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BLE MCUs Offer Multiprotocol RF and NFC Options

NXP Semiconductors has announced the availability of its
QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible
options for 802.15.4, Multiprotocol RF, and optional NFC technology. The latest
additions to its QN series of Bluetooth Low Energy (BLE) devices enable next
generation intelligent connected devices by achieving ultra-low power
consumption and integrating a high-capacity CPU with a wide operating
temperature range, a comprehensive mix of analog and digital peripherals and
BLE mesh support.

The QN9090 and QN9030 devices are powered by an Arm
Cortex-M4 running at 48MHz and include up to 640KB onboard flash and 152KB
SRAM, providing storage space and flexibility for complex applications and safe
over-the-air (OTA) updates. NXP says the QN Series is designed for diverse IoT
applications such as personal healthcare devices, sports and fitness trackers,
connected appliances, building and home automation, toys and gaming
peripherals, as well as beacons and mesh networks.

As NXP’s BLE SoC with NFC integrated on chip, the QN9090T
and QN9030T variants support out-of-band wireless communications to enable
numerous use cases. By tapping an IoT device based on the QN9090T to a
smartphone, tablet or other NFC reader device, a BLE connection can be quickly
established, greatly simplifying the pairing process. The built in NFC NTAG
eliminates the need for the tag to be powered and creates additional
opportunities for diagnostics or device commissioning in stages of the device
life cycle.

Features:

  • Low-power: 
    Ultra-low power solution is ideal for Bluetooth, battery operated
    applications, featuring 4.3mA Rx current and 7.3mA Tx current @+0dBm.
  • CPU with large and scalable embedded flash
    memory and SRAM: 48 MHz Arm Cortext-M4, 640KB of embedded flash, and 152KB of
    SRAM.
  • Advanced integration with robust peripherals
    including NFC NTAG: Reduces system board footprint and cost of manufacturing
    with digital and analog integration.
  • Microcontroller intelligence: Rich set of MCU
    capabilities, including various low power modes, digital MIC interface with
    wake up on audio event and Quad SPI NOR flash memory controller for high
    density data or code storage.
  • Standardized connectivity: 2.4GHz Bluetooth Low
    Energy 5.0 transceiver supporting 2Mbps and up to 8 concurrent Bluetooth
    connections with antenna diversity support.
  • Integrated power amplifiers with exceptionally
    high transmit power (up to +11 dBm) to make long-distance transmission
    possible.
  • Wide temperature range: -40℃
    to +125℃,
    applicable in various environments.
  • Broad portfolio: NXP offers pin-to-pin
    compatible solutions for 802.15.4 and Multiprotocol RF devices along with
    leading solutions across the spectrum of embedded processing.

NXP MCUXpresso SDK for QN is compatible with the latest
toolchains from IAR and NXP’s MCUXpresso IDE. The full MCUXpresso Suite of
software and tools provides a seamless software experience across NXP devices
as well as a fast path to add Bluetooth LE capability to an existing design on
other NXP devices. The NXP IoT Toolbox smart device application is available,
along with the NXP Connectivity Tool and Test Tool are to help the developers’
evaluate RF performance and test more efficiently.

The QN9090 and QN9030 devices are available now from NXP
and its distribution partners.

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NXP Semiconductors | www.nxp.com

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BLE MCUs Offer Multiprotocol RF and NFC Options

by Circuit Cellar Staff time to read: 2 min