Dialog Semiconductor recently announced that it is collaborating with Bosch Sensortec to develop a low-power smart sensor platform for Internet of Things (IoT) devices. The 12-DOF smart sensor reference platform is intended for gesture recognition in wearable computing devices and immersive gaming, including augmented reality and 3-D indoor mapping and navigation.
The platform comprises Dialog’s DA14580 Bluetooth Smart SoC with three low-power Bosch Sensortecsensors: the BMM150 (for three-axis geo-magnetic field measurement), the BME280 (pressure, humidity, and temperature sensor), and the siz-axis BMI160 (a combination of a three-axis accelerometer and three-axis gyroscope in one chip). The resulting 14 × 14 mm2 unit draws less than 500 µA from a 3-V coin cell when updating and transferring all 12 × 16 bits of data wirelessly to a smartphone.
The 2.5 × 2.5 × 0.5 mm DA14580 SmartBond SoC integrates a Bluetooth Smart radio with an ARM Cortex-M0 application processor and intelligent power management. It more than doubles the battery life of an application-enabled smartphone accessory, wearable device, or computer peripheral in comparison with other solutions. The DA14580 includes a variety of analog and digital interfaces and features less than 15 mW power consumption in active mode and 600-nA standby current.
Bosch Sensortec’s BMI160 six-axis Inertial Measurement Unit (IMU) integrates a 16 bit, three-axis, low-g accelerometer and an ultra-low power three-axis gyroscope within a single package. When the accelerometer and gyroscope are in full operation mode, the typical current consumption is 950 µA.
The BMM150 integrates a compact three-axis geo-magnetic field sensor using Bosch Sensortec’s high performance FlipCore technology. The BME280 Integrated Environmental Unit combines sensors for barometric pressure, humidity, and temperature measurement. Its altitude measurement function is a key requirement in applications such as indoor navigation with floor tracking.
Source: Dialog Semiconductor