Semtech LoRa Technology Tapped for Smart Agriculture

Semtech announced that WaterBit, a venture backed precision agriculture irrigation company and National Science Foundation (NSF) grant winner, has incorporated Semtech’s LoRa devices and wireless radio frequency technology (LoRa Technology) into its Autonomous Irrigation Solution (AIS).

WaterBit provides irrigation automation for growers based on analysis of granular, ground-truth data collected through the WaterBit system, including line pressure and flow, soil moisture and temperature and more. With WaterBit’s AIS, growers maximize yield across soil types, while optimizing the use of labor and other input resources. The complete solution is used across a wide variety of crops including grapes, berries, tree nuts, cotton, corn and leafy greens.

WaterBit’s goal when developing its solution was to create the highest quality and most reliable networking product in agriculture. To achieve this, WaterBit eliminated batteries in its production units and enabled duplex communications as well as better control with LoRa Technology.

Key Features of LoRa Technology:

  • Long Range: A single base station using LoRa Technology enables deep penetration capability for dense urban environments and indoor coverage, while also providing the ability to connect to sensors more than 15-30 miles away in rural areas.
  • Low Power: Enables unprecedented battery lifetime of up to 10 years depending on the application.
  • Geolocation: Enables tracking applications without GPS or additional power consumption.
  • Low Cost: LoRa Technology reduces up front infrastructure investments and operating costs, as well as end-node sensor costs.
  • Open Standard: The LoRaWAN open protocol ensures interoperability among applications, IoT solution providers and telecom operators to speed adoption and deployment.

Semtech | www.semtech.com

MCU Enables 3D Graphics in Car Displays

Cypress Semiconductor has announced a new series in its Traveo automotive microcontroller family with more memory to support a hybrid instrument cluster with 3D graphics and up to 6 traditional gauges, as well as a head-up display. The highly integrated, single-chip devices in the S6J32xEK series include an advanced 3D and 2.5D graphics engine and provide scalability with Cypress’ low-pin-count HyperBus memory interface. The series continues Cypress’ expansion of its broad automotive portfolio with differentiated system performance via its MCUs, wireless radios, capacitive-touch solutions, memories and Power Management ICs (PMICs).
Cypress Traveo Automotive MCUs 2017

The Traveo S6J32xEK series integrates up to 4MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, an ARM Cortex-R5 core at 240 MHz performance, a Low-Voltage Differential Signaling (LVDS) video output, a Low-Voltage Transistor-Transistor Logic (LVTTL) video output and a 6x stepper motor control. This combination enables the devices to serve as single-chip solutions to drive two displays. The devices have up to two 12-pin HyperBus memory interfaces that dramatically improve read and write performance of graphical data and other data or code.

A single HyperBus interface can be used to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end-users to get software fixes and new features and applications for their vehicles on-the-go. The devices support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB. Additionally, the series provides robust security with integrated enhanced secure hardware extension (eSHE) support.

The Traveo S6J32xEK series include 50 channels of 12-bit Analog to Digital Converters (ADC), 12 channels of multi-function serial interfaces and I2S interfaces with an audio to output the complex, high-quality sounds required in today’s instrument clusters. The devices’ support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time. The S6J32xEK series offers functional safety features to support Automotive Safety Integrity Level (ASIL) B, and the devices feature a wide ambient temperature range of -40˚C to +105˚C. The Traveo family is backed by a comprehensive tools and software ecosystem that simplifies system integration, including AUTOSAR MCAL 4.0.3 support.

The Traveo S6J32xEK series is sampling now and will be in production in the first quarter of 2018. The MCUs are available in a 208-pin and 216-pin thermally enhanced quad flat package (TEQFP).

Cypress Semiconductor | www.cypress.com