Avoid Reinventing the Wheel on Industrial Designs

Software updates are easy to roll out, but hardware upgrades on custom designs often require a major investment of time and money. A modular approach can speed up this process. In this article, congatec’s Dan Demers explains how.

Make slow progress or speed ahead with buy-in?

By Dan Demers, Director of Sales and Marketing – Americas, congatec

We are used to receiving software updates on-the-fly today. So why not utilize converged embedded computing platforms to upgrade our hardware? This would enable us to take direct advantage of the rapid development cycles of the computing, vision and AI industries.

There are plenty of examples on how to upgrade the hardware during running series production. In the medical sector, for instance, where medical devices even require certification. But it appears that some system developers have not yet learned how to consistently build computing core upgrades into their product development.

This is because full custom designs are still quite common. The integration of expensive navigation systems by premium vehicle manufacturers is a bad example of this. Although pretty and expensive, they are often much slower than the driver’s considerably cheaper mobile phone. Before the computer technology that’s installed in the vehicle gets used by the customer, it is usually already obsolete.  Market acceptance for such monolithic solutions is therefore dwindling noticeably.

The problem of these manufacturers is anchored in the design principles of mass production, where every cent matters, but no attention is paid to the innovation cycle demanded by users. This has fatal consequences: If the computing part is entirely custom designed, an upgrade will in many cases require a redesign, where the ability to reuse blocks of the previous generation is limited. So all in all, we’re talking about a major investment to always deploy the latest computer technology in an application.

But there’s another way: To avoid having to reinvent the wheel every time, the Computer-on-Module concept was developed at the end of the 90s. Modular approaches had existed before then, but it is only since the Computer-on-Module concept emerged, that modules stopped being proprietary and became available as standardized components from numerous providers.

congatec offers SFF Computer-on-Modules for all leading standards: SMARC 2.0, Qseven, COM Express Mini and COM Express Compact modules.

Computer-on-Modules are available in different designs. For low-power CPUs such as Intel Atom, AMD G-Series or the ARM i.MX6 and i.MX8 platforms from NXP, the Qseven and SMARC Computer-on-Module standards are particularly suitable. For higher computing power and interface demands, COM Express is the best standard. COM Express Type 6 modules support fast CPUs, like the AMD V1000 or the latest Intel Core processors.

Type 7 was defined for edge server processors and 10 Gbit Ethernet support; however, in true server fashion, it no longer supports any video interfaces. The upcoming PICMG COM-HPC standard will support even faster interfaces. The specification is due to be published in 2019, with first products expected in 2020.

With Server-on-Modules a modular approach is even suitable for the development and constant update of high-performance microservers by just exchanging the modules. This significantly reduce the efforts and cost connected for upgrades.

All in all, Computer-on-Modules are an ideal and easy way to equip machines and devices with the latest processor technology. So anyone who wants to use converged system platforms as part of their closed-loop engineering, will find that Computer-on-Modules are a perfect platform for performance upgrades. However, this doesn’t mean that you shouldn’t implement a full custom design when it comes to mass production. But here too, getting the module supplier to implement a fusion of modules and carrier board works significantly better than the OEM developing everything from scratch.

congatec | www.congatec.com/us

 

Sponsored by: congatec

Ryzen Embedded V1000 Module Supports Four USB 3.1 Ports

By Eric Brown

Ibase has announced a COM Express Type 6 module equipped with AMD’s Ryzen Embedded V1000 system-on-chip. The announcement refers to the ET876 as a Compact module (95 x 95mm) like Ibase’s earlier, Intel 7th Gen “Kaby Lake” ET975, but the spec sheet and the photo indicate it’s a larger 125 x 95mm Basic module like Ibase’s 7th Gen ET970.


 
ET976, front and back
(click images to enlarge)

The ET976 follows other V1000-based COM Express Type 6 modules including Seco’s Compact COMe-B75-CT6, Kontron’s Compact COMe-cVR6, Advantech’s Basic SOM-5871, and MEN Micro’s Basic CB71C. The Kontron and MEN Micro modules also support the new stripped-down Ryzen Embedded R1000.

Ibase listed no OS support for the ET976, but all the other V1000-based modules either ship with Linux as the default or support Linux and Windows. The module supports the dual-core V1202B and the quad-core V1605B, V1807B, and V1807B SoCs at up to 3.8GHz. Applications include graphics-intensive devices used in industrial automation, medical imaging, transportation, gaming, payment systems, and ATM machines.

Claimed to be up to twice as fast as AMD’s earlier R-Series SoCs, the Ryzen Embedded V1000 competes with Intel’s similarly 14nm-fabricated Kaby Lake and Coffee Lake Core processors. The SoC offers up to four dual-threaded Zen CPU cores for 8x threads total, as well as high-end Radeon Vega 3 graphics with up to 11 compute units.



ET976 
(click image to enlarge)


The ET976 supports up to 8GB of DDR4, including ECC RAM. It integrates an Intel I210IT GbE controller a watchdog, hardware monitoring functionality, and support for TPM 2.0.

The announcement mentions triple independent displays, but the product page says there are only dual displays. In any case, they are enabled with 2x DDI and either an LVDS or optional eDP interface. No resolution was mentioned, but some of the other modules support 4K video.

This is the first V1000-based module we’ve seen with USB 3.1 support as opposed to USB 3.0. The ET976 expresses I/O including 4x USB 3.1, 8x USB 2.0, 2x SATA III, 2x UART, HD audio, and 4-in/4-out DIO. The module provides a single PEG x8 connection and 8x PCIe expansion interfaces, and there’s support for 0 to 60°C temperatures.

 
Further information

No pricing or availability information was provided for the ET976. More information may be found in Ibase’s ET976 announcement and product page.

This article originally appeared on LinuxGizmos.com on July 16.

Ibase | www.ibase.com.tw

Congatec Rolls Out Ten Modules Based on Coffee Lake H Processors

Congatec has announced 10 new COM Express Type 6 modules featuring the latest Intel embedded processor technology. The four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors are all based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables Congatec to provide all 10 new processors on one COM Express module design: the conga-TS370. A total of 14 processor module variants are now available on this single microarchitecture, offering extremely wide scalability.

The spearhead in terms of computing power is the 45 W 6-core module with 2.8 GHz Intel Xeon E-2276ME processor. It provides the highest embedded computing performance with integrated high-performance processor graphics currently available worldwide, while the 2.4 GHz Intel Celeron G4930E processor module with 35 watts sets the new price-performance benchmark.

Particularly noteworthy are the two 6-core Congatec modules with a TDP of 25 W offered on Intel Xeon E-2276ML and Intel Core i7-9850HL processors. They enable developers to create completely passively cooled embedded edge computing systems that can run up to 12 standalone virtual machines in parallel thanks to hyperthreading. This allows operation even in fully sealed systems, under the harshest environmental conditions and with the highest IP protection. The same applies to the two quad-core modules with Intel Xeon E-2254ML or Intel Core i3-9100HL processor as well as the Intel Celeron G4932E processor-based module, all featuring a–partly configurable –TDP of 25 W.

Other applications besides embedded edge computing including classic high-end medical imaging systems and HMIs as well as high-end gaming, infotainment and digital signage systems that require best-in-class computing power and throughput on a single die in tandem with the Intel graphics technology.

Congatec | www.congatec.com

PICMG to Develop COM Open Spec for Server-Level Edge Computing

PICMG has announced that it has recently formed the COM-HPC technical subcommittee. It is actively developing a new COM (Computer-On-Module) specification to meet the increasing requirements of edge computing applications. Well suited for a wide range of applications, PICMG’s popular COM Express has been adopted worldwide and is anticipated to grow and thrive over the next decade.

According to multiple research reports, the computer-on-module (COM) market is expanding rapidly and is expected to reach over $1 billion by 2022. The technical requirements to bring server-level computing to the edge have driven the need to create new open specifications to complement COM Express. PICMG members have long been at the forefront of designing and supplying edge computing solutions and are collaborating to meet the requirements of applications well into the future.

PICMG says the new COM specification under development is in parallel to existing COM Express efforts. This effort is intended to complement rather than be a replacement for COM Express The subcommittee will develop a next-generation COM standard and an accompanying Carrier Design Guide. The new specification is expected to support two different module types: one for high-performance computing, the other for embedded computing. Initial plans include incorporating a new high-speed connector able to support existing and future interfaces such as PCI Express Gen 5, and 100/200 Gbit Ethernet. The specification will target medium to high-performance server-class processors.

Key COM-HPC Goals:

  • Support for PCIe Gen 5.0 (32 Gb/s)
  • 64 PCIe Lanes
  • 25 Gbit Ethernet per signal pair to support 100 Gbit Ethernet
  • Update of other interfaces to latest technology levels

The goal is to have specifications ratified in early 2020. The team has elected Christian Eder of congatec as committee chair. Kontron’s Stefan Milnor is the technical editor and Dylan Lang of Samtec is the secretary.

“COM-HPC will become a very high-performance module specification,” said committee chair Christian Eder. “It is not a replacement for COM Express; it extends the computer modules to a completely new level. It will serve as a transition from Computer-On-Module to Server-On-Module.”

So far, this initiative includes twenty active member participating companies: ADLINK, Advantech, Amphenol, Bielefeld University, congatec, Elma, Emerson, ept, FASTWEL, HEITEC, Intel, Kontron, MEN Mikro, MSC Technologies, N.A.T., Samtec, SECO, TE Connectivity, Trenz Electronic and VersaLogic.

PICMG | www.picmg.org

 

Updated COMe Board Sports 9th Gen Intel Processors, 128 GB RAM

Kontron is providing the its COMe-bCL6 COM Express basic Type 6 form factor (125 mm x 95 mm) board equipped with Intel 9th Gen processors. With up to four memory sockets it enables a maximum memory expansion of up to 128 GB. The board is available in different processor versions. All versions can be equipped with up to 128 GB non-ECC/ECC DDR4 memory.

The Intel Optane system accelerator ensures fast data transfer from and to high-capacity mass storage devices. NVMe SSD also supports what is currently the fastest storage technology in a very compact package. Thanks to USB 3.1 support with up to 10 Gbps and USB Type-C support, twice the bandwidth (compared to USB 3.0) can be achieved for fast data transfers.

The COMe-bCL6 is well suited as a successor for existing solutions, because it takes over their pin out and feature implementation. Typical applications include communication, digital signage, professional gaming and entertainment, medical imaging, surveillance and security, industrial edge or server applications, as well as industrial plant, machine and robot control, both at shop floor level and from the control room. The rugged variants of the COMe-bCL6 meet the particular demands of the defense, transportation and avionics sectors by offering an extended feature set and industrial temperature range from -40°C to +85°C.

The COMe-bCL6 supports the Kontron APPROTECT security solution based on Wibu-Systems CodeMeter. In addition, Kontron APPROTECT Licensing enables the realization of new business models such as pay-per-use or time-based test versions.

Kontron | www.kontron.com

Whiskey Lake-UE Boards Feature up to 15-year Availability

By Eric Brown

Congatec has launched a “Conga-TC370” COM Express Type 6 and two SBCs — the 3.5-inch “Conga-JC370” and thin Mini-ITX “Conga-IC370” — with new embedded “UE” 8th Gen chips with 10-year plus availability.

At Embedded World in early March, Congatec unveiled 3.5-inch Conga-JC370 and thin Mini-ITX Conga-IC370 SBCs with Intel’s 8th Gen Whiskey Lake U-series processors. Now, the German embedded firm has announced their availability along with a new Conga-TC370 COM Express Compact Type 6 module. The Linux-friendly boards sport Intel’s new embedded-focused UE versions of the chips, featuring 10-year plus availability.


Congatec’s 8th Gen UE-series lineup (left to right): Conga-IC370, Conga-JC370, and Conga-TC370
(click image to enlarge)
This is the first we’ve heard of the Whiskey Lake UE models, which do not appear to be publicly documented. The processors appear to be otherwise identical with the 8th Gen U-series.

Congatec claims its new boards “are the first in the industry to offer long-term availability of 10+ years.” The boards offer “10+ and on basis of specific last time buy contract up to 15 years long-term availability right from the start,” stated Christian Eder, Congatec Director of Marketing. He noted that most embedded boards offer 7-year availability, which is insufficient for the transportation and mobility sector, as well as many medical devices, industrial controls, embedded edge clients, and HMI systems. Congatec’s 8th Gen Coffee Lake-H based Conga-TS370 Type 6 module goes longer than that, but is still limited to “up to” 10-year availability.

The new Congatec boards run Linux, Windows 10, or Win 10 IoT Enterprise on the following processors:

  • Core i5-8365UE (4x cores @ 1.6GHz, 6MB cache, 15W)
  • Core i7-8665UE (4x cores @ 1.7GHz, 8MB cache, 15W)
  • Core i3-8145UE (2x cores @ 2.2GHz, 4MB cache, 15W)
  • Celeron 4305UE (2x cores @ 2.0GHz, 2MB cache, 15W)

Congatec touts the quad-core i7 and i5 Whiskey Lake chips for their performance boost of up to 58 percent compared to previous U-Series processors. ASll the Whiskey Lake CPUs have an “improved microarchitecture” and provide “efficient task scheduling,” says the company. They also support RTS hypervisor software “to allow additional optimization of I/O throughput from the input channels to the processor cores.”

The 24-EU Intel Gen9 HD graphics supports OpenCL 2.1, OpenGL 4.5 and DirectX12, as well as hardware MPEG-2 or WMV9 (VC-1) decode and H.265 (HEVC) support. All three of the Congatec boards support up to 3x independent 60Hz UHD displays with up to 4096 x 2304 resolution.

 
Conga-TC370, front and back
(click images to enlarge)
Common features among the Conga-TC370, Conga-JC370, and Conga-IC370 include support for up to 64GB DDR4-2400 via dual channels. They all provide native USB 3.1 Gen 2 for transfer rates of 10Gbps and offer Gigabit Ethernet with TSN (Time-Sensitive Networking) real-time support.

The new boards support 0 to 60°C temperatures and offer humidity resistance rated at “10 to 90% r. H. non cond.” They all ship with TPM 2.0 security and the Congatec Board Controller, which offers features like a multi-stage watchdog, power loss control, and hardware health monitoring.

Conga-TC370

Whereas the earlier, Coffee Lake-H based Conga-TS370 adopts the 125 x 95mm COM Express Basic Type 6 form factor, the Conga-TC370 is a 95 x 95 mm Compact Type 6 module. Features include an Intel i219LM GbE controller and interfaces including 3x SATA III, 8x PCIe Gen 3.0, 4x USB 3.1 Gen2, and 8x USB 2.0. There are also LPC, I2C, and 2x UART interfaces.


Conga-TC370 block diagram
(click image to enlarge)
For video, you get 2x DisplayPort 1.2 or HDMI 2.0a ports (or dual DP++), as well as an eDP 1.4. Other features include embedded BIOS boot, update, and security functions and optional active and passive cooling solutions.

Conga-JC370 and Conga-IC370

Aside from the new processor models, the now shipping Conga-JC370 and Conga-IC370 appear to be the same as described in our March coverage. That report offers detailed spec lists and block diagrams.

 
Conga-JC370 (left) and Conga-IC370
(click images to enlarge)
The 146 x 102mm Conga-JC370 appears to be Congatec’s first 3.5-inch SBC. Display features include a DP++ port, with the possibility of a second DP port via the USB 3.1 Gen 2 Type-C port. The Type-C can also draw power as an alternative to the 12-24V DC input. In addition to the standard LVDS or eDP interface, there’s an option for a second LVDS via an adapter.


Conga-JC370 detail view
(click image to enlarge)
One of the 2x GbE ports support TSN. Other features include 2x USB 3.1 Gen 2 ports, an RS232/422/485 port, and internal USB 2.0, serial, GPIO, powered SATA III, and optional CAN interfaces. For expansion, there’s a mini-PCIe slot and micro-SIM slot, as well as an M.2 M-key storage slot with Optane support and general-purpose M.2 B- and E-key slots.

The 170 x 170mm Conga-IC370 thin Mini-ITX board shares several features with the Conga-JC370, including 2x GbE ports, a single USB 3.1 Gen. 2 port, and a 12-24V input. Expansion features are the same except that instead of the M.2 M-key storage socket you get a second SATA III port. The Conga-IC370 also adds a PCIe x4 slot.


Conga-IC370 detail view
(click image to enlarge)
The Conga-IC370 lacks the 3.5-inch model’s Type-C port, but you get dual DP++ ports, LVDS, and eDP. For audio, there’s SPDIF in addition to dual audio jacks. The dual USB 2.0 interfaces have been expressed as coastline ports.

Further information

The Conga-TC370, Conga-JC370, and Conga-IC370 are available now, with pricing undisclosed. More information may be found in Congatec’s 8th Gen UE announcementand the Conga-TC370Conga-JC370, and Conga-IC370 product pages.

This article originally appeared on LinuxGizmos.com on June 12.

Congatec | www.congatec.com

Rugged COMe Board Sports Ryzen Embedded V1000/R1000 SoC

MEN Micro has announced the CB71C, a rugged COM Express module for rail, public transportation and industry applications.  The module is 100% compatible with the COM Express Type 6 pin-out and conforms to the VITA 59 standard, which specifies robust mechanics to ensure reliable operation under the harsh environmental conditions.
The CB71C Rugged COM Express Module can be equipped with the new Ryzen Embedded R1000 SoC in addition to the Ryzen Embedded V1000 SoC. The new AMD Ryzen Embedded R1000 SoC features a Radeon Vega graphics engine with three compute units and support for up to three displays with a resolution of up to 4k without additional graphics hardware. With up to four “Zen” processor cores, when using the AMD Ryzen Embedded V1000 SoC, the CB71C is also suitable for virtualization.

The module provides passive cooling and a temperature range from -40°C to +85°C are possible with the low-power versions. The CB71C can be equipped with up to 32 GB directly soldered DDR4 main memory and a 16 GB eMMC. PCI Express 3.0, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0 are available as high-speed interfaces.

The COM module has a board management controller with monitoring functions and a trusted platform module. The module also uses the Secure Memory Encryption capability in the AMD Ryzen Embedded R1000 SoC. That feature is essential for security-critical applications such as payment and ticketing terminals, fleet management or monitoring, according to MEN Micro.

Features:

  • AMD Ryzen Embedded V1000/R1000 series
  • Up to 32 GB DDR4 RAM with ECC
  • Up to 4 Digital Display Interfaces (DP, eDP, HDMI, DVI)
  • Hardware memory encryption
  • Safety-relevant supervision functions
  • Virtualization
  • Supports up to -40°C to +85°C Tcase, conduction cooling
  • VITA 59 in process, compliant with COM Express Basic, type 6
  • PICMG COM.0 COM Express version also available

MEN Micro | www.menmicro.com

 

Whiskey-Lake U Processor Rides COM Express Type 6 Module

TQ Systems has released a COM Express Compact Type 6 module TQMx80UC based on the 8th generation Intel Core Mobile Processors code named “Whiskey-Lake U”. This module is well suited for industrial controllers, robotics applications, medical devices and point-of-sales. Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 W TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).

The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 GB and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s.

Four high-speed interfaces are available for this purpose. In addition, eMMC flash in sizes between 8 GB and 128 GB is available for the first time on the module. The COM Express Compact Module TQMx80UC with its dimensions of 95 mm x 95 mm and Type 6 pinout conforms to PICMG COM.0 R3.0. It is supported by the new TQ mainboard MB-COME6-3. Together with a 11 mm high heatspreader and a heatsink, the combination of boards results in an effective evaluation platform.

TQ Systems | www.tq-group.com

 

 

COMe Type 7 Card Sports AMD EPYC Embedded 3000 Processor

Congatec has introduced its first Server-on-Module (SoM) with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor offers up to 52% more instructions per clock compared to legacy architectures, according to the company. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, firewall security and VPN technologies—optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI)

Also attractive for edge server deployments is the support of the extended temperature range (-40 to 85 °C) for selected versions and the comprehensive RAS (reliability, availability and serviceability) features common to all versions. Edge applications benefit from the hardware-integrated virtualization and comprehensive security package that includes Secure Boot System, Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV), as well as a secure migration channel between two SEV-capable platforms. Support is also given for IPsec with integrated crypto acceleration. As a consequence, even the server administrator does not have access to such an encrypted Virtual Machine (VM). This is important for the high security required by many edge server services, which must enable multi-vendor applications in Industry 4.0 automation while effectively warding off sabotage attempts by hackers.

The conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs. Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.

Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. Congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP, and can be adapted to customers’ housings, if required. This allows OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system’s cooling capacity. OS support is provided for Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.

Congatec | www.congatec.com

 

Congatec Doubles RAM Support for Server-on-Modules

Congatec has announced that its Intel Atom C3000 processor-based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity. The company is touting this as a new milestone for COM Express Type 7 based designs, because memory is one of the most important performance levers for embedded edge server technologies. This increase was possible because the Intel Atom C3000 family supports the newly available 32 GB SO-DIMMs. The new Server-on-Modules with a high-speed memory bandwidth of 2400 MT/s are available now and can be ordered with and without ECC support.

High memory capacity is essential for server applications, because the fastest way to read and write values from a database is to fully load them into memory, according to Congatec. The larger the databases, the more memory capacity is needed. There are many database applications in the field of embedded edge computing, such as network appliances for content delivery in video surveillance applications, IoT gateways or OPC UA servers in automation.

A large RAM is also a good intermediate buffer for Big Data analytics on the fly so that only smaller results need to be stored. Servers that host many virtual machines also benefit immensely from the doubled memory capacity. With 96 GB RAM, 12 virtual machines now have 8 GB RAM available on each partition, making them well-suited for standard Linux or Windows installations.

The conga-B7AC Server-on-Modules with up to 96 GB RAM can be ordered in the following configurations and include personal integration support for OEMs off the shelf:

Processor Cores Cache [MB] Clock [GHz] TDP [W]  Temperature range
Intel Atom C3958 16 16 2.0 31 0 to +60 °C
Intel Atom C3858 12 12 2.0 25 0 to +60 °C
Intel Atom C3758 8 16 2.2 25 0 to +60 °C
Intel Atom C3558 4 8 2.2 16 0 to +60 °C
Intel Atom C3538 4 8 2.1 15 0 to +60 °C
Intel Atom C3808 12 12 2.0 25 -40 to +85 °C
Intel Atom C3708 8 16 1.7 17 0 to +60 °C
Intel Atom C3508 4 8 1.6 11.5 -40 to +85 °C
Intel Atom C3308 2 4 1.6 2.1 0 to +60 °C

Congatec | www.congatec.com

Quad Core i3-Based Type 6 COM Express Board

ADLINK has announced the addition of the quad-core Intel Core i3-8100H processor to its recently released Express-CF COM Express Basic size Type 6 module based on the 8th Generation Intel Core i5/i7 and Xeon processors (formerly Coffee Lake). The Express-CF/CFE is the first COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel Core and Xeon processor (codename “Coffeelake-H”) with Mobile Intel QM370, HM370, CM246 chipset.

Whereas previous generations Intel Core i3 processors supported only dual cores with 3 MB cache, the Intel Core i3-8100H is the first in its class to support 4 CPU cores with 6 MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel Core i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control.

These Hexa-core processors support up to 12 threads (Intel Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4 GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution. The Express-CF/CFE has up to three SODIMM sockets supporting up to 48 GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2.

Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion.

Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel Optane memory, allowing applications access to the highest speed storage solutions and include a single onboard Gbit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor and watchdog timer.

ADLINK Technology | www.adlinktech.com

COM Express Card Sports 3 GHz Core i3 Processor

Congatec has introduced a Computer-on-Module for the entry-level of high-end embedded computing based on Intel’s latest Core i3-8100H processor platform. The board’s fast 16 PCIe Gen 3.0 lanes make it suited for all new artificial intelligence (AI) and machine learning applications requiring multiple GPUs for massive parallel processing.

The new conga-TS370 COM Express Basic Type 6 Computer-on-Module with quad-core Intel Core i3 8100H processor offers a 45 W TDP configurable to 35 W, supports 6 MB cache and provides up to 32 GB dual-channel DDR4 2400 memory. Compared to the preceding 7th generation of Intel Core processors, the improved memory bandwidth also helps to increase the graphics and GPGPU performance of the integrated new Intel UHD630 graphics, which additionally features an increased maximum dynamic frequency of up to 1.0 GHz for its 24 execution units. It supports up to three independent 4K displays with up to 60 Hz via DP 1.4, HDMI, eDP and LVDS.

Embedded system designers can now switch from eDP to LVDS purely by modifying the software without any hardware changes. The module further provides exceptionally high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel Optane memory. All common Linux operating systems as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are supported. Congatec’s personal integration support rounds off the feature set. Additionally, Congatec also offers an extensive range of accessories and comprehensive technical services, which simplify the integration of new modules into customer-specific solutions.

Congatec | www.congatec.com

Rugged COM Express Type 10 Module Sports Intel Apollo Lake-I

MEN Micro has announced the CM50C, a low-power, compact, Rugged COM Express module that was developed around the Intel Atom E3900 series of processors. Due to the low power consumption, the virtualization support of the processor and the safe board management controller, the module is a multifaceted solution for individual designs in harsh environments and safety-critical applications.

The CM50C is a COM Express Mini module for rolling stock, public transportation and industry applications. It is compatible to COM Express Type 10 Pin-Out and conforms to the VITA 59 standard which specifies the mechanics to ensure reliable operation in harsh environmental conditions. In accordance with the Rugged COM Express standard, the CM50C is embedded in a solid aluminum frame that protects the electronics from environmental influences such as humidity, dust, vibrations or EMC radiation and also enables operation in the extended temperature range from -40 to +85°C via conduction cooling.

Based on the Intel E3900 CPU series with a low power dissipation of 7 W to 16 W, the CM50C provides a scalable performance up to 4 cores and integrated quality graphics. It also offers Intel VT-x virtualization support. This allows to run multiple applications on a single hardware platform, saving physical hardware and costs.

The board management controller provides enhanced reliability, reduced downtime and is certifiable up to SIL 2. With the Trusted Platform Module and the secure/ measured booting features fast cryptographic execution is supported. The CM50C comes with a large variety of interfaces, including, for example, Digital Display Interfaces, HD Audio, PCI Express and Gigabit Ethernet. This enables implementing many functions on a very small form factor.

The processor’s 15 years long-term availability ensures an extended product life and future-safety for a wide range of applications. For less demanding applications, a standard COM Express variant without frame is also available.

Features:

  • Intel Atom E3900 series
  • Up to 8 GB DDR3 RAM with ECC
  • Intel VT-x virtualization support
  • Rugged COM Express Mini (VITA 59 RCE) type 10
  • Trusted Platform Module
  • Board Management Controller (SIL 2 certifiable)
  • Conduction cooling
  • -40°C to +85°C

MEN Micro | www.menmicro.com

COM Express Type 6 Card Sports 8th Gen Core or Xeon Chips

ADLINK has introduced its latest COM Express Type 6 modules. According to the company, Express-CF modules are equipped with the 8th generation Intel Core processor family and Intel Xeon processor E-2100M family, and are the first Type 6 modules to support both Xeon and Core i7 Hexa-core (6-core) CPUs. These Hexa-core processors support up to 12 threads and a turbo boost of up to 4.4 GHz. Compared to earlier mobile quad-core Xeon and Core i7 CPUs, the additional two cores of the new Hexa-core CPUs results in more than 25% performance boost at no significant cost increase.ADLINK’s Express-CF provides standard support for up to 48GB non-ECC DDR4 in three SO-DIMMs (two on the top side, one on the bottom), while complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon Hexa-core processor support both ECC and non-ECC SODIMMs.

With integrated Intel UHD Graphics 630, the Express-CF supports up to three independent 4K displays via DisplayPort, HDMI, DVI and LVDS. ADLINK also offers either eDP or analog VGA as build options by customer request. Additionally, the Express-CF supports Intel Optane memory and NVMe SSDs through high speed PCIe x4 Gen3 interfaces.

ADLINK Technology | www.adlinktech.com

Cellular/Wi-Fi Gateway Targets In-Vehicle Intelligent Systems

Kontron has introduced the EvoTRAC G103 In-Vehicle Rugged Cellular and Wi-Fi Gateway that provides broad connectivity capabilities that enable a new range of in-vehicle management, remote access and cloud-based applications. Providing the mobile connectivity and onboard recording device storage needed for a new generation of more intelligent systems, the EvoTRAC G103 features a WiFi and 4G Advanced Pro+ LTE module, and includes 64 GB eMMC for onboard storage as well as optionalfixed storage capacity.

The EvoTRAC G103 is a flexible open-architecture building block platform that supports fast access to actionable information from its integrated dual Gigabit Ethernet and dual CAN bus interface that supports 2.0 A and B, along with two USB 2.0 interface. With the explosion of data generated by today’s commercial vehicles, implementing a robust gateway such as the EvoTRAC G103 offloads important information operators can use to keep drivers safe, lower fuel consumption and effectively manage maintenance costs.

Tested to survive extreme temperature (-40° C to +80° C) and other demanding on and off-road vehicle conditions (shock, vibration, humidity, salt fog), the EvoTRAC™ G103 Gateway leverages Kontron’s hardened Type 6 COMe E3845 COM Express® CPU module coupled with a ruggedized Carrier Board, all packaged in a natural convection, sealed IP67 enclosure. Extremely rugged and mechanically compact, this gateway is based on the efficient, low-power Intel Atom processor, and incorporates protection from water and dust ingress, as well as CISPR25 emissions and ISO 11452-2 susceptibility.

Kontron | www.kontron.com