Eurotech to Provide IoT Tech for New Paris Metro Lines

 

Eurotech France, the French subsidiary of the Eurotech Group, has announced that it has been selected by Thales as a supplier of embedded hardware and IoT software for the CAVE project “Automatic Counting of Passengers” of the new Grand Paris Express metro lines 15, 16 and 17. The entire project represents for Eurotech the supply of a minimum of 1400 passenger counters, with potential additional traches for a total up to 4250. No other financial details have been disclosed.

DynaPCN 10-20

 

This project aims to know in real time the number of wagon users at each station to feed mobility applications and then to improve transport services through a detailed analysis of all the data collected about passengers flows. In addition to using the PoE version of Eurotech’s DynaPCN passenger counter, the solution is based on ESF (Everyware Software Framework) for the on-board software for data collection and remote configuration, and EC (Everyware Cloud) for the ground software to enable Société du Grand Paris to securely access passenger counting information and to use this data internally or by sharing it externally.

The DynaPCN 10-20 is a compact, low power, autonomous device based on non-contact stereoscopic vision technology. It has been specifically designed for passenger counting above the doorways in buses and trains; it can also be used to count people as they enter or leave buildings or any area with restricted access.

Stereoscopic cameras capture images of the area below the device. Thanks to the integrated high luminosity infrared LED indicators it can operate in any type of lighting condition. The extended temperature range capabilities allow integrators to use the device in a wide range of climatic conditions.

The DynaPCN 10-20 analyses the height, shape and direction of any object passing the field of view; if the object is recognized as a person entering or leaving, the incoming and outgoing counters are incremented accordingly, along with time and date information.

Data transfer is made via an Ethernet interface. The onboard insulated digital I/O interfaces can be used to directly communicate with intelligent doors or flow control systems, guaranteeing optimal functionality at all times: for example, stop counting when the doors are closed.

The DynaPCN 10-20 can be easily mounted in the ceiling space above a doorway becoming almost invisible. The angle of the optical panel can be adjusted from 0° to 45°; therefore, it can be placed in an ideal position even if the mounting surface is not horizontal.

Eurotech | www.eurotech.com

MCU Family Adds EtherCAT, Ethernet and CAN FD Capabilities

Texas Instruments (TI) has introduced new communications capabilities on its C2000 MCUs. C2000 F2838x 32-bit MCUs enable designers to use a single chip to implement connectivity, including EtherCAT, Ethernet and Controller Area Network with Flexible Data Rate (CAN FD), in AC servo drives and other industrial systems.

Systems with communication interfaces often require an external application-specific integrated circuit (ASIC) or dedicated host control microprocessor, which limits the flexibility of the design architecture, adds complexity and takes up space on the board. The new C2000 F2838x MCUs do not require an external ASIC, therefore reducing overall solution size and bill of materials.

By integrating three industrial communication protocols, the F2838x MCUs give designers the ability to tailor one MCU to the unique needs of each system. A key component in achieving this is a new connectivity manager, an Arm Cortex-M4-based subsystem, which offloads processing-intensive communications and optimizes connectivity. In addition to these capabilities, C2000 F2838x MCUs offer enhanced real-time control performance and higher flexibility than previous C2000 series MCUs.

For electrically isolated architectures, the new MCUs use a fast serial interface with eight receiving channels to facilitate chip-to-chip communication at up to 200 Mbps using minimal pins. Designers can build on this high level of integration in CAN FD designs and quickly increase the number of available CAN FD ports by pairing the F2838x with a TI system basis chip (SBC), such as the TCAN4550 SBC with integrated CAN FD controller and transceiver.

With a 64-bit floating-point unit and fast integer division hardware, the C28x central processing unit-based control allows for differentiated capability and high-precision designs. For servo drive applications, the fast current-loop technology processes field-oriented control in less than 500 ns to enable more precise position control.

The C2000 F2838x series also integrates a single-ended 16-bit analog-to-digital converter, which doubles the number of available channels compared to previous C2000 MCUs to minimize external components, minimize system latency and maximize control-loop accuracy. An expanded configurable logic block enables designers to customize peripherals and removes or reduces the need for a field-programmable gate array.

Pre-production samples of the C2000 TMS320F28388D are now available through the TI store in a 337 ball-grid-array package. Pricing starts at US$14.00 in 1,000-unit quantities. Developers can get started with the C2000 TMDSCNCD28388D development kit, available through the TI store for $249.

Texas Instruments | www.ti.com

 

Whiskey Lake-UE Boards Feature up to 15-year Availability

By Eric Brown

Congatec has launched a “Conga-TC370” COM Express Type 6 and two SBCs — the 3.5-inch “Conga-JC370” and thin Mini-ITX “Conga-IC370” — with new embedded “UE” 8th Gen chips with 10-year plus availability.

At Embedded World in early March, Congatec unveiled 3.5-inch Conga-JC370 and thin Mini-ITX Conga-IC370 SBCs with Intel’s 8th Gen Whiskey Lake U-series processors. Now, the German embedded firm has announced their availability along with a new Conga-TC370 COM Express Compact Type 6 module. The Linux-friendly boards sport Intel’s new embedded-focused UE versions of the chips, featuring 10-year plus availability.


Congatec’s 8th Gen UE-series lineup (left to right): Conga-IC370, Conga-JC370, and Conga-TC370
(click image to enlarge)
This is the first we’ve heard of the Whiskey Lake UE models, which do not appear to be publicly documented. The processors appear to be otherwise identical with the 8th Gen U-series.

Congatec claims its new boards “are the first in the industry to offer long-term availability of 10+ years.” The boards offer “10+ and on basis of specific last time buy contract up to 15 years long-term availability right from the start,” stated Christian Eder, Congatec Director of Marketing. He noted that most embedded boards offer 7-year availability, which is insufficient for the transportation and mobility sector, as well as many medical devices, industrial controls, embedded edge clients, and HMI systems. Congatec’s 8th Gen Coffee Lake-H based Conga-TS370 Type 6 module goes longer than that, but is still limited to “up to” 10-year availability.

The new Congatec boards run Linux, Windows 10, or Win 10 IoT Enterprise on the following processors:

  • Core i5-8365UE (4x cores @ 1.6GHz, 6MB cache, 15W)
  • Core i7-8665UE (4x cores @ 1.7GHz, 8MB cache, 15W)
  • Core i3-8145UE (2x cores @ 2.2GHz, 4MB cache, 15W)
  • Celeron 4305UE (2x cores @ 2.0GHz, 2MB cache, 15W)

Congatec touts the quad-core i7 and i5 Whiskey Lake chips for their performance boost of up to 58 percent compared to previous U-Series processors. ASll the Whiskey Lake CPUs have an “improved microarchitecture” and provide “efficient task scheduling,” says the company. They also support RTS hypervisor software “to allow additional optimization of I/O throughput from the input channels to the processor cores.”

The 24-EU Intel Gen9 HD graphics supports OpenCL 2.1, OpenGL 4.5 and DirectX12, as well as hardware MPEG-2 or WMV9 (VC-1) decode and H.265 (HEVC) support. All three of the Congatec boards support up to 3x independent 60Hz UHD displays with up to 4096 x 2304 resolution.

 
Conga-TC370, front and back
(click images to enlarge)
Common features among the Conga-TC370, Conga-JC370, and Conga-IC370 include support for up to 64GB DDR4-2400 via dual channels. They all provide native USB 3.1 Gen 2 for transfer rates of 10Gbps and offer Gigabit Ethernet with TSN (Time-Sensitive Networking) real-time support.

The new boards support 0 to 60°C temperatures and offer humidity resistance rated at “10 to 90% r. H. non cond.” They all ship with TPM 2.0 security and the Congatec Board Controller, which offers features like a multi-stage watchdog, power loss control, and hardware health monitoring.

Conga-TC370

Whereas the earlier, Coffee Lake-H based Conga-TS370 adopts the 125 x 95mm COM Express Basic Type 6 form factor, the Conga-TC370 is a 95 x 95 mm Compact Type 6 module. Features include an Intel i219LM GbE controller and interfaces including 3x SATA III, 8x PCIe Gen 3.0, 4x USB 3.1 Gen2, and 8x USB 2.0. There are also LPC, I2C, and 2x UART interfaces.


Conga-TC370 block diagram
(click image to enlarge)
For video, you get 2x DisplayPort 1.2 or HDMI 2.0a ports (or dual DP++), as well as an eDP 1.4. Other features include embedded BIOS boot, update, and security functions and optional active and passive cooling solutions.

Conga-JC370 and Conga-IC370

Aside from the new processor models, the now shipping Conga-JC370 and Conga-IC370 appear to be the same as described in our March coverage. That report offers detailed spec lists and block diagrams.

 
Conga-JC370 (left) and Conga-IC370
(click images to enlarge)
The 146 x 102mm Conga-JC370 appears to be Congatec’s first 3.5-inch SBC. Display features include a DP++ port, with the possibility of a second DP port via the USB 3.1 Gen 2 Type-C port. The Type-C can also draw power as an alternative to the 12-24V DC input. In addition to the standard LVDS or eDP interface, there’s an option for a second LVDS via an adapter.


Conga-JC370 detail view
(click image to enlarge)
One of the 2x GbE ports support TSN. Other features include 2x USB 3.1 Gen 2 ports, an RS232/422/485 port, and internal USB 2.0, serial, GPIO, powered SATA III, and optional CAN interfaces. For expansion, there’s a mini-PCIe slot and micro-SIM slot, as well as an M.2 M-key storage slot with Optane support and general-purpose M.2 B- and E-key slots.

The 170 x 170mm Conga-IC370 thin Mini-ITX board shares several features with the Conga-JC370, including 2x GbE ports, a single USB 3.1 Gen. 2 port, and a 12-24V input. Expansion features are the same except that instead of the M.2 M-key storage socket you get a second SATA III port. The Conga-IC370 also adds a PCIe x4 slot.


Conga-IC370 detail view
(click image to enlarge)
The Conga-IC370 lacks the 3.5-inch model’s Type-C port, but you get dual DP++ ports, LVDS, and eDP. For audio, there’s SPDIF in addition to dual audio jacks. The dual USB 2.0 interfaces have been expressed as coastline ports.

Further information

The Conga-TC370, Conga-JC370, and Conga-IC370 are available now, with pricing undisclosed. More information may be found in Congatec’s 8th Gen UE announcementand the Conga-TC370Conga-JC370, and Conga-IC370 product pages.

This article originally appeared on LinuxGizmos.com on June 12.

Congatec | www.congatec.com

MCUs with EtherCAT Target Industrial Applications

Renesas Electronics has introduced the RX72M Group of RX MCUs featuring an EtherCAT slave controller for industrial Ethernet communication. The new product group offers a high-performance, single-chip MCU solution with large memory capacities for industrial equipment requiring control and communication functions such as compact industrial robots, programmable logic controllers, remote I/O and industrial gateways.
According to Renesas, the use of EtherCAT in industrial Ethernet is growing fast, and is currently used on dedicated MCUs, ICs, and high-end SoC devices specialized for EtherCAT communication. The new RX72M Group achieves the superior performance of a 1396 CoreMark score at 240 MHz as measured by EEMBC Benchmarks, and it is capable of both application processing and EtherCAT communication. Combining a motor-control MCU with on-chip EtherCAT slave functions allows industrial application developers reduce their bill of materials (BOM) and support the miniaturization levels required for industrial equipment design.

The RX72M Group is the first RX MCU group to include an EtherCAT slave controller featuring the RX family’s highest SRAM capacity—1 MB of SRAM—and 4 MB of Flash memory. The large-capacity SRAM allows the MCUs to run multiple memory-intensive middleware systems, such as TCP/IP, web servers, and file systems, at high speed without the use of external memory. It also provides flexibility for the support of future functional expansions, such as OPC United Architecture (OPC UA) with no additional memory required. The on-board flash memory operates as two 2 MB banks, which enables stable operation of the end equipment, such as executing a program in one flash memory while simultaneously conducting background rewrites in the other flash memory.

Key features of the RX72M MCUs:

  • The first EtherCAT slave controller for industrial Ethernet communication in an RX MCU
  • High performance with a CoreMark benchmark score of 1396 at up to 240 MHz, and the first embedded double precision floating point unit (FPU) in an RX MCU
  • High-speed flash memory system supporting readout up to 120 MHz, creating high-performance and low-variability execution environment
  • Dedicated trigonometric function (sin, cos, arctan and hypot fucntions) accelerators and register bank save function supporting high-precision motor control implementation – a feature shared with the Renesas RX72T motor-control MCUs
  • Reliable cryptography functions such as encryption module and memory protection function in hardware to protect encryption keys – this prevents application systems from being copied without authorization and supports authentication for genuine equipment
  • Flexible package options including 176-pin LQFP and 176-pin BGA configurations as well as the first 224-pin BGA package for RX MCUs, which offers additional space saving for size-constrained designs

Samples of the RX72M Group of MCUs are available now. Renesas will begin mass production orders starting September 2019.

Renesas Electronics | www.renesas.com

Report Expects PoE Solutions Market to Exceed $2 Billion by 2025

The power-over-Ethernet (PoE) solutions market size is set to exceed $2 billion (USD) by 2025, according to a new research report by Global Market Insights. The PoE solutions market growth is driven by the increase in the number of connected devices generating demand for more power, light and data converged networks in IoT-enabled infrastructure, says the report. The enterprises are facing challenges while designing a network infrastructure that can support several IoT devices. They are continuously seeking new ways to address network capacity planning for high-speed performance.
PoE solutions enable companies to manufacture PoE-compatible network devices to provide a cost-effective solution for larger installations. The PoE solutions-enabled network infrastructure is helping companies to eliminate additional hardware and reduce costs required to provide connectivity and power to connected devices separately.

The PoE solutions offers flexibility to enterprises by eliminating the need to locate powered devices such as IP cameras, VoIP phones and access control systems close to the power source. The PoE solutions offers uninterrupted power supply to powered devices, which helps in continuous operations of physical security applications such as IP cameras and access controllers. The PoE technology reduces the total cost of ownership of enterprise network hardware by providing connectivity and power to wireless devices through a single ethernet cable.

The Powered Devices (PDs) segment is expected to grow at a CAGR of over 15% in the PoE solutions market during the forecast period due to the increase in the adoption of wireless devices such as VoIP phones, access control systems, lighting controls, alarms, barcode scanners, RFID, clocks, IP security cameras, digital signage displays, computer monitors and PoS terminals. The complexities and costs required to manage power and connectivity to these devices are enabling enterprises to shift to the PoE-enabled PDs. The PoE solutions is helping enterprises in reducing costs and complexities associated with the maintenance of these devices by eliminating additional network hardware.

In 2018, the VoIP phones held the major share in the PoE solutions market due to the need for a cost-effective and reliable solution for enterprise communication. The enterprises are using VoIP phones to reduce costs and complexities associated with the legacy telephony system. The PoE-enabled VoIP phones allow enterprises to reduce costs associated with the network hardware infrastructure by using a single cable for power and data transmission.

The PoE solutions providers are developing network devices, which can support the changing network demand of enterprise customers. For instance, in May 2019, IP-COM, a leading networking solution provider, introduced eight-port managed Gigabit PoE switch in India. This new product launch helped SMEs in India to reduce complexities and costs associated with the deployment of VoIP phones.

The infotainment segment in PoE solutions market is expected to grow at a CAGR of over 15% during the forecast period due to the increase in the demand for enhanced in-vehicle experience. The growing demand for smart vehicles is enabling vehicle manufacturers to develop vehicles with integrated infotainment systems. The existing infotainment system is complex and lacks the bandwidth and packet data capabilities required for network support system updates.

The automotive manufacturers are shifting to PoE-enabled infotainment systems for transforming the in-car experience through the delivery of features such as in-vehicle navigation, audio, video and internet connectivity. The increasing demand for autonomous driving is enabling technology companies to develop PoE-based infotainment systems to match the changing bandwidth and connectivity demands of driverless cars. For instance, in November 2018, Microchip Technology, a leading semiconductor company, introduced Intelligent Network Interface Controller networking (INICnet), an automotive infotainment networking solution for enhancing the in-car experience.

The commercial sector held a significant market share of over 30% in 2018 due to the increase in the adoption of smart and automated systems in commercial buildings. The growing demand for smart workplaces is supporting PoE solutions market growth in office spaces. The PoE solutions improves productivity in office spaces through connected and remotely controlled lighting. PoE infrastructure is a key asset for the implementation of the IoT technology in offices. PoE-enabled lighting improves the quality of the light with smoother intensity, dimming functions, and adjustable lighting color options to provide a comfortable and productive working environment.

Asia Pacific is expected to grow at the highest CAGR of around 20% in the PoE solutions market over the forecast period due to the rising automation across various industries in the region. The governments in India and China are supporting digital transformation initiatives such as ‘Make in India’, Smart City, and ‘Made in China 2025’, to promote the adoption of IoT across various industries. Many Chinese local governments are collaborating with foreign companies to implement smart infrastructure in their cities. In March 2019, China Shanghai Yangpu government collaborated with MXC Foundation to develop its IoT standards for smart cities to improve efficiency and life of citizens.

The companies in the PoE solutions market are focusing on extending their businesses through partnerships with distributors. For instance, in April 2018, Microsemi partnered with Future Electronics, a global leading distributor of electronic components, for distributing its highly-compact single port Gigabit Ethernet. This partnership helped the company in offering innovative capabilities to differentiate OEM end-products including lower power consumption, extended product design life cycle, and enhanced IEEE 1588v2 Precision Time Protocol (PTP) accuracy from a system-level solution for future 5G compliant designs.

The key players operating in the PoE solutions market are Advantech B+B SmartWorx, Analog Devices, Avaya, Belden, Broadcom, Cisco, CommScope, Dell, euromicron, HPE, Huawei, Kinetic Technologies, Maxim Integrated, Microchip, Monolithic Power Systems, NETGEAR, ON Semiconductor, Silicon Laboratories, STMicroelectronics and Texas Instruments.

The Power over Ethernet (PoE) solutions market research report includes in-depth coverage of the industry with estimates and forecast in terms of revenue in USD from 2014 to 2025.

Global Market Insights | www.gminsights.com

Fanless Industrial IoT Gateway Boasts Small Form Factor

WIN Enterprises has announced the PL-80580, a fanless, small form factor for use as an Industrial IoT (IIoT) Gateway, and for networking applications requiring the small footprint and temperature tolerance of industrial applications. The small footprint of the PL-80580 (216 mm x 142 mm x 37.5 mm) also provides a good fit for robotics, cart-based medical and digital signage applications.

The unit features a choice of three Intel Atom E3800 3-D processors with Tri-gate design in single-, dual, and quad-core versions with 2x GbE LAN ports. The Intel processor is high performance, low-power consuming at 5 W, 7 w or 10 W. The E3845 SoC provides up to 1.91 GHz performance with its quad-core design. CPUs are partnered with the Intel i210AT GbE LAN controller. System I/O includes 1x USB 3.0, 2x USB 2.0, 2x Intel PCIe GbE, and 1x RS-232/422/485 & 3x RS232, plus expansion capabilities. The unit is RoHS, FCC, and CE compliant.

Features:

  • Intel Atom Processor E3800 SoC (up to 1.91 GHz)
  • Supports -10°C~60°C operating temperature range
  • 1 x HDMI, 1 x VGA1 x SATA III, 1 x Half-size mSATA
  • 2 x Intel i210AT Gigabit Ethernet
  • 4 x COM, USB 2.0, USB 3.0
  • 1 x Full-size mini-PCIe, 1 x Half-size mini-PCIe (mSATA)
  • DC 8V-32V input

WIN Enterprises will customize the PL-80580 based on customer’s specific market requirements.

WIN Enterprises | www.win-ent.com

 

Isolated DC-DC Converters Meet PoE Requirements

Murata Manufacturing has expanded its lineup of isolated DC-DC converters for Power over Ethernet (PoE). The additions to the lineup consist of the following two isolation type DC-DC converter products intended for Powered Devices (PD) and also the following isolation type DC-DC converter product intended for Power Sourcing Equipment (PSE). The MYBSP0055AABFT is 5 V output /5.1 A product for PDs. The MYBSP0122BABFT is a 12 V output /2.1 A product also for PDs. And the MYBSS054R6EBF is a 54 V output/0.6 A device for PSEs.

These products are suitable for biometric authentication devices which are required mainly to occupy minimal space and possess low noise characteristics, an IoT Gateway which is necessary for edge computing, and camera modules. They also contribute to miniaturization of conventional wireless access points, IP telephones, and routers. These products are already being mass produced, and Murata can provide samples upon request.

MYBSP0055AABFT, MYBSP0122BABFT Features:

  • Complies with IEEE 802.3at Class 4
  • Compact, low-profile SMD type: 35.5 x 22.4 x 10.55 mm
  • Operating temperature range: -40 to +85°C
  • Low noise
  • Input/output isolation withstand voltage: 2250 Vdc
  • Adapter-ORing function
  • Type 2 PSE indicator function

MYBSS054R6EBF Features:

  • 30W Boost-up isolation type converter
  • Compact, low-profile SMD type: 35.5 x 22.4 x 8.9 mm
  • Operating temperature range: -40 to +85°C
  • Input/output isolation withstand voltage: 2250 Vdc
  • Supports 12 V and 24 V outputs, and also ACDC adapter inputs

Murata | www.murata.com

 

IoT Wireless Sensor Nodes Target LPWAN Deployments

Advantech has released its WISE-4210 series of IoT wireless sensor products, including a wireless LPWAN-to-Ethernet AP and three wireless sensor nodes. The nodes include tthe WISE-4210-S231 internal temperature and humidity sensor (shown), WISE-4210-S251 sensor node with 6-channel digital input and a serial port and WISE-4210-S214 sensor node with 4-channel analog input and 4-channel digital input. The device-to-cloud total solution provided by this series of LPWAN products allows IT, OT, and cloud platform system developers to easily implement a private LPWAN, acquire field site data, and achieve seamless integration with both public cloud, such as Microsoft Azure and private enterprise clouds.

Based on proprietary LPWAN technology, the new WISE-4210 series products minimize frequency band interference, support a wider data transmission range, are compatible with lithium batteries, and enable cloud platform integration. By locking the sub-GHz frequency band, WISE-4210 series products significantly reduce susceptibility to interference for 2.4 GHz wireless communication technologies such as Wi-Fi, Bluetooth and Zigbee.

By supporting a network transmission distance of up to 5 km, the WISE-4210 series meets the requirements of large-scale interior environments such as data centers, factories and warehouses for collecting and applying a wide range of interior data. With LPWAN technology, only three 3.6 V lithium batteries are required to operate the WISE-4210 sensor nodes for up to five years, eliminating the need for additional wiring and frequent recharging. Additionally, the WISE-4210 series supports multiple transfer protocols, including MQTT, RESTful, Modbus/TCP and Modbus/RTU, for simple device-to-cloud connections.

The WISE-4210-S231 sensor node with built-in temperature and humidity sensor collects relevant data form factories, data centers or warehouse management without requiring the installation of additional sensors or gateways, making it ideal for indoor temperature and humidity control applications. Meanwhile, the WISE-4210-S251 sensor node, which provides 6-channel digital input and a single RS-485 port, and the WISE-4210-S214 sensor node, which provides four-channel analog input and 4-channel digital input, can be used to collect electricity meter, pressure gauge, thermometer, and power consumption data from factory facilities.

The three wireless nodes support direct data transmissions to SCADA and cloud platforms through a WISE-4210-AP, eliminating the need for a separate data conversion device. The WISE-4210-AP access point is capable of managing up to 64 nodes simultaneously, and thus can simplify overall infrastructure and save installation space.

Advantech | www.advantech.com

CompactPCI Serial Board Delivers Four Gbit Ethernet Channels

MEN Micro has announced the G211X Ethernet interface card. It ensures fast data transmission with four X-coded M12 connectors connected to the backplane via an x4 link. The G211X is a new quad Ethernet card based on CompactPCI Serial. It can be used in combination with a CompactPCI Serial or CompactPCI PlusIO CPU board in a CompactPCI Serial or hybrid system. The four Gigabit Ethernet interfaces on the front panel are accessible via robust, X-coded M12 connectors.

All four interfaces are controlled by an Ethernet controller connected to the backplane via an x4 PCI Express connection. Each interface also supports a data transmission rate of 1 Gbit/s—even if all four channels are used simultaneously. For better control, two LEDs each indicate the connection and activity status of the interfaces. The G211X is designed for the extended operating temperature and prepared for conformal coating for use in harsh and mobile environments, in particular for rolling stock applications.

  • Four 10/100/1000BASE-T Ethernet channels
  • Intel i350 Server chipset with support for 8 virtual machines
  • Full-duplex or half-duplex
  • X-coded M12 connectors
  • 500 V insulation voltage
  • -40°C to +85°C operating temperature
  • Based on PICMG CPCI-S.0 CompactPCI Serial

MEN Micro | www.menmicro.com

1U Net Service Appliance Embeds AMD EPYC 7000 Processor

WIN Enterprises has announced the PL-81280, a 1U high-performance rack-mounted networking system designed for use in the cloud and datacenter. The appliance supports the AMD Naples EPYC 7000 SoC processor. The System on Chip (SoC) processor features integrated security and graphics capabilities.
The EPYC processor achieves high computing performance offering up to 32 processing cores. Big data analytics and in-memory databases are accelerated with the additional parallelism enabled by this microarchitecture. Overall throughput is optimized in data intensive environments by two standard PCIe x16 slots that support two 100 Gbit Ethernet adapter cards.

The PL-81280 supports up to 4 NIC modules and has multiple Ethernet module bays that enable flexible port configuration. That includes 1/10/40 Gigabit fiber and Gigabit copper with BYPASS option.Strong I/O elements include Ethernet ports for management and optional IPMI, a console port, two USB 3.0 ports, a Graph LCD module, 5-key interface, and LEDs for power/HDD/2xGPIO. In addition, PL-81280 supports one 3.5-inch or two 2.5-inch SATA HDDs/SSDs, one m-SATA and two M.2 2280/22110 slots to accommodate basic network storage applications. WIN Enterprises will customize the PL-81280 based on a customer’s more specific application needs.

Features:

  • Supports AMD Naples EPYC 7000 Series SoC Processor, LGA4094
  • Eight-channel DDR4 ECC Registered 2400/2667MHz memory
  • Max memory support of 512GB
  • Max support 4x PCIe X8 slots for expansion LAN modules, supporting a maximum of 32 GbE Copper/Fiber ports
  • 1 x 3.5” or 2 x 2.5” HDD/SSD support
  • 1 x riser card for PCIe slot expansion
  • 2 x M.2 2280/22110 and 1 x m-SATA
  • Supports optional IPMI card with VGA

WIN Enterprises | www.win-ent.com

Apollo Lake Pico-ITX SBC Sports Dual GbE Ports

AAEON has released the PICO-APL4, a compact SBC that features onboard memory and storage along with dual Gbit Ethernet support. The board is well suited for factory automation and IoT gateway systems. AAEON’s latest PICO form factor board is powered by an Intel Atom, Pentium N4200 or Celeron N3350 processor. By fitting the controller with up to 4 GB of onboard DDR3L memory and up to 64 GB of onboard eMMC storage, AAEON has made the board more resistant to the shocks and vibrations regularly experienced in industrial settings. This also cuts application development times because system developers don’t need to test the compatibility of external memory and storage.

The flexible PICO-APL4 houses USB ports and connectors, COM ports, a HDMI port and optional eDP. There’s also a 4-bit DIO to manage peripherals and an optional four-lane MIPI-CSI. Expansion is easily achieved with M.2 B and E keys enabling the connection of additional storage and WiFi/Bluetooth modules. Through an optional board-to-board interface, customers can also extend the IO interface and add a larger DIO.

Features:

  • Intel Atom/ Pentium N4200/ Celeron N3350 Processor SoC
  • Onboard DDR3L 2 GB (Optional to 4 GB)
  • Onboard Storage eMMC 16 GB (Optional to 32 GB / 64 GB)
  • Dual Gigabit Ethernet Support
  • HDMI 1.4b, eDP (Optional) for Display
  • BIO Reserved (Optional)
  • USB 3.0 x 2, USB 2.0 x 2, SATA 6.0 Gb/s x 1
  • 2 B Key (2280) x 1, M.2 E Key (2230) x 1

AAEON | www.aaeon.com

2U HPC Server Sports Dual Intel Xeon Scalable Processors

WIN Enterprises has announced the PL-81890, a high performance 2U server platform with support for dual Intel Xeon Scalable Series processors, Trusted Platform Module (TPM) and storage features including twenty four 2.5-inch hot-swappable U.2 SSDs. I/O support includes 10GBASE-T, two ports of 10 Gbit Ethernet, two ports of 25 Gbit Ethernet, four ports of 10 Gbit Ethernet SFP+, one 1GBASE-T port dedicated to IPMI, plus three USB 2.0 ports. Up to two GPGPU cards are supported to visualize decision support data. Two M.2 NVMe slots are supported for high performance SSDs.

n onboard Trusted Platform Module (TPM) ensures the integrity of network processing for critical applications. A choice of three TPM modules is provided: TPM Module 1.2 with LPC, TPM Module 2.0 with LPC or TPM Module with eSPI.
The unit’s high performance processors and memory capacity of 3 Terabytes makes the unit appropriate for high-end, latency-sensitive operations, including transaction processing, scientific/real-time analytics, IoT cloud computing, virtualization, data mining, data warehousing and other critical applications.

Features:

  • 2U, 12 Bays TPCS System
  • Dual Intel Xeon Scalable Processor Platforms
  • (12) DDR4 ECC-RDIMM/LRDIMM/3DS LRDIMM 2133
  • (4+2) 1G BaseT LAN ports / (4) 10GbE SFP+
  • 80+ Platinum Certified 550W/850W CRPS
  • Supports 1.2 and 2.0 Trusted Platform Modules (TPM)
  • Supports (2) GPGPU graphics cards for AI applications

WIN Enterprises | www.win-ent.com

Commell Launches its First ARM-Based Pico-ITX

By Eric Brown

Commell has announced the LP-150, a Rockchip RK3128 based Pico-ITX SBC that appears to be its first ARM-based embedded board of any kind. The 100 mm x 72 mm LP-150 is the only ARM-based SBC out of the many dozens of mostly Intel-based boards listed on Commell’s SBC page.

Shipping with Android 4.4.4, but also supporting Linux, the LP-150 is intended primarily for imaging, machine vision and digital signage applications. Other Commell Pico-ITX SBCs include its Intel Braswell based LP-176.

Commell LP-150

Rockchip’s quad-core, Cortex-A7 RK3128 hasn’t seen as much uptake in the embedded world as the quad -A17 RK3288, which is found on hacker boards such as the Firefly-RK3288 Reload or the high-end, hexa-core RK3399, which has appeared on numerous recent products such as OpenEmbed’s em3399 module or Aaeon’s RICO-3399 PICO-ITX SBC. The only RK3128-based SBC we can recall is the open spec Firefly-FirePrime S.

The LP-150 SBC has a fairly modest feature set, with only 512 MB DDR3. Yet, it offers a few features you don’t typically find on x86 Pico-ITX SBCs like eMMC storage (8GB) and built-in Wi-Fi. Media features include an HDMI 1.4 port limited to HD resolution and an LVDS interface with capacitive touchscreen support. You also get CVBS inputs and outputs and audio I/O headers.

The LP-150 is further equipped with a GbE port and USB 2.0 host and OTG ports. There is also an RTC with battery, and a smattering of RS-232, UART, and GPIO interfaces.

Specifications listed for the Commell LP-150 include:

  • Processor — Rockchip RK3128 (4x Cortex-A7 @ 1.3 GHz); Mali-400 MP2 GPU with OpenGL ES1.1 and 2.0, OpenVG1.1
  • Memory — 512 MB DDR3
  • Storage — 8 GB eMMC; microSD slot
  • Display:
    • HDMI 1.4 port for up to 1080p
    • Single-channel 18/24-bit LVDS for up to 1280 x 720 displays or up to 1024 x 600 cap. touchscreens
    • LCD/LVDS panel and inverter connectors
    • CVBS in/out
  • Wireless — Wi-Fi with SMA antenna
  • Networking — Gigabit Ethernet port (RTL8211E)
  • Other I/O:
    • USB 2.0 host port with support for 4-port hub
    • USB 2.0 OTG port
    • 2x RS232 interfaces
    • 3x UART
    • Audio line-out, mic-in headers (Rockchip codec)
    • GPIO header
  • Other features — Power, recovery, reset buttons; RTC with lithium battery; LED
  • Operating temperature — 0 to 70°C
  • Power — DC input 5 V
  • Dimensions — 100 mm x 72 mm (Pico-ITX)
  • Operating system — Android 4.4.4; Linux also supported

Further information

No pricing or availability information was provided for the LP-150. More information may be found on Commell’s LP-150 product page.

Commell |  www.commell.com.tw

This article originally appeared on LinuxGizmos.com on March 6.

Industrial Ethernet Switch on 3U cPCI

MEN Micro has announced the G102, a fully managed 3U flexible multiport Gbit switch, with a 29 Gbit/s switch matrix, implemented as a CompactPCI Serial board. It occupies one system slot or one peripheral slot using a 4 HP front panel with three Gbit Ethernet ports on M12 X-coded connectors on the front panel. The new backplane concept for MEN routers and switches allows high flexibility in network applications and management.

02g102-03_rightThe G102 guarantees high speed, high efficiency and an extensive firmware supporting various protocols like security, time synchronicity, stability, as well as for temperature needs. The switch supports EEE (Energy Efficient Ethernet) as a standard on all ports, IEEE1588v2 on ports 1 to 12 and SyncE (synchronous Ethernet) as an option.

The G102 either features three Ethernet ports on the front and up to 22 ports on the rear, or alternatively all 25 ports on the rear. These include 12 ports with integrated 10/100/1000 Mbit/s copper PHYs.

The switch is fault tolerant and restores itself on its own: If a link is temporarily unavailable, frames can be sent via backup/redundant links (spanning tree protocol/link aggregation) and no data loss occurs. Its built-in test mechanisms make the G102 an even more reliable component in the communication system. The railway Ethernet switch is specifically designed for rugged mobile communication systems and fully compliant with the EN 50155 railway standard, qualified for a -40 to +85°C operation temperature and ready for coating.

MEN Micro | www.menmicro.com

COM-Based SBCs Offer High I/O Density

Diamond Systems has released its ultra-small COM-based ZETA single board computer family. Highlights include interchangeable COM Express COMs for scalability and long product life, ultra- compact size and an rich amount of I/O, including a complete high-quality analog and digital data acquisition subsystem.

Designed in the COM Express Mini Type 10 form factor (84 mm x 55 mm / 3.3 in. x 2.2in.), the Zeta family offers performance scalability due to its use of COM Express CPU modules. Three processor options are currently available: Intel “Bay Trail” E3825 dual-core 1.33 GHz CPU with soldered 2 GB RAM; Intel “Apollo Lake” E3940 quad core 1.60 GHz CPU with soldered 4 GB RAM; and Intel “Apollo Lake” N4200 quad core 1.1 GHz (burstable to 2.5 GHz) CPU with soldered 8 GB RAM.

zeta-enlargedThe use of interchangeable CPU modules in the increasingly popular COM Express Mini Type 10 format enables Zeta to serve applications across a wide spectrum of price and performance needs. It also offers customers the longest possible product lifetime by vastly simplifying migration to a new CPU when the current one reaches its end of life. Zeta is an excellent choice for applications with expected lifetimes of 10 or more years, including military, medical, and transportation.

Zeta’s two-board COM + baseboard construction yields the highest feature density possible in a given footprint. The COM provides the core CPU functions, while the baseboard provides the “final inch” for all the system I/O plus the data acquisition subsystem, power supplies, and expansion sockets. Zeta provides as much as a 60% reduction in size compared to boards in larger form factors offering the same level of I/O.

Zeta’s impressive I/O list includes the following:

  • VGA display and Single-Channel LVDS port
  • Dual Gigabit Ethernet
  • 4 USB 2.0 Ports + 1 USB 3.0 port
  • 4 RS-232/422/485 ports with software-programmable protocol and termination
  • 16 digital IlO lines
  • Optional complete analog and digital data acquisition system
  • Integrated wide-range 6 V to 36 V power input circuit

Zeta is available in two I/O configurations, digital I/O only or digital + analog I/O. The DIO only circuit offers 16 DIO lines with selectable 3.3V/5V logic levels. The full circuit includes 16 channels of 16-bit A/D, 4 channels of 16-bit D/A, 27 digital I/O lines with selectable 3.3V/5V logic levels, and 8 32-bit counter/timers, all supported by Diamond’s free, industry-leading Universal Driver data acquisition programming library. An interactive graphical control panel for Windows and Linux is also provided to control all data acquisition features.

Zeta offers multiple options for system expansion and mass storage. It includes a PCIe Minicard / mSATA socket and a micro-SD socket. A unique expansion connector enables the installation of a daughterboard that contains an M.2 SATA SSD socket, a second PCIe Minicard socket, HD audio and 16 additional GPIO lines.

A built-in heat spreader efficiently removes heat from the SBC to keep the processor and all internal electronics cooler for improved reliability. The bottom-side mounting configuration of the heat spreader provides a secure and convenient mounting system for the board. It also simplifies the installation of I/O expansion modules by eliminating interference or airflow problems that can occur with traditional heat sinks. All three models of Zeta are tested for operation over the full industrial temperature range of -40°C to +85°C, making Zeta well suited for vehicle applications.

Diamond Systems | www.diamondsystems.com