Whiskey-Lake U Processor Rides COM Express Type 6 Module

TQ Systems has released a COM Express Compact Type 6 module TQMx80UC based on the 8th generation Intel Core Mobile Processors code named “Whiskey-Lake U”. This module is well suited for industrial controllers, robotics applications, medical devices and point-of-sales. Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 W TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).

The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 GB and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s.

Four high-speed interfaces are available for this purpose. In addition, eMMC flash in sizes between 8 GB and 128 GB is available for the first time on the module. The COM Express Compact Module TQMx80UC with its dimensions of 95 mm x 95 mm and Type 6 pinout conforms to PICMG COM.0 R3.0. It is supported by the new TQ mainboard MB-COME6-3. Together with a 11 mm high heatspreader and a heatsink, the combination of boards results in an effective evaluation platform.

TQ Systems | www.tq-group.com

 

 

COM Express Type 6 Card Sports AMD Ryzen V1000

Congatec has introduced the conga-TR4 COM Express Type 6 module based on the new AMD Ryzen Embedded V1000 processors. AMD Ryzen Embedded V1000 processors deliver up to 3X more GPU performance than competitive solutions, and up to 2X increase in performance over previous generations . With a TDP that is scalable from 12 W to 54 W, Congatec products based on these new processors can benefit from multiple performance leaps across the TDP range and enormous optimization potential with regards to size, weight, power and costs (SWaP-C) at high graphics performance.

The new Congatec COM Express basic modules are designed for the development of embedded computing systems with impressive graphics performance for applications such as medical imaging; professional broadcasting, infotainment and gambling; digital signage; control rooms and video surveillance; optical quality control and 3D simulators. Other applications include smart robotics and autonomous vehicles that use deep learning to optimize their situational awareness.

The new conga-TR4 high-performance modules with COM Express Type 6 pinout are based on the latest AMD Ryzen Embedded V1000 multi-core processors. These modules offer up to 52% more processor performance, reaching up to 3.75 GHz. Thanks to symmetrical multiprocessing, they also provide particularly high parallel processing performance. They support up to 32 GB energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT/s and optional ECC for maximum data security.

The new integrated AMD Radeon Vega graphics with up to 11 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video  in both directions. Thanks to HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. In safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES.

The new conga-TR4 is also the first Congatec COM Express Type 6 module to allow a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces offered, includes 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces.

The supported operating systems include Linux, Yocto 2.0 and Microsoft Windows 10, or optionally Windows 7. Congatec provides an extensive range of passive and active cooling solutions for workstation designs up to 54W performance, application-ready carrier boards as well as best practice carrier board layouts and circuit diagrams, such as for USB-C implementations, to help simplify the design-in of the modules. Congatec also offers the development of custom carrier boards and module variants.

Congatec | www.congatec.com