Updated COMe Board Sports 9th Gen Intel Processors, 128 GB RAM

Kontron is providing the its COMe-bCL6 COM Express basic Type 6 form factor (125 mm x 95 mm) board equipped with Intel 9th Gen processors. With up to four memory sockets it enables a maximum memory expansion of up to 128 GB. The board is available in different processor versions. All versions can be equipped with up to 128 GB non-ECC/ECC DDR4 memory.

The Intel Optane system accelerator ensures fast data transfer from and to high-capacity mass storage devices. NVMe SSD also supports what is currently the fastest storage technology in a very compact package. Thanks to USB 3.1 support with up to 10 Gbps and USB Type-C support, twice the bandwidth (compared to USB 3.0) can be achieved for fast data transfers.

The COMe-bCL6 is well suited as a successor for existing solutions, because it takes over their pin out and feature implementation. Typical applications include communication, digital signage, professional gaming and entertainment, medical imaging, surveillance and security, industrial edge or server applications, as well as industrial plant, machine and robot control, both at shop floor level and from the control room. The rugged variants of the COMe-bCL6 meet the particular demands of the defense, transportation and avionics sectors by offering an extended feature set and industrial temperature range from -40°C to +85°C.

The COMe-bCL6 supports the Kontron APPROTECT security solution based on Wibu-Systems CodeMeter. In addition, Kontron APPROTECT Licensing enables the realization of new business models such as pay-per-use or time-based test versions.

Kontron | www.kontron.com

Avoid Reinventing the Wheel on Industrial Designs

Software updates are easy to roll out, but hardware upgrades on custom designs often require a major investment of time and money. A modular approach can speed up this process. In this article, congatec’s Dan Demers explains how.

Make slow progress or speed ahead with buy-in?

By Dan Demers, Director of Sales and Marketing – Americas, congatec

We are used to receiving software updates on-the-fly today. So why not utilize converged embedded computing platforms to upgrade our hardware? This would enable us to take direct advantage of the rapid development cycles of the computing, vision and AI industries.

There are plenty of examples on how to upgrade the hardware during running series production. In the medical sector, for instance, where medical devices even require certification. But it appears that some system developers have not yet learned how to consistently build computing core upgrades into their product development.

This is because full custom designs are still quite common. The integration of expensive navigation systems by premium vehicle manufacturers is a bad example of this. Although pretty and expensive, they are often much slower than the driver’s considerably cheaper mobile phone. Before the computer technology that’s installed in the vehicle gets used by the customer, it is usually already obsolete.  Market acceptance for such monolithic solutions is therefore dwindling noticeably.

The problem of these manufacturers is anchored in the design principles of mass production, where every cent matters, but no attention is paid to the innovation cycle demanded by users. This has fatal consequences: If the computing part is entirely custom designed, an upgrade will in many cases require a redesign, where the ability to reuse blocks of the previous generation is limited. So all in all, we’re talking about a major investment to always deploy the latest computer technology in an application.

But there’s another way: To avoid having to reinvent the wheel every time, the Computer-on-Module concept was developed at the end of the 90s. Modular approaches had existed before then, but it is only since the Computer-on-Module concept emerged, that modules stopped being proprietary and became available as standardized components from numerous providers.

congatec offers SFF Computer-on-Modules for all leading standards: SMARC 2.0, Qseven, COM Express Mini and COM Express Compact modules.

Computer-on-Modules are available in different designs. For low-power CPUs such as Intel Atom, AMD G-Series or the ARM i.MX6 and i.MX8 platforms from NXP, the Qseven and SMARC Computer-on-Module standards are particularly suitable. For higher computing power and interface demands, COM Express is the best standard. COM Express Type 6 modules support fast CPUs, like the AMD V1000 or the latest Intel Core processors.

Type 7 was defined for edge server processors and 10 Gbit Ethernet support; however, in true server fashion, it no longer supports any video interfaces. The upcoming PICMG COM-HPC standard will support even faster interfaces. The specification is due to be published in 2019, with first products expected in 2020.

With Server-on-Modules a modular approach is even suitable for the development and constant update of high-performance microservers by just exchanging the modules. This significantly reduce the efforts and cost connected for upgrades.

All in all, Computer-on-Modules are an ideal and easy way to equip machines and devices with the latest processor technology. So anyone who wants to use converged system platforms as part of their closed-loop engineering, will find that Computer-on-Modules are a perfect platform for performance upgrades. However, this doesn’t mean that you shouldn’t implement a full custom design when it comes to mass production. But here too, getting the module supplier to implement a fusion of modules and carrier board works significantly better than the OEM developing everything from scratch.

congatec | www.congatec.com/us

 

Sponsored by: congatec

Whiskey Lake-UE Boards Feature up to 15-year Availability

By Eric Brown

Congatec has launched a “Conga-TC370” COM Express Type 6 and two SBCs — the 3.5-inch “Conga-JC370” and thin Mini-ITX “Conga-IC370” — with new embedded “UE” 8th Gen chips with 10-year plus availability.

At Embedded World in early March, Congatec unveiled 3.5-inch Conga-JC370 and thin Mini-ITX Conga-IC370 SBCs with Intel’s 8th Gen Whiskey Lake U-series processors. Now, the German embedded firm has announced their availability along with a new Conga-TC370 COM Express Compact Type 6 module. The Linux-friendly boards sport Intel’s new embedded-focused UE versions of the chips, featuring 10-year plus availability.


Congatec’s 8th Gen UE-series lineup (left to right): Conga-IC370, Conga-JC370, and Conga-TC370
(click image to enlarge)
This is the first we’ve heard of the Whiskey Lake UE models, which do not appear to be publicly documented. The processors appear to be otherwise identical with the 8th Gen U-series.

Congatec claims its new boards “are the first in the industry to offer long-term availability of 10+ years.” The boards offer “10+ and on basis of specific last time buy contract up to 15 years long-term availability right from the start,” stated Christian Eder, Congatec Director of Marketing. He noted that most embedded boards offer 7-year availability, which is insufficient for the transportation and mobility sector, as well as many medical devices, industrial controls, embedded edge clients, and HMI systems. Congatec’s 8th Gen Coffee Lake-H based Conga-TS370 Type 6 module goes longer than that, but is still limited to “up to” 10-year availability.

The new Congatec boards run Linux, Windows 10, or Win 10 IoT Enterprise on the following processors:

  • Core i5-8365UE (4x cores @ 1.6GHz, 6MB cache, 15W)
  • Core i7-8665UE (4x cores @ 1.7GHz, 8MB cache, 15W)
  • Core i3-8145UE (2x cores @ 2.2GHz, 4MB cache, 15W)
  • Celeron 4305UE (2x cores @ 2.0GHz, 2MB cache, 15W)

Congatec touts the quad-core i7 and i5 Whiskey Lake chips for their performance boost of up to 58 percent compared to previous U-Series processors. ASll the Whiskey Lake CPUs have an “improved microarchitecture” and provide “efficient task scheduling,” says the company. They also support RTS hypervisor software “to allow additional optimization of I/O throughput from the input channels to the processor cores.”

The 24-EU Intel Gen9 HD graphics supports OpenCL 2.1, OpenGL 4.5 and DirectX12, as well as hardware MPEG-2 or WMV9 (VC-1) decode and H.265 (HEVC) support. All three of the Congatec boards support up to 3x independent 60Hz UHD displays with up to 4096 x 2304 resolution.

 
Conga-TC370, front and back
(click images to enlarge)
Common features among the Conga-TC370, Conga-JC370, and Conga-IC370 include support for up to 64GB DDR4-2400 via dual channels. They all provide native USB 3.1 Gen 2 for transfer rates of 10Gbps and offer Gigabit Ethernet with TSN (Time-Sensitive Networking) real-time support.

The new boards support 0 to 60°C temperatures and offer humidity resistance rated at “10 to 90% r. H. non cond.” They all ship with TPM 2.0 security and the Congatec Board Controller, which offers features like a multi-stage watchdog, power loss control, and hardware health monitoring.

Conga-TC370

Whereas the earlier, Coffee Lake-H based Conga-TS370 adopts the 125 x 95mm COM Express Basic Type 6 form factor, the Conga-TC370 is a 95 x 95 mm Compact Type 6 module. Features include an Intel i219LM GbE controller and interfaces including 3x SATA III, 8x PCIe Gen 3.0, 4x USB 3.1 Gen2, and 8x USB 2.0. There are also LPC, I2C, and 2x UART interfaces.


Conga-TC370 block diagram
(click image to enlarge)
For video, you get 2x DisplayPort 1.2 or HDMI 2.0a ports (or dual DP++), as well as an eDP 1.4. Other features include embedded BIOS boot, update, and security functions and optional active and passive cooling solutions.

Conga-JC370 and Conga-IC370

Aside from the new processor models, the now shipping Conga-JC370 and Conga-IC370 appear to be the same as described in our March coverage. That report offers detailed spec lists and block diagrams.

 
Conga-JC370 (left) and Conga-IC370
(click images to enlarge)
The 146 x 102mm Conga-JC370 appears to be Congatec’s first 3.5-inch SBC. Display features include a DP++ port, with the possibility of a second DP port via the USB 3.1 Gen 2 Type-C port. The Type-C can also draw power as an alternative to the 12-24V DC input. In addition to the standard LVDS or eDP interface, there’s an option for a second LVDS via an adapter.


Conga-JC370 detail view
(click image to enlarge)
One of the 2x GbE ports support TSN. Other features include 2x USB 3.1 Gen 2 ports, an RS232/422/485 port, and internal USB 2.0, serial, GPIO, powered SATA III, and optional CAN interfaces. For expansion, there’s a mini-PCIe slot and micro-SIM slot, as well as an M.2 M-key storage slot with Optane support and general-purpose M.2 B- and E-key slots.

The 170 x 170mm Conga-IC370 thin Mini-ITX board shares several features with the Conga-JC370, including 2x GbE ports, a single USB 3.1 Gen. 2 port, and a 12-24V input. Expansion features are the same except that instead of the M.2 M-key storage socket you get a second SATA III port. The Conga-IC370 also adds a PCIe x4 slot.


Conga-IC370 detail view
(click image to enlarge)
The Conga-IC370 lacks the 3.5-inch model’s Type-C port, but you get dual DP++ ports, LVDS, and eDP. For audio, there’s SPDIF in addition to dual audio jacks. The dual USB 2.0 interfaces have been expressed as coastline ports.

Further information

The Conga-TC370, Conga-JC370, and Conga-IC370 are available now, with pricing undisclosed. More information may be found in Congatec’s 8th Gen UE announcementand the Conga-TC370Conga-JC370, and Conga-IC370 product pages.

This article originally appeared on LinuxGizmos.com on June 12.

Congatec | www.congatec.com

Rugged COMe Board Sports Ryzen Embedded V1000/R1000 SoC

MEN Micro has announced the CB71C, a rugged COM Express module for rail, public transportation and industry applications.  The module is 100% compatible with the COM Express Type 6 pin-out and conforms to the VITA 59 standard, which specifies robust mechanics to ensure reliable operation under the harsh environmental conditions.
The CB71C Rugged COM Express Module can be equipped with the new Ryzen Embedded R1000 SoC in addition to the Ryzen Embedded V1000 SoC. The new AMD Ryzen Embedded R1000 SoC features a Radeon Vega graphics engine with three compute units and support for up to three displays with a resolution of up to 4k without additional graphics hardware. With up to four “Zen” processor cores, when using the AMD Ryzen Embedded V1000 SoC, the CB71C is also suitable for virtualization.

The module provides passive cooling and a temperature range from -40°C to +85°C are possible with the low-power versions. The CB71C can be equipped with up to 32 GB directly soldered DDR4 main memory and a 16 GB eMMC. PCI Express 3.0, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.0 are available as high-speed interfaces.

The COM module has a board management controller with monitoring functions and a trusted platform module. The module also uses the Secure Memory Encryption capability in the AMD Ryzen Embedded R1000 SoC. That feature is essential for security-critical applications such as payment and ticketing terminals, fleet management or monitoring, according to MEN Micro.

Features:

  • AMD Ryzen Embedded V1000/R1000 series
  • Up to 32 GB DDR4 RAM with ECC
  • Up to 4 Digital Display Interfaces (DP, eDP, HDMI, DVI)
  • Hardware memory encryption
  • Safety-relevant supervision functions
  • Virtualization
  • Supports up to -40°C to +85°C Tcase, conduction cooling
  • VITA 59 in process, compliant with COM Express Basic, type 6
  • PICMG COM.0 COM Express version also available

MEN Micro | www.menmicro.com

 

Whiskey-Lake U Processor Rides COM Express Type 6 Module

TQ Systems has released a COM Express Compact Type 6 module TQMx80UC based on the 8th generation Intel Core Mobile Processors code named “Whiskey-Lake U”. This module is well suited for industrial controllers, robotics applications, medical devices and point-of-sales. Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 W TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).

The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 GB and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s.

Four high-speed interfaces are available for this purpose. In addition, eMMC flash in sizes between 8 GB and 128 GB is available for the first time on the module. The COM Express Compact Module TQMx80UC with its dimensions of 95 mm x 95 mm and Type 6 pinout conforms to PICMG COM.0 R3.0. It is supported by the new TQ mainboard MB-COME6-3. Together with a 11 mm high heatspreader and a heatsink, the combination of boards results in an effective evaluation platform.

TQ Systems | www.tq-group.com

 

 

COMe Type 7 Card Sports AMD EPYC Embedded 3000 Processor

Congatec has introduced its first Server-on-Module (SoM) with AMD embedded server technology. The new conga-B7E3 Server-on-Module with AMD EPYC Embedded 3000 processor offers up to 52% more instructions per clock compared to legacy architectures, according to the company. Use cases include Industry 4.0, smart robot cells with collaborative robotics, autonomous robotic and logistics vehicles, as well as virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, firewall security and VPN technologies—optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI)

Also attractive for edge server deployments is the support of the extended temperature range (-40 to 85 °C) for selected versions and the comprehensive RAS (reliability, availability and serviceability) features common to all versions. Edge applications benefit from the hardware-integrated virtualization and comprehensive security package that includes Secure Boot System, Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV), as well as a secure migration channel between two SEV-capable platforms. Support is also given for IPsec with integrated crypto acceleration. As a consequence, even the server administrator does not have access to such an encrypted Virtual Machine (VM). This is important for the high security required by many edge server services, which must enable multi-vendor applications in Industry 4.0 automation while effectively warding off sabotage attempts by hackers.

The conga-B7E3 COM Express Type 7 modules are equipped with AMD EPYC Embedded 3000 processors with 4, 8, 12, or 16 high-performance cores, support simultaneous multi-threading (SMT) and up to 96 GB of DDR4 2666 RAM in the COM Express Basic form factor and up to 1TB in full custom designs. Measuring just 125 x 95 mm, the COM Express Basic Type 7 module supports up 4x 10 GbE and up to 32 PCIe Gen 3 lanes. For storage the module even integrates an optional 1 TB NVMe SSD and offers 2x SATA Gen 3.0 ports for conventional drives.

Further interfaces include 4x USB 3.1 Gen 1, 4x USB 2.0 as well as 2x UART, GPIO, I2C, LPC and SPI. Attractive features also include seamless support of dedicated high-end GPUs and improved floating-point performance, which is essential for emerging AI and HPC applications. Congatec also offers advanced cooling solutions for its COM Express Type 7 Server-on-Modules that match the processor, support fanless cooling even beyond 65 W TDP, and can be adapted to customers’ housings, if required. This allows OEMs to integrate maximum processor performance into their designs, as performance is often limited by the system’s cooling capacity. OS support is provided for Linux and Yocto, as well as Microsoft Windows 10 and Windows Server.

Congatec | www.congatec.com

 

Congatec Doubles RAM Support for Server-on-Modules

Congatec has announced that its Intel Atom C3000 processor-based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity. The company is touting this as a new milestone for COM Express Type 7 based designs, because memory is one of the most important performance levers for embedded edge server technologies. This increase was possible because the Intel Atom C3000 family supports the newly available 32 GB SO-DIMMs. The new Server-on-Modules with a high-speed memory bandwidth of 2400 MT/s are available now and can be ordered with and without ECC support.

High memory capacity is essential for server applications, because the fastest way to read and write values from a database is to fully load them into memory, according to Congatec. The larger the databases, the more memory capacity is needed. There are many database applications in the field of embedded edge computing, such as network appliances for content delivery in video surveillance applications, IoT gateways or OPC UA servers in automation.

A large RAM is also a good intermediate buffer for Big Data analytics on the fly so that only smaller results need to be stored. Servers that host many virtual machines also benefit immensely from the doubled memory capacity. With 96 GB RAM, 12 virtual machines now have 8 GB RAM available on each partition, making them well-suited for standard Linux or Windows installations.

The conga-B7AC Server-on-Modules with up to 96 GB RAM can be ordered in the following configurations and include personal integration support for OEMs off the shelf:

Processor Cores Cache [MB] Clock [GHz] TDP [W]  Temperature range
Intel Atom C3958 16 16 2.0 31 0 to +60 °C
Intel Atom C3858 12 12 2.0 25 0 to +60 °C
Intel Atom C3758 8 16 2.2 25 0 to +60 °C
Intel Atom C3558 4 8 2.2 16 0 to +60 °C
Intel Atom C3538 4 8 2.1 15 0 to +60 °C
Intel Atom C3808 12 12 2.0 25 -40 to +85 °C
Intel Atom C3708 8 16 1.7 17 0 to +60 °C
Intel Atom C3508 4 8 1.6 11.5 -40 to +85 °C
Intel Atom C3308 2 4 1.6 2.1 0 to +60 °C

Congatec | www.congatec.com

Quad Core i3-Based Type 6 COM Express Board

ADLINK has announced the addition of the quad-core Intel Core i3-8100H processor to its recently released Express-CF COM Express Basic size Type 6 module based on the 8th Generation Intel Core i5/i7 and Xeon processors (formerly Coffee Lake). The Express-CF/CFE is the first COM Express COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel Core and Xeon processor (codename “Coffeelake-H”) with Mobile Intel QM370, HM370, CM246 chipset.

Whereas previous generations Intel Core i3 processors supported only dual cores with 3 MB cache, the Intel Core i3-8100H is the first in its class to support 4 CPU cores with 6 MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel Core i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control.

These Hexa-core processors support up to 12 threads (Intel Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4 GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution. The Express-CF/CFE has up to three SODIMM sockets supporting up to 48 GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon processor and CM246 Chipset support both ECC and non-ECC SODIMMs.

Integrated Intel Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full H.265/HEVC 10-bit, MPEG2 hardware codec. In addition, High Dynamic Range is supported for enhanced picture color and quality and digital content protection has been upgraded to HDCP 2.2.

Graphics outputs include LVDS and three DDI ports supporting HDMI/DVI/DisplayPort and eDP/VGA as a build option. The Express-CF/CFE is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time. In addition to the onboard integrated graphics, a multiplexed PCIe x16 graphics bus is available for discrete graphics expansion.

Input/output features include eight PCIe Gen3 lanes that can be used for NVMe SSD and Intel Optane memory, allowing applications access to the highest speed storage solutions and include a single onboard Gbit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, hardware monitor and watchdog timer.

ADLINK Technology | www.adlinktech.com

COM Express Card Sports 3 GHz Core i3 Processor

Congatec has introduced a Computer-on-Module for the entry-level of high-end embedded computing based on Intel’s latest Core i3-8100H processor platform. The board’s fast 16 PCIe Gen 3.0 lanes make it suited for all new artificial intelligence (AI) and machine learning applications requiring multiple GPUs for massive parallel processing.

The new conga-TS370 COM Express Basic Type 6 Computer-on-Module with quad-core Intel Core i3 8100H processor offers a 45 W TDP configurable to 35 W, supports 6 MB cache and provides up to 32 GB dual-channel DDR4 2400 memory. Compared to the preceding 7th generation of Intel Core processors, the improved memory bandwidth also helps to increase the graphics and GPGPU performance of the integrated new Intel UHD630 graphics, which additionally features an increased maximum dynamic frequency of up to 1.0 GHz for its 24 execution units. It supports up to three independent 4K displays with up to 60 Hz via DP 1.4, HDMI, eDP and LVDS.

Embedded system designers can now switch from eDP to LVDS purely by modifying the software without any hardware changes. The module further provides exceptionally high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel Optane memory. All common Linux operating systems as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are supported. Congatec’s personal integration support rounds off the feature set. Additionally, Congatec also offers an extensive range of accessories and comprehensive technical services, which simplify the integration of new modules into customer-specific solutions.

Congatec | www.congatec.com

Rugged COM Express Type 10 Module Sports Intel Apollo Lake-I

MEN Micro has announced the CM50C, a low-power, compact, Rugged COM Express module that was developed around the Intel Atom E3900 series of processors. Due to the low power consumption, the virtualization support of the processor and the safe board management controller, the module is a multifaceted solution for individual designs in harsh environments and safety-critical applications.

The CM50C is a COM Express Mini module for rolling stock, public transportation and industry applications. It is compatible to COM Express Type 10 Pin-Out and conforms to the VITA 59 standard which specifies the mechanics to ensure reliable operation in harsh environmental conditions. In accordance with the Rugged COM Express standard, the CM50C is embedded in a solid aluminum frame that protects the electronics from environmental influences such as humidity, dust, vibrations or EMC radiation and also enables operation in the extended temperature range from -40 to +85°C via conduction cooling.

Based on the Intel E3900 CPU series with a low power dissipation of 7 W to 16 W, the CM50C provides a scalable performance up to 4 cores and integrated quality graphics. It also offers Intel VT-x virtualization support. This allows to run multiple applications on a single hardware platform, saving physical hardware and costs.

The board management controller provides enhanced reliability, reduced downtime and is certifiable up to SIL 2. With the Trusted Platform Module and the secure/ measured booting features fast cryptographic execution is supported. The CM50C comes with a large variety of interfaces, including, for example, Digital Display Interfaces, HD Audio, PCI Express and Gigabit Ethernet. This enables implementing many functions on a very small form factor.

The processor’s 15 years long-term availability ensures an extended product life and future-safety for a wide range of applications. For less demanding applications, a standard COM Express variant without frame is also available.

Features:

  • Intel Atom E3900 series
  • Up to 8 GB DDR3 RAM with ECC
  • Intel VT-x virtualization support
  • Rugged COM Express Mini (VITA 59 RCE) type 10
  • Trusted Platform Module
  • Board Management Controller (SIL 2 certifiable)
  • Conduction cooling
  • -40°C to +85°C

MEN Micro | www.menmicro.com

COM Express Type 6 Card Sports 8th Gen Core or Xeon Chips

ADLINK has introduced its latest COM Express Type 6 modules. According to the company, Express-CF modules are equipped with the 8th generation Intel Core processor family and Intel Xeon processor E-2100M family, and are the first Type 6 modules to support both Xeon and Core i7 Hexa-core (6-core) CPUs. These Hexa-core processors support up to 12 threads and a turbo boost of up to 4.4 GHz. Compared to earlier mobile quad-core Xeon and Core i7 CPUs, the additional two cores of the new Hexa-core CPUs results in more than 25% performance boost at no significant cost increase.ADLINK’s Express-CF provides standard support for up to 48GB non-ECC DDR4 in three SO-DIMMs (two on the top side, one on the bottom), while complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon Hexa-core processor support both ECC and non-ECC SODIMMs.

With integrated Intel UHD Graphics 630, the Express-CF supports up to three independent 4K displays via DisplayPort, HDMI, DVI and LVDS. ADLINK also offers either eDP or analog VGA as build options by customer request. Additionally, the Express-CF supports Intel Optane memory and NVMe SSDs through high speed PCIe x4 Gen3 interfaces.

ADLINK Technology | www.adlinktech.com

Cellular/Wi-Fi Gateway Targets In-Vehicle Intelligent Systems

Kontron has introduced the EvoTRAC G103 In-Vehicle Rugged Cellular and Wi-Fi Gateway that provides broad connectivity capabilities that enable a new range of in-vehicle management, remote access and cloud-based applications. Providing the mobile connectivity and onboard recording device storage needed for a new generation of more intelligent systems, the EvoTRAC G103 features a WiFi and 4G Advanced Pro+ LTE module, and includes 64 GB eMMC for onboard storage as well as optionalfixed storage capacity.

The EvoTRAC G103 is a flexible open-architecture building block platform that supports fast access to actionable information from its integrated dual Gigabit Ethernet and dual CAN bus interface that supports 2.0 A and B, along with two USB 2.0 interface. With the explosion of data generated by today’s commercial vehicles, implementing a robust gateway such as the EvoTRAC G103 offloads important information operators can use to keep drivers safe, lower fuel consumption and effectively manage maintenance costs.

Tested to survive extreme temperature (-40° C to +80° C) and other demanding on and off-road vehicle conditions (shock, vibration, humidity, salt fog), the EvoTRAC™ G103 Gateway leverages Kontron’s hardened Type 6 COMe E3845 COM Express® CPU module coupled with a ruggedized Carrier Board, all packaged in a natural convection, sealed IP67 enclosure. Extremely rugged and mechanically compact, this gateway is based on the efficient, low-power Intel Atom processor, and incorporates protection from water and dust ingress, as well as CISPR25 emissions and ISO 11452-2 susceptibility.

Kontron | www.kontron.com

Tiny Apollo Lake Module Targets Factory Automation

By Eric Brown

The NanoCOM-APL is an Apollo Lake upgrade for customers of Aaeon’s similarly COM Express Type 10 Mini form-factor NanoCOM-BT module, which runs on a Bay Trail Atom E3800 SoC. No OS support was listed for the factory automation targeted NanoCOM-APL, but we assume that like the NanoCOM-BT, it runs Linux, as well as Windows.


 
NanoCOM-APL, front and back
(click images to enlarge)

Three Intel Apollo Lake SoCs are available: the quad-core Pentium N4200 and Atom E3950 and the dual-core Celeron N3350. The Pentium and Atom SKUs ship standard with 4 GB LPDDR4, and the Celeron model has 2 GB. Yet, Aaeon also lists a maximum capacity of 8 GB LPDDR4. The only other difference between the SKUs is that the Atom-based model is the only one with 32 GB eMMC 5.0 storage, with an option for up to 64 GB.

The relatively low TDPs of the Atom SoCs compared to other x86 processors enables power consumption of as little as 7 W for the Celeron module, says Aaeon. (The Atom E3950 model runs at up to 12 W.)

The low power consumption enables “hand-held, battery powered devices and fully enclosed IP67 applications,” says Aaeon, One early customer is already using the module combined with an FPGA and an AI chip for a machine vision system that can scan products to “create 3D images that can be checked for faults,” says the company. The vision system be integrated within a production line or a robotic arm.


 
NanoCOM-APL and block diagram
(click images to enlarge)

The NanoCOM-APL module is equipped with an Intel I210IT GbE controller with WoL, and offers dual SATA II interfaces. The Intel HD Graphics Gen9 drives an 18/24-bit single-channel LVDS interface (or optional eDP) plus a DDI connector that supports DDI, LCD/eDP, or LVDS. In the press release, Aaeon promotes the module’s dual MIPI-CSI interfaces. However, there’s no evidence for this on the product page, datasheet, or block diagram.

The NanoCOM-APL supports 2x USB 3.0, 8x USB 2.0, 2x TX/RX serial, and an HD audio interface. You also get 8-bit GPIO, I2C, LPC Bus, SMBus, and PCIe, which can be configured as PCIe x4 or 3x PCIe x1.

Like the NanoCOM-BT, the 84 x 55mm module is available in 0 to 60˚C and -40 to 85˚C models. A watchdog is standard, and a heatspreader and CPU cooler are optional. There’s a 12V power input with optional 5V, with both supporting AT and ATX.



ECB-920A carrier board detail view
(click image to enlarge)

The NanoCOM-APL supports the same Aaeon ECB-920A carrier board as the earlier NanoCOM-BT. Coastline ports include dual USB 3.0, dual USB 2.0, dual DisplayPort, and VGA, GbE, and audio. The ECB-920A also provides 5x PCIe x1 slots, as well as PCIe x4, PCIe x16, and mini-PCIe slots. Four SATA ports, dual serial ports, an I2C interface, and a debug port are also on board.

Further information

No pricing or availability information was provided for the NanoCOM-APL module. More information may be found at Aaeon’s NanoCOM-APL product page.

This article originally appeared on LinuxGizmos.com on June 12.

Aaeon | www.aaeon.com

COM Express Board Sports Intel 8th Gen Processors

Avnet Integrated Solutions (MSC Technologies) has introduced a COM Express module (MSC C6B-CFLH) that features Intel Core-i7, Core-i5 and Xeon processors. They are designed to provide more processing power for target applications like medical, gaming, in-broadcasting and also in-media production equipment, video surveillance, traffic enforcement and for toll collect systems. Based on the newly-announced 8th generation Intel Core processors, codenamed “Coffee Lake”, Intel’s new generation introduces six core processors and delivers considerably higher computing and graphics performance but at a similar power dissipation level to the previous 7th generation.

Engineering samples of the COM Express module (MSC C6B-CFLH) will be available in the 2nd quarter 2018 from Avnet Integrated Solutions. Like similar products, these new modules with Intel’s 8th generation Core processors come with a 15-year lifecycle from the date of introduction, and are designed and produced in Germany.

Technical Specifications

The MSC C6B-CFLH Type 6 COM Express modules in the “Basic” form factor of 125 mm x 95 mm round off the top end of the MSC product portfolio. The boards are offered with three processor variants: Intel Core i7-8850H with 6 CPU cores / 12 threads, i5-8400H with 4 CPU cores / 8 threads, and Intel Xeon E-2176M with 6 CPU cores / 12 threads. A total of up to 32Gbytes of DDR4-2666 DRAM can be inserted in the two SO-DIMM memory module slots on the modules.

For the Xeon-based module, security-enhanced ECC memory is supported by the use of corresponding ECC memory modules. The maximum power consumption of the modules falls between 35 W and 55 W depending on the usage model. The high-end processor boards operate between 0 and 60 °C. The processors integrate the powerful Intel UHD Graphics, and they are accompanied by the Intel QM370 or C246 Chipsets (PCH).

The integrated graphics controller allows triple independent display of max. 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. DirectX 11.3/12 are supported as well as Open CL 1.2/2.0/2.1 and OpenGL 4.3/4.4/4.5. The COM Express modules feature 3x DisplayPort/HDMI/DVI outputs as well as eDP/LVDS, 8x PCI Express Gen 3 x1 lanes and one PEG x16 Gen 3 interface. 4x SATA 6Gb/s, 4x USB 3.0 Gen 1 and 4x USB 2.0 are available plus the TPM 2.0 device for security and encryption.

MSC Technologies / Avnet Integrated | www.msc-technologies.eu

Intel Coffee Lake H-Series Debut Processors Debut in Congatec and Seco Modules

By Eric Brown

Intel has rolled out new H-, M-, U- and T-series Intel Core and Xeon chips, expanding its line of 14 nm fabricated, 8th Gen Core Kaby Lake Refresh processors, code-named “Coffee Lake.” Of special interest are four new dual- and quad-core U-series chips with up to 2.7 GHz clock rates and 28 W TDPs, as well as four quad- and hexa-core H-series Core i5 and i7 processors and a pair of hexa-core M-series Xeon chips, all with 45 W TDP (total dissipated power).

Congatec Conga-TS370 (top) and Seco COMe-C08-BT6 (bottom) (click images to enlarge)

The hexa-core Core i7-8850H, quad-core Core i5-8400H, and hexa-core Xeon E-2176M are appearing in a pair of 125 mm x 95 mm COM Express Basic Type 6 announced by Congatec and Seco. Both the Conga-TS370 and Seco’s COMe-C08-BT6 are available with Linux or Windows 10, and support 0 to 60°C temperatures (see farther below).

Intel’s 8th Gen M- and H-series processors (click image to enlarge)

Intel launched its first round of 8th-Gen Kaby Lake Refresh “Coffee Lake” chips back in September. This fourth generation of its 14 nm fabricated Core chips — following Broadwell, Skylake, and Kaby Lake — offers relatively modest performance and power efficiency improvements.Like most of AMD’s new Ryzen Embedded V1000 SoCs, most of the Coffee Lake processors are double threaded, so four cores give you eight threads and six cores give you 12. The exception is a line of standard, desktop-oriented T-series chips with 35 W TDPs. The T-series models are all single-threaded except the top-of-the-line, hexa-core Core i7-8700T, clocked to 2.4 GHz /4.0 GHz.

Intel’s latest batch of U-series (top) and new T-series CPUs (bottom)
(click images to enlarge)

The latest batch of U-series processors give you more speed, but higher 28 W TDPs than the original batch. The initial U-series chips, which were used in recent Linux-based laptops from System76 and ZaReason, provide slightly faster quad- instead of dual-core designs with the same price and 15 W TDP as 7th-Gen “Kaby Lake” models. The first round of Coffee Lake chips also included some high-end models tuned to gaming, as well as the first hexa-core Core i5 and first quad-core Core i3 models.

Also today, Intel unveiled a new line of 300-series I/O chipsets that are based on the upcoming Cannon Lake PCH. The lineup includes a Q370 model that supports up to 6x USB 3.1 Gen2 ports, up to 24x PCIe 3.0 lanes, and Intel Wireless-AC for faster 802.11ac.

Intel’s original line of 8th Gen CPUs (top) and new 300-series I/O chipsets (bottom) (click images to enlarge)Intel added to the Coffee Lake parade with some gaming focused G-series chips that use a Radeon Vega GPU from rival AMD. The Core i7-8809G, which can be overclocked, as well as the fixed rate Core i7-8705G, are available in Intel NUC mini-PCs.Today’s media coverage emphasized Intel’s first mobile version of its gaming-oriented Core i9 design. The hexa-core Core i9-8950HK CPU uses thermal velocity boost” technology to jump from 2.9 GHz to 4.8 GHz.

The related H- and M-series processors used by Seco and Congatec include the Core i7-8850H, the fastest of the two hexa-core Core i7 models with 2. 6GHz /4.3 GHz performance. The i7-8850H offers a 9MB Intel Smart Cache and supports “partial” overclocking. The Core i5-8400H is the fastest of the two quad-core i5 models, with 2.5 GHz /4.2 GHz performance and an 8MB cache. The hexa-core, 2.7 GH z/4.4 GHz Xeon E-2176M with 12 MB cache is the slower of the two Xeon M-series chips. (The turbo speeds can only be achieved by one core at a time.)

All the models used by Congatec and Seco offer 45W TDPs and support Intel Optane memory and Intel VPro technology. As with other Coffee Lake processors, there are software patches to protect against Meltdown and Spectre vulnerabilities. However, a hardware fix will await the 10nm Cannon Lake generation.

The three models used by the Conga-TS370 and COMe-C08-BT6 modules are the:

  • Intel Core i7-8850H (6x 12-thread 14nm Coffee Lake cores at 2.6 GHz /4.3 GHz); 9 MB Cache, 45W TDP (35W cTDP)
  • Intel Core i5-8400H 4x 8-thread 14 nm Coffee Lake cores at 2.5 GHz /4.2 GHz); 8 MB Cache, 45W TDP (35W cTDP)
  • Intel Xeon E-2176M, 8850H (6x 12-thread 14 nm Coffee Lake cores at 2.7 GHz /4.4 GHz); 9 MB Cache, 45 W TDP (35W cTDP)

Intel claims that the six-core H-series and M-series modules offer between 45 to 50 percent more multi-thread and 15 to 25 percent more single-thread performance compared to 7th Gen “Kaby Lake” Core processors. The built-in Intel Gen9 LP graphics can manage up to 3x independent displays at once, with a resolution up to 4096 x 2304 at 60 Hz, 24 bpp. There’s support for DirectX 12 and OpenGL 4.5, as well as an H.265 / HEVC hardware transcoder.

Conga-TS370

Like Congatec’s 6th Gen Skylake based Conga-TS170 and 7th Gen Kaby Lake powered Conga-TS175, the Conga-TS370 uses the COM Express Type 6 Basic form factor. All common Linux operating systems, as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are supported.

 

Conga-TS370 block diagram
(click image to enlarge)

The module offers up to 10-year availability, and targets applications including “high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores,” says Congatec.Thanks to the Coffee Lake-H chips, the module supports Intel Optane memory, as well as Intel Software Guard extensions, Trusted Execution Engine, and Intel Platform Trust Technology. The Core processors use the new Intel PCH-H QM370 Series I/O chipset while the Xeon is paired with a CM246 Series controller.

You can load up to 32GB of  DDR4-2666 memory via dual sockets with optional ECC. There are 4x SATA III interfaces, as well as an Intel i219-LM GbE controller with AMT 12.0 support. Expansion features include a PEG x16 Gen3 interface and 8x PCIe Gen 3.0 lanes.

The integrated Intel UHD630 graphics supports up to three independent 4K displays via HDMI 1.4a, eDP 1.4, and DisplayPort 1.2. Dual-channel LVDS is also available as an alternative to eDP, and for the first time, you can switch between eDP to LVDS by software alone, says Congatec.

The highlighted feature enabled by Coffee Lake-H is its support for up to 4x USB 3.1 Gen 2 ports, which operate at up to 10 Gbps. The module also includes 8x USB 2.0 interfaces.

The Conga-TS370 is further equipped with LPC, I2C, SMBus, GPIO, SDIO, and dual UARTs. There’s also an HD Audio interface, TPM 2.0, and ACPI 4.0 with battery support. The Congatec Board Controller provides features including watchdog, non-volatile user storage, and backlight control.

Support services are available, along with a range of accessories and standardized or customized carrier boards and systems. A Conga-Teva2 carrier is in the works but is not yet documented.

COMe-C08-BT6

Seco’s COMe-C08-BT6 module, which follows it similarly Type 6, 6th Gen Skylake based COMe-B09-BT6, is designed for applications including gaming, signage, infotainment, HMI, biomedical devices, Industry 4.0, automation, and telco. There’s support for 64-bit Linux and Windows 10.

 

COMe-C08-BT6
(click image to enlarge)

Not surprisingly, the feature set is very similar to that of the Conga-TS370. You get up to 3 2GB of DDR4-2666 with ECC, 4x SATA 3.0 channels, and an Intel i219-LM GbE controller.The COMe-C08-BT6 has the same triple display and 4K support as the Congatec model. In this case you get DP, HDMI, and DVI DDI interfaces, as well as a choice of eDP, LVDS, or LVDS + VGA interfaces. HD Audio is also available.

Like the Conga-TS370, there are 4x USB 3.1 Gen 2 interfaces, 8x USB 2.0 links, a PEG x16 Gen3 interface, and 8x PCIe Gen 3.0 lanes. Other features include 2x UARTs, as well as SPI, I2C, SMBus, LPC, and GPIO. You also get a watchdog, optional TPM 2.0, thermal and fan management signals, and 12 V or optional 5 V DC input.

CCOMe-965 carrier (top) and block diagram (bottom)
(click images to enlarge)The COMe-C08-BT6 is available with Seco’s CCOMe-965 Mini-ITX carrier board, which also supports other Seco Type 6 modules such as the COMe-B09-BT6 and Ryzen V1000 based COMe-B75-CT6. There’s also a Cross Platform Development Kit that includes the CCOMe-965, along with HDMI and DisplayPort cables, and is said to support ARM-based Type 6 COMs in addition to x86.

CCOMe-C30 carrier (top) and block diagram (bottom)
(click images to enlarge)One final development option is an upcoming, 3.5-inch form factor CCOMe-C30 board that features a DP++ port, 2x mini-DP++ ports, and LVDS and eDP connections. The 146 mm x 102 mm board has dual M.2 sockets, dual GbE ports, and SATA and microSD slots. You also get 2x USB 3.0 and 2x USB 2.0 ports, plus 4x serial headers, among other features.Further information

No pricing or availability information was provided for the Congatec Conga-TS370 or Seco COMe-C08-BT6 Type 6 modules. More on Congatec’s Conga-TS370 module may be found in the Conga-TS370 announcement and product pages.

More on Seco’s COMe-C08-BT6 may be found on the COMe-C08-BT6 product page.

Intel’s latest Intel Coffee Lake processors should start shipping in volume by the end of the month. More information may be found on Intel’s 8th Gen Intel Core announcement page.

This article originally appeared on LinuxGizmos.com on April 3.

Congatec | www.congtatec.com

Seco | www.seco.com