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Qualcomm SDA845 SoC-Based Module Targets Drone Designs

Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x 25 mm), production-ready embedded module, well suited for powering the most advanced robotics, drones, cameras and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm SDA845 system on chip (SoC) from Qualcomm Technologies, the 845 µSOM integrates many new features and capabilities in the same small form-factor:

  • Higher performing Octa-core CPU – up to 2.6 GHz on Gold cores
  • New hardware-based security layers for vault-like defense
  • Third generation Qualcomm AI platform for immersive, on-device intelligence
  • Four camera ports with flexible configurations supports up to 7 cameras
  • New camera architecture for cinema grade video capture
  • DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency
  • Additional USB3.1 port for device connectivity while using DisplayPort
  • Gen3 PCIe interface.

This new hardware platform will be supported by your choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is a starting point for evaluation of the SOM and to kick-start your product development. If you prefer a Linux OS, that will be available to download from Intrinsyc and program onto your development kit. Full software documentation will also be included with purchase of the development kit.

Open-Q 845 µSOM Key Specifications:

  • Qualcomm SDA845 SoC built on 2nd-Gen 10nm technology:
    • Qualcomm Kryo 385 Octa-core CPU
    • Qualcomm Adreno 630 Visual Processing Subsystem
    • Qualcomm Spectra 280 Image Signal Processor
    • Qualcomm Hexagon 685 DSP
    • Qualcomm Secure Processing Unit
    • Third Generation Qualcomm Artificial Intelligence Engine for on-device intelligence
  • System Memory: 4GB or 6GB LPDDR4x RAM (POP) + 32GB or 64GB UFS flash storage
  • Wireless Connectivity: Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO + Bluetooth 5.x
    • Display Interfaces:
    • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
  • 2x MIPI 4-lane DSI up to 4K 10-bit 60fps
  • Camera Interfaces:
    • 4 Cameras: 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI camera ports
    • Dual 16MP ISP + ISP-lite 2MP
  • Video Performance:
    • Encode: 4K60 H.264/H.265, 4K30 for VP8
    • Decode: 4K60 H.264/H.265/VP9
  • Audio Interfaces:
    • Dedicated Audio DSP supporting Qualcomm WCD9340 audio codec (off-SOM)
    • SLIMBus or multi-channel I2S digital audio interfaces
  • I/O Interfaces:
    • 2x USB3.1, one with Type-C/DisplayPort support
    • 1x USB2.0 micro-B debug UART
    • 1x SDIO 4-bit interface
    • 1x PCIe Gen3 1-lane interface
  • Power: Integrated power and battery management on SOM
  • Size: 25mm x 50mm
  • Operating System: Android 9, Linux

Intrinsyc offers the Open-Q 845 µSOM Development Kit, a full-featured platform including software tools, documentation, and optional accessories – everything required to immediately begin evaluation and product development. The development kit marries the production-ready Open‐Q 845 µSOM with a carrier board providing numerous expansion and connectivity options to support development and testing of peripherals and applications.

Intrinsyc Technologies | www.intrinsyc.com

 

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