Tiny PLC Reference Design Serves Digital Factory Needs

Digital factories require a surprising amount of analog and power technology. Exemplifying that trend, Maxim Integrated Products offers its new programmable logic controller (PLC) reference design called Go-IO. Go-IO embeds 17 configurable I/Os in a space one-half the size of a credit card and enables productivity-enhancing self-diagnostic capabilities in automated factory subsystems. System designers are striving to bring greater intelligence into Industry 4.0 digital factory equipment while meeting the stringent size and power demands of PLCs.
Digital factories can dynamically adjust the manufacturing line on the fly based on new or changing requirements. To fully realize industrial convergence, automated equipment must also possess self-diagnostic and optimization capabilities. Go-IO pushes intelligence closer to the edge, enabling active monitoring and communication of equipment health and status information as well as higher throughput and productivity. The reference design also meets increasingly stringent size and power requirements of PLCs, providing a 10x smaller solution with 50% less power consumption compared to its predecessor, the Pocket IO.

The flexible, rugged, open-source Go-IO reference design is ideal for industrial automation, building automation and industrial robotics applications. It has 12 highly integrated ICs, 17 IOs supporting multiple digital IO configurations, a 4-channel IO-Link master to provide a universal IO interface to both analog and digital sensors, and a robust 25 Mbps isolated RS-485 communications channel that provides a reliable, multi-drop data network for uploading time-sensitive health and status information into a local data lake or the cloud.

Go-IO contains the following technologies:

  • MAX14819 low-power, dual-channel, IO-Link master transceiver with sensor/actuator power-supply controllers.
  • MAX22192 8-channel octal digital input with isolated Serial Peripheral Interface (SPI), wire break detection and accurate input current limiters in a 6 mm x 10 mm package. The MAX22192 was announced today as part of Maxim’s expanded Digital IO portfolio. (Read today’s digital input press release)
  • MAX14912 8-channel digital output driver featuring 640mA high-side switches or push-pull configurable outputs, capable of achieving 200 kHz switching rates while providing proprietary fast, safe demagnetization inductive kickback protection.
  • MAXM22511 integrated 2.5 kVRMS isolated power and digital isolated RS-485 transceiver module supporting 25 Mbps data rates with ±35 kV ESD protection in a compact 9.5 mm x 11.5 mm package. (Read the October 31, 2018 press release)
  • MAX14483/MAX14130 6-channel, 3.75 kVRMS galvanic low-power digital isolator in a compact 20-pin SSOP package/4-channel 1 kVRMS galvanic digital isolator in a small 16-pin QSOP.
  • MAXM15462 Himalaya uSLIC voltage regulator ICs and power modules for cooler, smaller and simpler industrial power supplies.

The Go-IO is available as MAXREFDES212# at Maxim’s website for $495. The reference design consists of an application processor, baseboard and the Go-IO module.

Maxim Integrated | www.maximintegrated.com

Touch-Sensor Development Kit for ESP32

The ESP32-Sense Kit is a new touch-sensor development kit produced by Espressif Systems. It can be used for evaluating and developing the touch-sensing functionality of ESP32. The ESP32-Sense Kit consists of one motherboard and several daughterboards. The motherboard is made up of a display unit, a main control unit and a debug unit. The daughterboards can be used in different application scenarios, since the ESP32-Sense Kit supports a linear slider, a duplex slider, a wheel slider, matrix buttons, and spring buttons. Users can even design and add their own daughterboards for special use cases. The photo provides an overview of the ESP32-Sense Kit. The wheel slider, linear slider, duplex slider, motherboard, spring buttons, and matrix buttons, are shown in a clockwise direction.

The ESP32 SoC offers up to 10 capacitive I/Os that detect changes in capacitance on touch sensors due to finger contact or proximity. The chip’s internal capacitance detection circuit features low noise and high sensitivity. It allows users to use touch pads with smaller area to implement the touch detection function. Users can also use the touch panel array to detect a larger area or more test points.

The follow related resources are available to support ESP Sense Kit:

  • ESP32 t=Touch-Sensor Design: The reference design manual of the ESP32 touch-sensing system.
  • ESP32-Sense Project: Contains programs for the ESP32-Sense Kit, which can be downloaded to the development board to enable the touch-sensing function.
  • ESP-IDF: The SDK for ESP32. Provides information on how to set up the ESP32 software environment.
  • ESP-Prog: The ESP32 debugger.

Espressif Systems | www.espressif.com

 

Xilinx Provides Design Platform for Scalable Storage

At the Flash Memory Summit earlier this month in Santa Clara, CA, leading FPGA vendor Xilinx rolled out the Xilinx NVMe-over-Fabrics reference design. It provides designers a flexible platform to enable scalable storage solutions and integrate custom acceleration functions into their storage arrays. The reference design eliminates the need for a dedicated x86 processor or an external NIC, thus creating a highly integrated, reliable and cost-effective solution. The NVMe-over-Fabrics (NVM-oF) reference platform is implemented on the Fidus Sidewinder card which supports up to 4 NVMe SSDs, and has a Xilinx ZU19EG Ultrascale+ MPSoC device. The reference platform is delivered with the required software drivers.

The Xilinx NVMe-over-Fabric Platform is a single-chip storage solution that integrates NVMe-over-Fabric and target RDMA offloads with a processing subsystem to provide a very power-efficient and low-latency solution compared to existing products that require both an external host chip and a Network Interface Card (NIC). This 2x100Gb Ethernet platform enables customers to implement value-added storage workload acceleration, such as compression and erasure code.

Xilinx | www.xilinx.com

Complete USB Type-C Reference Design

Silicon Labs recently announced a complete USB reference design for developing cables and cable adapters based on the USB Type-C specification. The USB Type-C reference design features EFM8 microcontrollers, USB Power Delivery (PD) protocol stacks certified by the USB-IF, and USB Billboard Device source code.Silicon Labs USB CDue to the rapid adoption of USB Type-C (USB-C), demand is increasing for dongles and adapters to connect with legacy and existing products. The Silicon Labs reference design provides a complete solution for a USB Type-C to DisplayPort (DP) adapter, making it easy to communicate with legacy products.

 

Qualified developers can access the reference design for free. In addition to schematics, it includes software libraries and stacks, source code, code examples, and access to Simplicity Studio development tools.

Silicon Labs USB Type-C solution highlights:

  • Comprehensive hardware/software reference design based on ultra-low-power EFM8 8-bit microcontrollers
  • Complete software solution, including a USB PD stack library, billboard device source code, and sample code for USB-C to DP applications available in Simplicity Studio library format
  • USB-IF certified USB Power Delivery silicon
  • Complete reference design solution for USB Type-C to DisplayPort adapters
  • Support for USB-C video adapter dongle and USB PD controller functions including attach/detach detection, power contract negotiation, and Alternate mode detection/selection
  • Billboard device support communicating Alternate Mode failure to host

The Silicon Labs USB Type-C reference design deliverables (schematics, PD stack library, billboard device source code and sample code) are available to qualified developers for free.

Source: Silicon Labs

5-V Qi Low-Power Wireless Charging Transmitter Reference Design

NXP Semiconductors has announced the availability of a new reference design for 5-V low-power Qi wireless charging transmitters, compliant with the Wireless Power Consortium (WPC) 1.1 Qi specification. The design is based on NXPs single-chip 5-V wireless power transmitter IC—the NXQ1TXA5 that was launched in 2014. It is the latest addition to NXP’s portfolio of Greenchip power solutions.NXP NXQ1TXA5

Building on NXP’s success as the market leader in Greenchip power ICs, the NXQ1TXA5 reference design has an unrivalled standby power consumption of less than 10 mW. It is the only solution on the market today that meets five-star mobile phone charger standby power ratings by consuming less than 30 mW in standby mode, which includes the standby power of the wall-charger. NXP recommends combining its NXQ1TXA5 ultra low standby power wireless power transmitter solution with another Greenchip device, its high efficiency TEA1720 SMPS IC with a standby power of less than 20 mW.

The NXQ1TXA5 device combines:

  • NXPs patented high efficiency Class D amplifier technology for outstanding EMI performance.
  • NXP’s ultra low power CoolFluxTM DSP technology for superior communication with smartphones placed on the charger.
  • Dedicated low power mixed signal circuitry to check for smartphone presence three times per second, enabling fast startup of charging, while keeping the standby power very low if there is no smartphone on the charger.

Due to the NXQ1TXA5’s  low-power consumption, the reference design also has a high efficiency for low transmitted powers, making it suitable for applications ranging from smartphone charging to deliver 5 W to the smartphone battery when used with a Qi compliant wireless charging receiver, to chargers for wearables that need less than 2-W charging power.

The NXQ1TXA5 reference design needs only 15 to 20 low-cost passive components and uses a standard two-layer PCB, with the components mounted on a single side. Depending on customer requirements, the complete application can be designed on a board space as small as 3 × 3 or 4 × 4 cm.

The new NXQ1TXA5 wireless charging transmitter reference design will be available in Q2.

Source: NXP Semiconductors