WinSystems has announced its Nano-ITX form factor ITX-N-3900 board-level system. It provides a complete system that can be readily expanded and configured for diverse applications requiring an extended product life and high reliability under extreme operating temperatures. The 4.27-inch (120 mm) square footprint features an onboard Trusted Platform Module (TPM) 2.0-compliant chipset and four USB 3.1 host ports, along with a robust I/O set.
The Nano-ITX form factor product series upports not only extended product longevity, but the extended range of operating temperatures common in rugged environments. Enabling such flexible computing solutions is particularly appropriate for industrial IoT, energy management, medical, digital signage and other industrial embedded system applications.
WinSystems | www.winsystems.com
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