IoT Module Family Features Ultra-Compact Form Factor

Telit has announced the xE310 family of miniature IoT modules. With initial models planned in LTE-M, NB-IoT and European 2G, the new form factor will enable Telit to meet growing demand for ultra-small, high-performance modules for wearable medical devices, fitness trackers, industrial sensors, smart metering, and other mass-production, massive deployment applications. Telit will start shipping xE310 modules in Q4 this year.
Telit claims the xE310 family is one of the smallest LGA form factors available in the market with a flexible perimeter footprint supporting various sizes from compact to smaller than 200 mm2. The xE310’s 94 pads include spares to provide Telit the flexibility to quickly deliver support for additional features as technologies, applications and markets evolve. Spares can be used for modules supporting Bluetooth, Wi-Fi or enhanced location technologies—in addition to cellular—while maintaining compatibility with cellular only models. They can also be used for additional connections that may be required for new 5G-enabled features.

The new form factor also gives OEMs greater flexibility, efficiency and yield during design and manufacturing. The xE310 family provides easy PCB routing while minimizing manufacturing process issues such as planarity and bending. The unique circular pad facilitates correct package orientation for automated assembly.

To learn more about the new xE310 family, visit the Telit stand 431 at IoT Solutions World Congress in Barcelona, Spain on October 16-18.

For a look at how this new design is enabling smart metering applications, register for the Telit webinar on November 15: “From 2G to 5G: 5 things you need to know for smarter utilities”: https://www.smart-energy.com/industry-sectors/data_analytics/webinar-15-november-5-things-you-need-to-know-for-smarter-utilities/.

Telit | www.telit.com