Texas Instruments (TI) has introduced a new ultra-high-speed ADC with what it claims is the industry’s widest bandwidth, fastest sampling rate and lowest power consumption. The ADC12DJ5200RF helps engineers achieve high measurement accuracy for 5G testing applications and oscilloscopes, and direct X-band sampling for radar applications, says TI. The company is demonstrating the ADC12DJ5200RF in booth No. 1272 at the International Microwave Symposium (IMS) in Boston this week (June 4-6).
The ADC12DJ5200RF’s 8 GHz bandwidth enables engineers to achieve as much as 20 percent higher analog input bandwidth than competing devices, which gives engineers the ability to directly digitize very high frequencies without the power consumption, cost and size of additional down-conversion. In dual-channel mode, the ADC12DJ5200RF samples at 5.2 GSPS and captures instantaneous bandwidth (IBW) as high as 2.6 GHz at 12-bit resolution. In single-channel mode, the new ultra-high-speed ADC samples at 10.4 GSPS and captures IBW up to 5.2 GHz.
As the first standalone GSPS ADC to support the JESD204C standard interface, according to TI, the ADC12DJ5200RF helps minimize the number of serializer/deserializer lanes needed to output data to field-programmable gate arrays (FPGAs), enabling designers to achieve higher data rates.
TI says the ADC12DJ5200RF has the highest available dynamic performance across power-supply variations, even at minimum specifications, which improves signal intelligence by providing ultra-high receiver sensitivity to detect even the smallest and weakest signals. In addition, the device includes internal dither which improves spurious-free performance.
High measurement accuracy means the device greatly minimizes system errors with offset error as low as ±300 µV and zero temperature drift. Engineers designing test and measurement equipment can achieve high measurement repeatability by taking advantage of the extremely low code error rate (CER) of the ADC12DJ5200RF, which is more than 100 times better than competing devices.
At 10 mm by 10 mm – 30 percent smaller than discrete solutions – the ADC12DJ5200RF helps engineers save board space. This ADC also requires a reduced number of lanes, which further allows for a smaller printed circuit board design. Engineers can minimize heat dissipation and simplify overall thermal management in their designs with the ADC12DJ5200RF 4-W power consumption, 20 percent lower than competitive ADCs.
The ADC12DJ5200RF is pin-compatible with the following other TI GSPS ADCs to provide an easy upgrade path from 2.7 GSPS to 10.4 GSPS, and minimizes the time and cost of redesign: ADC12DJ3200, ADC12DJ2700 and ADC08DJ3200. The ADC12DJ5200RF dual- and single-channel ultra-high-speed ADC is available for sampling through the TI store. The device is in a 144-ball, 10-by-10-mm flip-chip ball grid array (FCBGA) package.
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