Congatec Rolls Out Ten Modules Based on Coffee Lake H Processors

Congatec has announced 10 new COM Express Type 6 modules featuring the latest Intel embedded processor technology. The four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors are all based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables Congatec to provide all 10 new processors on one COM Express module design: the conga-TS370. A total of 14 processor module variants are now available on this single microarchitecture, offering extremely wide scalability.

The spearhead in terms of computing power is the 45 W 6-core module with 2.8 GHz Intel Xeon E-2276ME processor. It provides the highest embedded computing performance with integrated high-performance processor graphics currently available worldwide, while the 2.4 GHz Intel Celeron G4930E processor module with 35 watts sets the new price-performance benchmark.

Particularly noteworthy are the two 6-core Congatec modules with a TDP of 25 W offered on Intel Xeon E-2276ML and Intel Core i7-9850HL processors. They enable developers to create completely passively cooled embedded edge computing systems that can run up to 12 standalone virtual machines in parallel thanks to hyperthreading. This allows operation even in fully sealed systems, under the harshest environmental conditions and with the highest IP protection. The same applies to the two quad-core modules with Intel Xeon E-2254ML or Intel Core i3-9100HL processor as well as the Intel Celeron G4932E processor-based module, all featuring a–partly configurable –TDP of 25 W.

Other applications besides embedded edge computing including classic high-end medical imaging systems and HMIs as well as high-end gaming, infotainment and digital signage systems that require best-in-class computing power and throughput on a single die in tandem with the Intel graphics technology.

Congatec | www.congatec.com

3.5-Inch SBC Serves up Coffee Lake-H Processors

COMMELL has unveiled its LE-37M 3.5-inch SBC based on Intel 8th generation Coffee Lake-H Core processor family. The Coffee Lake-H 8th generation Intel Core i7/i5/i3 processors provides higher computing and graphics performance but at a similar power dissipation level to the previous 7th generation. The LE-37M SBC will be offered with two processor variants: LE-37M5 comprised of Core i5-8400H Max Turbo up to 4.2 GHz with 4 CPU cores, 8-thread and 45 W TDP, LE-37M7 comprise of Core i7-8850H Max Turbo up to 4.3 GHz with 6 CPU cores, 12-thread and 45 W TDP.

The LE-37M 3.5-inch SBC is designed for the 8th generation Intel Core H-series processors in the FCBGA1440 and accompany with Intel QM370 Chipset. DDR4 memory is supported up to a total of 32 GB (DDR4 SO-DIMM 2,666 MHz). The SBC is based on powerful Intel UHD Graphics that provides high-end media and graphics capabilities, allows triple independent display with 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. The LE-37M features VGA, LVDS, HDMI and one DisplayPort outputs to provide its advanced solutions for imaging, machine vision and infotainment applications, medical and gaming machine applications.

The SBC provides lots of features including high-speed data transfer interfaces such as 4 x USB3.1 Gen2 and 2 x SATAIII, equipped with dual Gbit Ethernet Intel I210 and I219-LM (iAMT 11.0 support), and comes with PS/2 port, 2 x RS232 and 2 x RS232/422/485, 4 x USB 2.0, Realtek High Definition Audio, 1 x SMBus, 1 x 8 bit GPIO, 1 x MiniPCIe (support mSATA), 1 x M.2 (Key E). The operating voltage of LE-37M is from 9 V to 35 V DC power supply.

COMMELL | www.commell.com.tw

DENSO Taps Cypress’ Fail-Safe Flash for Car Cockpit Design

Cypress Semiconductor has announced that automotive supplier DENSO has selected Cypress’ Semper fail-safe storage for its next-generation digital automotive cockpit applications with advanced graphics. Based on an embedded Arm Cortex-M0 processing core, the Semper family is purpose-built for automotive environments.
The Cypress Semper family offers high density serial NOR Flash memory up to 4 Gbit and leverages the company’s proprietary MirrorBit process technology. The family also features EnduraFlex architecture, which achieves greater reliability and endurance. Semper fail-safe storage devices were the first in the industry to achieve the ISO 26262 automotive functional safety standard and are ASIL-B compliant, says Cypress.

According to Cypress, the Semper fail-safe storage products exceed automotive quality and functional safety requirements with ASIL-B compliance and are ready for use in ASIL-D systems. Cypress’ 512 Mb, 1 Gb and 2 Gb Semper devices are currently sampling.

Cypress Semiconductor | www.cypress.com

 

Automotive USB 3.1 SmartHub Features Type-C Support

Microchip Technology provides an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal connectivity in vehicles, the USB7002 SmartHub IC includes interfaces for USB Type-C connectors.

As automotive manufacturers continue to add more functions to vehicles and integrate with mobile phone applications, the role of USB for reliable data transfers requires robust functionality and faster transfer speeds. Consumers expect instant responses from infotainment systems despite many functions occurring simultaneously in vehicles, from transferring mapping data to playing music and interacting with user interfaces.

The 5 Gbps SuperSpeed data rates of USB 3.1 ensure higher bandwidth and maximum functionality, making it well suited for applications that require gigabit speeds for faster data streaming, data download and in-vehicle communication. The USB7002 also reduces the download time for large videos, which is ideal for vehicles that have integrated 4K dash cams.

Consumer demand for faster mobile device charging has led to the rise of USB Type-C in the smartphone industry. The USB7002 combines the benefits of USB 3.1 technology with the rising popularity of USB Type-C. The USB7002 enables direct USB Type-C connections through native Configuration Channel (CC) pin interfaces and integrated 2:1 multiplexers that support the reversible connection feature of the USB Type-C connector.

To support the driver assistance applications that are now standard on all mobile handsets, the SmartHub ICs also include Microchip’s patented FlexConnect technology, which provides the unique ability to dynamically swap between a USB host and USB device. The SmartHub ICs also feature patented multi-host end-point reflector technology, which enables USB data to be mirrored between two USB hosts. These fundamental features enable the graphical user interface of a phone to be displayed on the vehicle’s screen and integrate with voice commands inside the car, while simultaneously charging the mobile device. This allows consumers to easily and safely use their mobile devices while driving, providing a user-friendly way to make calls, send messages and get directions while focusing on the road.

Development Tools

The USB7002 IC comes with a complete solution including the MPLAB® Connect Configurator hub configuration tool, evaluation boards with schematics and gerbers to reduce development time. Microchip’s USBCheck services allow manufacturers to verify designs and layouts prior to sending out a PCB for manufacturing, significantly accelerating time to market for their end products.

The USB7002-I/KDXVA0 is AEC-Q100 Grade 3 qualified and available now starting at $4.05 in volume production quantities.

Microchip Technology | www.microchip.com

 

Tiny PMICs Offer Efficient High Voltage Automotive Solutions

Maxim Integrated Products has announced power-management ICs (PMICs) that the company claims offers the industry’s smallest solution size and highest efficiency. MAX20004/6/8, MAX20034 and MAX20098 offer low quiescent current, improved noise performance and electromagnetic interference (EMI) mitigation for digital instrument clusters and radio head units.
Maxim’s array of automotive-grade ICs provides many options to manage the DC power as automotive OEMs transition from processors that consume 20 W of power to artificial intelligence platforms that consume as much as 500 W. With a package size of 3.5 mm x 3.75 mm, Maxim’s buck converters offer the industry’s smallest solution size, says the company. Their flip-chip quad-flat no-leads (FCQFN) packaging reduces high-frequency switch node ringing and eliminates bond wires to lower MOSFET switch on-resistance and increase efficiency. Maxim provides pin-compatible parts for four, six and eight amps for flexible power regulation. All of the ICs feature spread-spectrum modulation, high switching frequency, forced pulse-width modulation and skip-mode operation for best-in-class performance.

Maxim’s newest automotive PMICs for high-voltage power applications include:

  • MAX20004, MAX20006 and MAX20008 4 A, 6 A and 8 A high-voltage (40 V tolerant) synchronous buck converters with integrated high-side and low-side MOSFETs, offering the industry’s lowest switch resistance of 38 and 18 mΩ, respectively, for high efficiency. Key advantages of these pin-compatible devices include 25 µA quiescent current, operating input voltages from 3.5 V to 36 V and 93 percent peak efficiency. All are available in a compact 3.5 mm x 3.75 mm, 17-pin side-wettable QFN package that reduces high-frequency switch node and improves efficiency.
  • MAX20098 220 kHz to 2.2 MHz synchronous buck controller for applications with mid- to high-power requirements operating with input voltages from 3.5 V to 36 V (42 V tolerant). For efficiency, this device features a quiescent current of 3.5 µA in skip mode at 3.3 V output along with a 1µA typical shutdown current specification. Its 3 mm x 3 mm side-wettable QFN package reduces solution size, and the IC requires few external components, enabling a two-layer PCB design.
  • MAX20034 220 kHz to 2.2 MHz dual synchronous buck controller for high-voltage applications operating with input voltages from 3.5 V to 36 V (42 V tolerant), where one regulator will operate as a fixed 5 V or 3.3 V output and the other output is adjustable between 1V to 10V. Key efficiency advantages include 17 µA quiescent current in skip mode and 6.5µA typical shutdown current. The device is available in a 5 mm x 5 mm side-wettable QFN package, and it provides up to 2.2 MHz switching frequency to enable smaller external components and total solution size.

Maxim Integrated | www.maximintegrated.com

 

MCUs Serve Up Solutions for Car Infotainment

Dashboard Dazzle

As automotive dashboard displays get more sophisticated, information and entertainment are merging into so-called infotainment systems. The new systems are driving a need for powerful MCU solutions that support the connectivity, computing and interfacing requirements particular to these designs.

(Caption for lead image Figure 1: The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay (shown) and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.).

By Jeff Child, Editor-in-Chief

Microcontroller (MCU) vendors have a rich legacy of providing key technologies for nearly every aspect of an automobile’s electronics—everything from the powertrain to the braking system to dashboard displays. In recent years, they’ve taken on a new set of challenges as demands rise for ever more sophisticated “infotainment” systems. Advanced touchscreen, processing, networking, voice recognition and more are parts of these subsystems tasked with providing drivers with information and entertainment suited to today’s demands—demands that must rival or exceed what’s possible in a modern smartphone or tablet. And, as driverless cars inch toward mainstream reality, that hunger for rich infotainment functionality will only increase.

In order to meet those system design needs, MCU vendors are keeping pace with highly integrated chip-level solutions and embedded software tailored specifically to address various aspects of the automotive infotainment challenge. Over the past 12 months, MCU companies have announced products aimed at everything from advanced dashboard graphics to connectivity solutions to security technologies. At the same time, many have announced milestone design wins that illustrate their engagement with this dynamic sub-segment of automotive system development.

Smartphone Support

Exemplifying these trends, in July Cypress Semiconductor announced that Pioneer integrated Cypress’ Wi-Fi and Bluetooth Combo solution into its flagship in-dash navigation AV receiver. The solution enables passengers to display and use their smartphone’s apps on the receiver’s screen via Apple CarPlay (Figure 1–lead image above) or Android Auto, which provide the ability to use smartphone voice recognition to search for information or respond to text messages. The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.

The Pioneer AVH-W8400NEX receiver uses Cypress’ CYW89359 combo solution, which includes an advanced coexistence engine that enables optimal performance for dual-band 2.4- and 5-GHz 802.11ac Wi-Fi and dual-mode Bluetooth/Bluetooth Low Energy (BLE) simultaneously for advanced multimedia experiences. The CYW89359’s RSDB architecture enables two unique data streams to run at full throughput simultaneously by integrating two complete Wi-Fi subsystems into a single chip. The CYW89359 is fully automotive qualified with AECQ-100 grade-3 validation and is being designed in by numerous top-tier car OEMs and automotive suppliers as a full in-vehicle connectivity solution, supporting infotainment and telematics applications such as smartphone screen-mirroring, content streaming and Bluetooth voice connectivity in car kits.

In October, Cypress announced another infotainment-related design win with Yazaki North America implementing Cypress’ instrument cluster solution to drive the advanced graphics in Yazaki’s instrument cluster for a leading American car manufacturer. According to Cypress, Yazaki selected the solution based on its unique offering of five chips that combine to drive dual displays and provide instant-on memory performance with automotive-grade, ASIL-B safety compliance. The Cypress solution is based on a Traveo MCU, along with two high-bandwidth HyperBus memories in a multi-chip package (MCP), an analog power management IC (PMIC) for safe electrical operation, and a PSoC MCU for system management support. The Traveo devices in the Yazaki instrument cluster were the industry’s first 3D-capable Arm Cortex-R5 cluster MCUs.

Virtualization Embraced

The complexity of automotive infotainment systems has pushed system developers to embrace advanced operating system approaches such as virtualization. Feeding those needs, last June Renesas Electronics rolled out its “R-Car virtualization support package” designed to enable easier development of hypervisors for the Renesas R-Car automotive system-on-chip (SoC). The R-Car virtualization support package includes, at no charge, both the R-Car hypervisor development guide document and sample software for use as reference in such development for software vendors who develop the embedded hypervisors that are required for integrated cockpits and connected car applications.

A hypervisor is a virtualization operating system (OS) that allows multiple guest OSs— such as Linux, Android and various real-time OSs (RTOS)—to run completely independently on a single chip. Renesas announced the R-Car hypervisor in April of 2017 and the new R-Car virtualization Support Package was developed to help software vendors accelerate their development of R-Car hypervisors.

The company’s third-generation R-Car SoCs were designed assuming that they would be used with a hypervisor. The Arm CPU cores, graphics cores, video/audio IP and other functions include virtualization functions. Originally, for software vendors to make use of these functions, they would have had to understand both the R-Car hardware manuals and the R-Car virtualization functions and start by looking into how to implement a hypervisor. Now, by following development guides in the R-Car virtualization support package, not only can software vendors easily take advantage of these functions, they will be able to take full advantage of the advanced features of R-Car. Also, by providing sample software that can be used as a reference, this package supports rapid development.

Technology partnerships have been playing a key role in automotive infotainment trends. Along just those lines, in September Renesas and OpenSynergy, a supplier of automotive hypervisors, announced that the Renesas’ SoC R-Car H3 and OpenSynergy’s COQOS Hypervisor SDK were adopted on Parrot Faurecia’s automotive safe multi-display cockpit. The latest version of Android is the guest OS of the COQOS Hypervisor, which executes both the instrument cluster functionality, including safety-relevant display elements based on Linux, and the Android-based in-vehicle infotainment (IVI) on a single R-Car H3 SoC chip (Figure 2). The COQOS Hypervisor SDK shares the R-Car H3 GPU with Android and Linux allowing applications to be presented on multiple displays, realizing a powerful and flexible cockpit system.

Figure 2
With Android as the guest OS of the COQOS Hypervisor, it executes both the instrument cluster functionality, including safety-relevant display elements based on Linux, and the Android-based in-vehicle infotainment (IVI) on a single R-Car H3 SoC chip.

According to OpenSynergy’s CEO Stefaan Sonck Thiebaut, the COQOS Hypervisor SDK takes full advantage of the hardware and software virtualization extensions provided by Renesas. The OpenSynergy solution includes key features, such as shared display, which allows several virtual machines to use multiple displays flexibly and safely. The R-Car H3 GPU and video/audio IP incorporates virtualization functions, making virtualization by the hypervisor possible and allowing for multiple OSs to operate independently and safely. OpenSynergy’s COQOS Hypervisor SDK is built around a safe and efficient hypervisor that can run software from multipurpose OSs such as Linux or Android, RTOS and AUTOSAR-compliant software simultaneously on one SoC.

Large Touchscreen Support

As the content provided by automotive infotainment systems gets more sophisticated, so too must the displays and user interface technologies that interact with that content. With that in mind, MCU vendors are offering more advanced touchscreen control solutions. Dashboard screens have unique design challenges. Screens in automobiles need to meet stringent head impact and vibration tests. That means thicker cover lenses that potentially impact the touch interface performance. Meanwhile, as screens get larger, they are also more likely to interfere with other frequencies such as AM radio and car access systems. All of these factors become a major challenge in the design of modern automotive capacitive touch systems.

Along just those lines, Microchip in December announced its maXTouch family of single-chip touchscreen controllers designed to address these issues for screens up to 20 inches in size (Figure 3). The MXT2912TD-A, with nearly 3,000 touch sensing nodes, and MXT2113TD-A, supporting more than 2,000 nodes, bring consumers the touchscreen user experience they expect in vehicles. These new devices build upon Microchip’s existing maXTouch touchscreen technology that is widely adopted by manufacturers worldwide. Microchip’s latest solutions offer superior signal-to-noise capability to address the requirements of thick lenses, even supporting multiple finger touches through thick gloves and in the presence of moisture.

Figure 3
The maXTouch family of single-chip touchscreen controllers is designed for screens up to 20 inches in size, and supports up to 3,000 touch sensing nodes. The devices even support multiple finger touches through thick gloves and in the presence of moisture.

As automakers use screens to replace mechanical switches on the dash for sleeker interior designs, safe and reliable operation becomes even more critical. The MXT2912TD and MXT2113TD devices incorporate self- and sensor-diagnostic functions, which constantly monitor the integrity of the touch system. These smart diagnostic features support the Automotive Safety Integrity Level (ASIL) classification index as defined by the ISO 26262 Functional Safety Specification for Passenger Vehicles.

The new devices feature technology that enables adaptive touch utilizing self-capacitance and mutual-capacitance measurements, so all touches are recognized and false touch detections are avoided. They also feature Microchip’s proprietary new signal shaping technology that significantly lowers emissions to help large touchscreens using maXTouch controllers meet CISPR-25 Level 5 requirements for electromagnetic interference (EMI) in automobiles. The new touch controllers also meet automotive temperature grade 3 (-40°C to +85°C) and grade 2 (-40°C to +105°C) operating ranges and are AEC-Q100 qualified.

3D Gesture Control

Aside from the touchscreen display side of automotive infotainment, Microchip for its part has also put its efforts toward innovations in 3D human interface technology. With that in mind, in July the company announced a new 3D gesture recognition controller that offers the lowest system cost in the automotive industry, providing a durable single-chip solution for advanced automotive HMI designs, according to Microchip. The MGC3140 joins the company’s family of easy-to-use 3D gesture controllers as the first qualified for automotive use (Figure 4).

Figure 4
The MGC3140 3D gesture controller is Microchip’s first qualified for automotive use. It’s suited for a range for applications such as navigating infotainment systems, sun shade operation, interior lighting and more.

Suited for a range for applications that limit driver distraction and add convenience to vehicles, Microchip’s new capacitive technology-based air gesture controller is ideal for navigating infotainment systems, sun shade operation, interior lighting and other applications. The technology also supports the opening of foot-activated rear liftgates and any other features a manufacturer wishes to incorporate with a simple gesture action.

The MGC3140 is Automotive Electronics Council AEC-Q100 qualified with an operating temperature range of -40°C to +125°C, and it meets the strict EMI and electromagnetic compatibility (EMC) requirements of automotive system designs. Each 3D gesture system consists of a sensor that can be constructed from any conductive material, as well as the Microchip gesture controller tuned for each individual application.

While existing solutions such as infrared and time-of-flight technologies can be costly and operate poorly in bright or direct sunlight, the MGC3140 offers reliable sensing in full sunlight and harsh environments. Other solutions on the market also come with physical constraints and require significant infrastructure and space to be integrated in a vehicle. The MGC3140 is compatible with ergonomic interior designs and enables HMI designers to innovate with fewer physical constraints, because the sensor can be any conductive material and hidden from view.

Vehicle Networking

While applicable to areas beyond infotainment, an automobile’s ability to network with the outside world has become ever more important. As critical vehicle powertrain, body, chassis, and infotainment features increasingly become defined by software, securely delivering updates such as fixes and option packs over the air (OTA) enhances cost efficiency and customer convenience. Serving those needs, in October STMicroelectronics released its latest Chorus automotive MCU that provides a gateway/domain-controller solution capable of handling major OTA updates securely.

With three high-performance processor cores, more than 1.2 MB RAM and powerful on-chip peripherals, ST’s new flagship SPC58 H Line joins the Chorus Series of automotive MCUs and can run multiple applications concurrently to allow more flexible and cost-effective vehicle-electronics architectures (Figure 5). Two independent Ethernet ports provide high-speed connectivity between multiple Chorus chips throughout the vehicle and enable responsive in-vehicle diagnostics. Also featuring 16 CAN-FD and 24 LINFlex interfaces, Chorus can act as a gateway for multiple ECUs (electronic control units) and support smart-gateway functionality via the two Ethernet interfaces on-chip.

Figure 5
The SPC58 H Line of MCUs can run multiple applications concurrently to allow more flexible and cost-effective vehicle-electronics architectures. Two independent Ethernet ports provide high-speed connectivity between multiple Chorus chips throughout the vehicle.

To protect connected-car functionalities and allow OTA updates to be applied safely, the new Chorus chip contains a Hardware Security Module (HSM) capable of asymmetric cryptography. Being EVITA Full compliant, it implements industry-leading attack prevention, detection and containment techniques.

Working with its large on-chip 10 MB flash, the SPC58NH92x’s context-swap mechanism allows current application code to run continuously even while an update is downloaded and made ready to be applied later at a safe time. The older software can be retained, giving the option to roll-back to the previous version in an emergency. Hyperbus and eMMC/SDIO high-speed interfaces to off-chip memory are also integrated, enabling further storage expansion if needed.

Single Cable Solution

Today’s automotive infotainment systems comprise mobile services, cross-domain communication and autonomous driving applications as part of in-vehicle networking. As a result, these systems require a more flexible solution for transporting packet, stream and control content. Existing implementations are either costly and cumbersome, or too limited in bandwidth and packet data capabilities to support system updates and internetworking requirements.

To address this need, Microchip Technology in November announced an automotive infotainment networking solution that supports all data types—including audio, video control and Ethernet—over a single cable. Intelligent Network Interface Controller networking (INICnet) technology is a synchronous, scalable solution that significantly simplifies building audio and infotainment systems, offering seamless implementation in vehicles that have Ethernet-oriented system architectures (Figure 6).

Figure 6
INICnet technology is a synchronous, scalable solution that significantly simplifies building audio and infotainment systems, offering seamless implementation in vehicles that have Ethernet-oriented system architectures.

Audio is a key infotainment feature in vehicles, and INICnet technology provides full flexibility through supporting a variety of digital audio formats with multiple sources and sinks. INICnet technology also provides high-speed packet-data communications with support for file transfers, OTA software updates and system diagnostics via standard Ethernet frames. In this way, INICnet technology supports seamless integration of Internet Protocol (IP)-based system management and data communications, along with very efficient transport of stream data. INICnet technology does not require the development and licensing of additional protocols or software stacks, reducing development costs, effort and time.

INICnet technology provides a standardized solution that works with both Unshielded Twisted Pair (UTP) at 50 Mbps and coaxial cable at 150 Mbps. With low and deterministic latency, INICnet technology supports deployment of complex audio and acoustics applications. Integrated network management supports networks ranging from two to 50 nodes, as well as processor-less or slim modules where the node is remotely configured and managed. The solution’s Power over Data Line (PoDL) capability saves costs on power management for microphones and other slim modules. Nodes can be arranged in any order with the same result, and any node in the system can directly communicate with any other node in the system.

Security for Connected Cars

As cars become more network-connected, the issue of security takes on new dimensions. In October, Infineon Technologies announced a key effort in cybersecurity for the connected car by introducing a Trusted Platform Module (TPM) specifically for automotive applications—the first on the market, according to the company. The new OPTIGA TPM 2.0 protects communication between the car manufacturer and the car, which increasingly turns into a computer on wheels. A number of car manufacturers already designed in Infineon’s OPTIGA TPM.

The TPM is a hardware-based security solution that has proven its worth in IT security. By using it, car manufacturers can incorporate sensitive security keys for assigning access rights, authentication and data encryption in the car in a protected way. The TPM can also be updated so that the level of security can be kept up to date throughout the vehicle’s service life.

Cars send real-time traffic information to the cloud or receive updates from the manufacturer “over the air,” for example to update software quickly and in a cost-effective manner. The senders and recipients of that data—whether car makers or individual components in the car—require cryptographic security keys to authenticate themselves. These critical keys are particularly protected against logical and physical attacks in the OPTIGA TPM as if they were in a safe.

Early Phase Critical

Incorporating the first or initial key into the vehicle is a particularly sensitive moment for car makers. When the TPM is used, this step can be carried out in Infineon’s certified production environment. After that, the keys are protected against unauthorized access; there is no need for further special security precautions. The TPM likewise generates, stores and administers further security keys for communication within the vehicle. And it is also used to detect faulty or manipulated software and components in the vehicle and initiate troubleshooting by the manufacturer in such a case.

Figure 7
The SLI 9670 consists of an attack-resistant security chip (shown) and high-performance firmware developed in accordance with the latest security standard. The firmware enables immediate use of security features, such as encryption, decryption, signing and verification.

The SLI 9670 consists of an attack-resistant security chip and high-performance firmware developed in accordance with the latest security standard (Figure 7). The firmware enables immediate use of security features, such as encryption, decryption, signing and verification. The TPM can be integrated quickly and easily in the system thanks to the open source software stack (TSS stack) for the host processor, which is also provided by Infineon. It has an SPI interface, an extended temperature range from -40°C to 105°C and the advanced encryption algorithms RSA-2048, ECC-256 and SHA-256. The new TPM complies with the internationally acknowledged Trusted Computing Group TPM 2.0 standard, is certified for security according to Common Criteria and is qualified in accordance with the automotive standard AEC-Q100.

Side by side with driverless vehicle innovations, there’s no doubt that infotainment systems represent one of the most dynamic subsets of today’s automotive systems design. MCU vendors offer a variety of chip and software solutions addressing all the different pieces of car infotainment requirements from display interfacing to connectivity to security. Circuit Cellar will continue to follow these developments. And later this year, we’ll take a look specifically at MCU solutions aimed at enabling driverless vehicles and assisted driving technologies.

RESOURCES

Cypress Semiconductor | www.cypress.com
Infineon Technologies | www.infineon.com
Microchip | www.microchip.com
OpenSynergy | www.opensynergy.com
Renesas Electronics America | www.renesas.com
STMicroelectronics | www.st.com

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February Circuit Cellar: Sneak Preview

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Here’s a sneak preview of February 2019 Circuit Cellar:

MCUs ARE EVERYWHERE, DOING EVERYTHING

Electronics for Automotive Infotainment
As automotive dashboard displays get more sophisticated, information and entertainment are merging into so-called infotainment systems. That’s driving a need for powerful MCU- and MPU-based solutions that support the connectivity, computing and interfacing needs particular to these system designs. In this article, Circuit Cellar’s Editor-in-Chief, Jeff Child, looks at the technology and trends feuling automotive infotainment.

Inductive Sensing with PSoC MCUs
Inductive sensing is shaping up to be the next big thing for touch technology. It’s suited for applications involving metal-over-touch situations in automotive, industrial and other similar systems. In his article, Nishant Mittal explores the science and technology of inductive sensing. He then describes a complete system design, along with firmware, for an inductive sensing solution based on Cypress Semiconductor’s PSoC microcontroller.

Build a Self-Correcting LED Clock
In North America, most radio-controlled clocks use WWVB’s transmissions to set the correct time. WWVB is a Colorado-based time signal radio station near. Learn how Cornell graduates Eldar Slobodyan and Jason Ben Nathan designed and built a prototype of a Digital WWVB Clock. The project’s main components include a Microchip PIC32 MCU, an external oscillator and a display.

WE’VE GOT THE POWER

Product Focus: ADCs and DACs
Analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) are two of the key IC components that enable digital systems to interact with the real world. Makers of analog ICs are constantly evolving their DAC and ADC chips pushing the barriers of resolution and speeds. This new Product Focus section updates readers on this technology and provides a product album of representative ADC and DAC products.

Building a Generator Control System
Three phase electrical power is a critical technology for heavy machinery. Learn how US Coast Guard Academy students Kent Altobelli and Caleb Stewart built a physical generator set model capable of producing three phase electricity. The article steps through the power sensors, master controller and DC-DC conversion design choices they faced with this project.

EMBEDDED COMPUTING FOR YOUR SYSTEM DESIGN

Non-Standard Single Board Computers
Although standard-form factor embedded computers provide a lot of value, many applications demand that form take priority over function. That’s where non-standard boards shine. The majority of non-standard boards tend to be extremely compact, and well suited for size-constrained system designs. Circuit Cellar Chief Editor Jeff Child explores the latest technology trends and product developments in non-standard SBCs.

Thermal Management in machine learning
Artificial intelligence and machine learning continue to move toward center stage. But the powerful processing they require is tied to high power dissipation that results in a lot of heat to manage. In his article, Tom Gregory from 6SigmaET explores the alternatives available today with a special look at cooling Google’s Tensor Processor Unit 3.0 (TPUv3) which was designed with machine learning in mind.

… AND MORE FROM OUR EXPERT COLUMNISTS

Bluetooth Mesh (Part 1)
Wireless mesh networks are being widely deployed in a wide variety of settings. In this article, Bob Japenga begins his series on Bluetooth mesh. He starts with defining what a mesh network is, then looks at two alternatives available to you as embedded systems designers.

Implementing Time Technology
Many embedded systems need to make use of synchronized time information. In this article, Jeff Bachiochi explores the history of time measurement and how it’s led to NTP and other modern technologies for coordinating universal date and time. Using Arduino and the Espressif System’s ESP32, Jeff then goes through the steps needed to enable your embedded system to request, retrieve and display the synchronized date and time to a display.

Infrared Sensors
Infrared sensing technology has broad application ranging from motion detection in security systems to proximity switches in consumer devices. In this article, George Novacek looks at the science, technology and circuitry of infrared sensors. He also discusses the various types of infrared sensing technologies and how to use them.

The Art of Voltage Probing
Using the right tool for the right job is a basic tenant of electronics engineering. In this article, Robert Lacoste explores one of the most common tools on an engineer’s bench: oscilloscope probes, and in particular the voltage measurement probe. He looks and the different types of voltage probes as well as the techniques to use them effectively and safely.

Pioneer Chooses Cypress Wi-Fi/ Bluetooth IC for Infotainment System

Cypress Semiconductor has announced that Pioneer has integrated Cypress’ Wi-Fi and Bluetooth Combo solution into its flagship in-dash navigation AV receiver. The solution enables passengers to display and use their smartphone’s apps on the receiver’s screen via Apple CarPlay or Android Auto, which provide the ability to use smartphone voice recognition to search for information or respond to text messages. The Cypress Wi-Fi and Bluetooth combo solution uses Real Simultaneous Dual Band (RSDB) technology so that Apple CarPlay and Android Auto can operate concurrently without degradation caused by switching back and forth between bands.
The Pioneer AVH-W8400NEX receiver uses Cypress’ CYW89359 combo solution, which includes an advanced coexistence engine that enables optimal performance for dual-band 2.4-GHz and 5-GHz 802.11ac Wi-Fi and dual-mode Bluetooth/Bluetooth Low Energy (BLE) simultaneously for superior multimedia experiences. The CYW89359’s RSDB architecture enables two unique data streams to run at full throughput simultaneously by integrating two complete Wi-Fi subsystems into a single chip.

The CYW89359 is fully automotive qualified with AECQ-100 grade-3 validation and is being designed in by numerous top-tier car OEMs and automotive suppliers as a full in-vehicle connectivity solution, supporting infotainment and telematics applications such as smartphone screen-mirroring, content streaming and Bluetooth voice connectivity in car kits.

Cypress Semiconductor | www.cypress.com

Simplified Interfacing to High-Speed Infotainment In-Vehicle Networks

Microchip Technology recently announced a new high-speed network solution for in-vehicle infotainment with device control over Internet Protocol (IP). Unified Centralized Software Stack (UNICENS) is a free software module for anyone using Intelligent Network Interface Controllers (INIC), such as the OS81118, OS81119, and any future INICs. It enables you to focus on application development rather than network management.

Microchip UNICENS
With UNICENS, you can choose your preferred device control method including Media Oriented Systems Transport (MOST) technology’s FBlock, Ethernet IP and customer-specific methods. It also supports the configuration and control of all network participants from one central node. Furthermore, you don’t need microcontrollers in all the other nodes in the network. UNICENS is currently available as open-source software for Microchip customers.

Microchip Technology | www.microchip.com

H.264 Video I/O Companion Integrated Circuits

Microchip Technology has announced the availability of the OS85621 and OS85623, which are the world’s first H.264 video I/O companion integrated circuits (ICs) optimized for the Media Oriented Systems Transport (MOST) high-speed automotive infotainment and Advanced Driver Assistance Systems (ADAS) network technology. Microchip OS85621

Featuring a low-latency, high-quality H.264 codec and an on-chip Digital Transmission Content Protection (DTCP) coprocessor, the OS85621 enables automotive designers to quickly implement content-protected video transmission solutions. You can now transmit video streams with restricted access from devices (e.g., DIDs, digital media drives, and TV tuners) as encrypted H.264 over a MOST network.

The OS85621’s on-chip DTCP coprocessor accelerates the computation-intensive operations required for DTCP authentication and content protection. You can simultaneously route up to eight independent data streams through the DTCP coprocessor’s cipher engine for M6 or AES-128 encryption/decryption.

The ultra-low-latency mode of the H.264 codec enables single-digit millisecond latency from video input to video output, including encoding, transmission over a MOST network, and decoding. This real-time, high-speed video processing makes the OS85623—which has no DTCP coprocessor—an excellent option for camera-based ADAS applications that are designed to enhance vehicle safety.

The OS85621 and OS85623 H.264 video I/O companion ICs are now available in a BGA 196 package. Volume pricing starts at $8.

Source: Microchip Technology