Toshiba Electronics Europe recently announced a new photocoupler that can support signal transfer speeds of up to 100 kbps. Intended for communication applications in industrial systems and home appliance devices, the TLP2703 can be driven by a low input current of 1 mA. It features a high current transfer ratio (IC/IF) of 900% (min) at an input current of 0.5 mA. With propagation delay at 25 µs (max) at an input current of IF = 1.6 mA and 7 µs (max) at IF = 12 mA, the IC is well suited for insulated communication interfaces (e.g., RS-232C).
Housed in an SO6L package (maximum height of 2.3 mm) and featuring a creepage distance of 8 mm and an isolation voltage of 5 kVRMS, you can use the TLP2703 in applications requiring high insulation performance. Futhermore, its temperature range is up to +125°C.
Toshiba Electronics Europe recently announced a general-purpose system power IC with multiple outputs and functional safety circuits for automotive applications. The TB9044FNG comes in an HTSSOP48-P-300-0.50 package measuring 6.1 mm × 12.5 mm × 1 mm. It integrates various failure-detection functions (e.g., a high-voltage and low-voltage detection and overheat detection) and a watchdog timer to monitor the failure detection of the external microcontroller. Also included is an initial diagnosis circuit to detect latent faults in the failure detection circuits to secure higher functional safety.
The IC generates a 6-V output from a high-efficiency buck-boost DC-DC converter. In order to avoid problems following a voltage drop during cranking, the low-side operating voltage range is improved down to 2.7 V (minimum) with battery operation. In addition, the IC incorporates four series power supply output circuits receiving the 6-V input generated by the DC-DC converter. It also incorporates an output circuit with a 5-V constant voltage (current capacity of 400 mA) for the microcomputer, and three circuits with 5-V constant voltage output (current capacity of 100 mA) for sensors and other interfaces. Each can output a voltage independently.
Samples are now available. Mass production scheduled to begin in October 2017.
Source: Toshiba Corp.
At CES 2015, Toshiba America Electronic Components introduced its newest IC enabling wireless mobile device charging. The TC7765WBG wireless power receiver controller IC can manage the 12-W power transfer required for the wireless charging of tablet devices. The TC7765WBG is compatible with the Qi low-power specification version 1.1 defined by the Wireless Power Consortium (WPC). It delivers a user experience comparable to that of conventional wired charging for tablets, as well as smartphones and other portable devices.
The TC7765WBG was built with Toshiba’s mixed-signal process using a high-performance MOSFET design that maximizes power efficiency and thermal performance. The IC combines modulation and control circuitry with a rectifier power pickup, I2C interface, and circuit protection functions. Compliance with the “Foreign Object Detection” (FOD) aspect of the Qi specification prevents heating of any metal objects in the path of wireless power transfer between the receiver and the transmitter.
The 12-W TC7765WBG is designed in a compact WCSP-28 2.4 mm × 3.67 mm × 0.5 mm package. This further facilitates design-in and contributes to the new chipset’s backward compatibility with the lower-power receiver IC. Combining the TC7765WBG with a copper coil, charging IC, and peripheral components creates a wireless power receiver. Joining the receiver with a Qi-compliant wireless power transmitter containing a Toshiba wireless power transmitter IC (e.g., TB6865AFG Enhanced version) forms a complete wireless power charging solution.
Toshiba announced that samples of the TC7765WBG wireless power receiver IC will be available at the end of January, with mass production set to begin in Q2 2015.