Telit has announced that it is a key partner for Deutsche Telekom’s nuSIM initiative. This is the latest milestone in Telit’s longstanding partnership with Deutsche Telekom to grow the IoT market by providing breakthrough technologies and services, says Telit. The nuSIM initiative takes a fundamentally new approach to IoT system design by moving the subscriber identity module’s (SIM) functionality to the cellular chipset. The IoT device has the mobile operators’ credentials securely programmed during manufacturing, eliminating the need for the traditional physical SIM card.
As a result, the nuSIM architecture streamlines design and manufacturing processes by eliminating the need for contacts, circuit paths, card holders and other components associated with physical SIMs. It also enables ultra-compact device form factors that would not be possible with a physical SIM card, such as healthcare wearables and industrial sensors. nuSIM also maximizes battery life by leveraging advanced power saving methods that are achievable only when the modem and SIM share the same underlying hardware. Each module ships with a fully operational integrated SIM. The solution eliminates overhead costs related to SIM logistics, such as stock keeping and handling.
Telit is a longtime Deutsche Telekom partner and was the first module supplier to become an active contributor in the nuSIM initiative. Telit’s role includes contributing to the nuSIM design process and serving as a test bed for the technology.
Telit | www.telit.com
Sponsor this Article
Circuit Cellar's editorial team comprises professional engineers, technical editors, and digital media specialists. You can reach the Editorial Department at editorial@circuitcellar.com, @circuitcellar, and facebook.com/circuitcellar
