomm Location Suite Gen9 VT
- U.FL antenna connectors for WiFi, BT, GNSS
- Media I/O:
- DisplayPort 1.4 via USB Type-C up to [email protected] with USB data concurrency (USB and power)
- MIPI DSI (4-lane) with I2C touch interface on flex cable connector for up to 1080p30
- 2x MIPI-CSI (4-lane) with micro-camera module connectors
- 2x analog mic I/Ps, speaker O/P, headset I/O
- I2S/SLIMBus digital audio interface with 2x DMIC ports (via 76-pin expansion header)
- Expansion — 76-pin header (multiple SPI, I2C, UART, GPIO, and sensor I/O; digital and analog audio I/O, LED flash O/P, haptic O/P, power output rails
- Other features — 3x LEDs; 4x mounting holes; optional dev kit with quick start guide, docs, SW updates
- Operating temperature — -25 to 60°C
- Power — 5-15V DC jack and support for user-supplied Li-Ion battery with USB Type-C charging; PM670 + PM670L PMIC; 12V supply with dev kit
- Dimensions — 68 x 50 x 13mm
- Operating system — Android 8.1 Oreo
Open-Q 624A Development Kit
Back in May, Google preannounced the Open-Q 624A Development Kit as an official Android Things 1.0 development board along with Intrinsyc’s Snapdragon 212 based Open-Q 212A, Innocomm’s i.MX8M based WB10-AT, and a MediaTek MT8516 development platform. Now, Intrinsyc is pitching the Open-Q 624A Development Kit, as well as the Open-Q 624A SOM module it’s based on, as an Android 8.0 platform aimed at the home hub market. There is no longer any mention of Android Things.
The Open-Q 624A SOM offers 2GB RAM, 4GB eMMC, WiFi-ac, BT 4.2, and an octa-core -A53 Qualcomm Snapdragon 624 SoC based on the Snapdragon 625. The kit is equipped with a USB 3.0 Type-C port, 2x USB host ports, micro-USB client and debug ports, MIPI-CSI and MIPI-DSI interfaces, sensor expansion and haptic output, and an optional GPS receiver. You also get extensive audio features, including I2S/SLIMBUS headers.
The Open-Q 605 SBC is available for pre-order in the full Development Kit version, which costs $429 and ships in early December. The SBC will also be sold on its own at an undisclosed price. More information may be found in Intrinsyc’s Open-Q 605 announcement, as well as the product page and shopping page.
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