WIN Enterprises recently launched the MB-73430 COM Express module, which features Type 6 pin-outs and supports Intel’s 6th Generation Core i7/i5/i3 SoC processors. Intended for systems designed for future upgrades, the COM Express modules are well suited for medical, industrial automation, and gaming applications. The MB-73434 offers up to 32-GB dual-channel DDR4 memory. In addition, it enables a variety of voltage inputs for mobile, embedded, counter top, and desktop environments.
The MB-73434 delivers enhanced HD graphics. Featuring three DDI channels and a LVDS, it supports up to three independent displays and Intel Gen9 HD Graphics with HEVC (H.265). It can be used for high-density streaming applications and optimized 4K video conferencing with HEVC (8-bit), VP8, VP9, and VDENC encoding, decoding, and transcoding.
Source: WIN Enterprises
Circuit Cellar's editorial team comprises professional engineers, technical editors, and digital media specialists. You can reach the Editorial Department at firstname.lastname@example.org, @circuitcellar, and facebook.com/circuitcellar