Congatec has introduced its first Server-on-Module (SoM) with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor offers up to 52% more instructions per clock compared to legacy architectures, according to the company. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, firewall security and VPN technologies—optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI)
Also attractive for edge server deployments is the support of the extended temperature range (-40 to 85 °C) for selected versions and the comprehensive RAS (reliability, availability and serviceability) features common to all versions. Edge applications benefit from the hardware-integrated virtualization and comprehensive security package that includes Secure Boot System, Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV), as well as a secure migration channel between two SEV-capable platforms. Support is also given for IPsec with integrated crypto acceleration. As a consequence, even the server administrator does not have access to such an encrypted Virtual Machine (VM). This is important for the high security required by many edge server services, which must enable multi-vendor applications in Industry 4.0 automation while effectively warding off sabotage attempts by hackers.
The conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs. Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.
Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. Congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP, and can be adapted to customers’ housings, if required. This allows OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system’s cooling capacity. OS support is provided for Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.
Congatec | www.congatec.com