WinSystems has announced its Nano-ITX form factor ITX-N-3900 board-level system. It provides a complete system that can be readily expanded and configured for diverse applications requiring an extended product life and high reliability under extreme operating temperatures. The 4.27-inch (120 mm) square footprint features an onboard Trusted Platform Module (TPM) 2.0-compliant chipset and four USB 3.1 host ports, along with a robust I/O set.
The ITX-N-3900 is SBC based on the Intel Atom E3900 Apollo Lake processor family. It uses less than 12 W for fanless applications and performs reliably in industrial operating temperatures ranging from -40º to +85ºC. It includes a SODIMM socket supporting up to 8 GB of DDR3L system memory, one high-speed SATA storage interface, microSD storage and one mSATA storage interface. It includes dual Ethernet, DisplayPort, an RS-232/485/422 serial channel, and expansion options via Mini-PCle and M.2 connectors. The ITX-N-3900 is designed for long-term availability and supports Linux, Windows 10 desktop, Windows 10 IoT, and other x86-compatible real-time operating systems (RTOS).
The Nano-ITX form factor product series upports not only extended product longevity, but the extended range of operating temperatures common in rugged environments. Enabling such flexible computing solutions is particularly appropriate for industrial IoT, energy management, medical, digital signage and other industrial embedded system applications.
WinSystems | www.winsystems.com
Circuit Cellar's editorial team comprises professional engineers, technical editors, and digital media specialists. You can reach the Editorial Department at editorial@circuitcellar.com, @circuitcellar, and facebook.com/circuitcellar
