Infineon Technologies AG and pmdtechnologies gmbh recently announced the development of REAL3 3-D image sensor chips for virtual and augmented reality applications, spatial measurement, photo effects, and more. The new sensors have improved optical sensitivity and power comsumption in comparison to the previous version.
Features and specs:
- Specifically designed for mobile devices, where most applications only need a resolution of 38,000 pixels.
- Small sensor chip area
- Each sensor chip features microlenses
- The chips operate with infrared light and use the time-of-flight (ToF) measuring principle
The IRS1125C will be available in volume as of first quarter of 2016. The IRS1645C and IRS1615C are slated for the second quarter of 2016.
Source: Infineon Technologies
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