Industrial Embedded Computing Technology for Smart Robots

Modules for Cooperative Robotics

The Service Robotics Research Center of Ulm University of Applied Sciences is developing a modular software framework to make it easier to program robots. The goal is to provide software components that can be used universally, for instance to swap robotic gripping arms from different manufacturers as required to generate new robotics solutions via plug and play. The team at Ulm University relies on congatec to address the need for highly scalable and standardized embedded computing hardware.

Zeljko Loncaric

Marketing Engineer, congatec

Prof. Dr. Christian Schlegel
Service Robotics Research Group’ Ulm University of Applied Sciences

Today’s modern robots are highly complex constructions with numerous subsystems. They use manipulators with various axis and drive units, at the ends of which specific tools, gripper systems or measuring instruments are installed. Additional sensor systems are needed for controlling the kinematics as well as for object and position recognition, for example in pick-and-place applications. With the advent of autonomous and collaborative robots—sharing the same workspace with humans—many more tasks and building blocks are added. Examples include localizing and navigating mobile robots in industrial settings and safe man-machine interaction. In Industry 4.0 environments, an M2M interface to the surrounding machines and systems is also required. The goal is mutual task coordination. All of these different robot types—from autonomous to cooperative to collaborative—require enormously powerful software components and high-performance embedded systems.

Collaborative robotics needs hardware and software components that can be modularly assembled to suit their task. There should be minimal to no programming effort—it should be enough for the modules to be parameterized. (Source: Zentilia | (ID 18864362)

High market demand for smart robots

Market demand for smart robots will grow rapidly in the coming years. For example, the market for autonomous robot systems is expected to grow at a CAGR of 23.7% until 2023, while the new market segment of collaborative robots is due to grow twice as much at an average 59% per annum. OEMs are under immense pressure to develop and to bring such new systems to market maturity as quickly as possible in order to participate in this high market growth. But the software development is a particularly great challenge for OEMs, system integrators and users: More subsystems have to be integrated into the already complex autonomous robotics solutions if they are to become collaborative and/or cooperative.

The Software Challenge

Today, the software for robots is frequently still implemented as a closed system— usually with individually tailored x86 or Arm hardware including ASICs or FPGAs. Often, the software is even individually tailored for each robot making reuse difficult. All tasks such as manipulator control, navigation, machine vision, task coordination and HMI are programmed as a unit. It is therefore currently nearly impossible to exchange software components even for the most frequently required functions or to use them on another hardware platform. This means that for every new design, the robotics software has to be re-implemented. This is both error-prone and time-consuming, and can significantly delay the rollout of much-needed innovative solutions—not to mention the hassle this causes operators who have to program each robot initially for its specific task.

Modular and Reusable

The development team of the Service Robotics Research Center of Ulm University of Applied Sciences under Professor Schlegel is now replacing this closed system approach, which perpetually creates new software projects for the system integrator and user, with a modular software approach that divides the complex overall robot system into several independent functional units, and then in a second step specifies the interaction between the individual units via fully and transparently defined interfaces. This concept, which is called SmartSoft, is now being expanded and widely marketed at the European level (EU H2020 project “RobMoSys – Composable Models and Software for Robotic Systems”) and national level (BMWi PAiCE project “SeRoNet – a platform for the joint development of service robot solutions”) in cooperation with partners from industry and research.

Essentially, this approach aims to make it possible to assemble robotic systems from fully developed and tested modular software building blocks. This allows software developers to focus on individual function modules without having to consider the internals of the other components. More importantly, it makes it possible to combine functions such as the cooperative or collaborative elements as well as the logic for specific manipulators and a lot more in a modular way – even across manufacturers. Ultimately, this also reduces the effort required for system integrators and end users to make customer-specific adaptations, and will significantly drive the widespread adoption of robotics.

So, let’s assume you have a manipulator from company A, combined with a chassis from manufacturer B, and a stereoscopic machine vision system from manufacturer C. The dedicated control software, for instance for use in intralogistics applications, is then easily assembled from the ready-made software components thanks to the high level of abstraction and requires only minor adjustments. This application is by no means a dream of the future, but already being tested in the real world. For example, the Ulm team has already implemented the service robotics duo Larry and Robotino, which, in a pharmaceutical intralogistics application for Transpharm Logistik GmbH, assembles drug packages from individual trays completely autonomously and takes them to a specified delivery point. In a slightly different configuration, the two robots have autonomously taken coffee orders and delivered them to the customer’s table. Thanks to the ready-made, freely combinable software components, the redesign took only a few hours. The video to see the two robots in action is posted here:

Containers with Clearly-Defined Interfaces

To enable virtually any assembly of elements, the team from the Service Robotics Research Center of Ulm University of Applied Sciences has developed a software model with individual service-oriented components and a model-driven open-source software toolchain for the Eclipse development environment. This environment provides component developers with tools that they can use to build their own code for each functional unit and then secure those algorithms by automatically generated component containers. These containers communicate with other containers based on uniform communication interfaces. In addition, the wrapping also protects the component developer’s IP. The team has already developed several such functional modules and makes them available for use in own projects. These include navigation modules, machine vision, HMI, manipulator control and task coordination, to name just a few examples. As a unifying communication interface, SmartSoft also relies on OPC UA. This allows manufacturers to focus on specific containers and build their core competencies here. Customers benefit from a much more flexible offer.

The SmartMDSD Toolchain allows component developers to develop software components for individual functional units that can be combined as required and reused in new robot designs. The underlying hardware should therefore be flexibly scalable.

Generic Embedded Hardware Instead of
Proprietary Designs

For the logic hardware, the Ulm team uses x86 technology to decouple the software development as far as possible from any specific hardware. With the appropriate glue logic, such an approach is particularly easy to implement with x86 technology also as far as the later migration of such systems is concerned.

Embedded x86 hardware is also particularly apt in this context because of the high standardization and comprehensive documentation. The form factors are standardized not only as regards dimensions but also in terms of the application programming interface. This facilitates replacement of hardware – provided the boards comply with the eAPI specification of the PICMG or SGET’s UIC standard. Under those circumstances, it is even possible to vary freely between different form factors such as motherboards and Computer-on-Modules depending on the requirements of the application without having to significantly change the way of accessing the hardware during the migration. One supplier who attaches great importance to this standardization and its documentation as well as the simplest possible hardware integration is congatec, whose products the Service Robotics Research Center of Ulm University of Applied Sciences uses in its projects.

“Next to basic requirements such as maximum computing power, energy efficiency and reliability, we also attach great importance to high standardization and the capability to migrate universally,” explains Matthias Lutz from Ulm University of Applied Sciences. “Every additional abstraction level in the software requires additional computing performance, so we’re currently working with powerful dual-core technology. A standardized approach to board components and GPIOs to control the robotics modules also gives us the abstraction required for independence at the embedded computing level.”

The autonomous picking robot Larry with congatec conga-IC175 Mini-ITX carrier board: High computing power, little heat waste, small form factor and highest reliability are the key factors here.

The choice ultimately fell on the fully industrial Mini-ITX carrier board conga-IC175. That’s because the standardized Mini-ITX form factor offers many advantages for developing the prototypes of the innovative software components into real systems: It already integrates all interfaces on a standardized board, and congatec lets you realize the power supply via standard ATX power supplies, industrial 12 V feed-in, or SMART batteries, which is essential for mobile robots such as Robotino and Larry. Extensions can also be implemented quickly and efficiently via PCIe expansion cards. The board is highly energy efficient and uses robust embedded components, so it can be operated without expensive cooling.

Evolution of embedded computing hardware from congatec for smart robots: Depending on the design concept and lot sizes in the series, OEMs can choose either embedded Mini-ITX motherboards (1), standardized carrier boards (here Mini-ITX) with Computer-on-Modules (2), customized carrier boards with Computer-on-Modules (3), or full custom designs (4), which congatec can implement comparatively quickly and easily on the basis of module upgrades.

Future commercial robot designs from Ulm will be implemented on Computer-on-Modules. But regardless of whether it’s a Mini-ITX motherboard, module with standard Mini-ITX carrier, module and individual carrier, or full-custom design: It is the Total cost of Ownership (TCO) that ultimately matters to OEMs, and when using modular software this is also determined by the software support of the hardware. To make it even easier to integrate more functionalities in the future, comprehensive support for real-time hypervisor technology can bring added benefits. This will give customers the option to integrate additional functionalities, such as their own IoT gateway, without having to use a dedicated hardware platform, which saves hardware costs.

“We see clear benefits in such modular approaches as they mirror the modular approach of our software. In this respect, it is very interesting to see that with the acquisition of Real-Time Systems congatec now has virtually direct access to the hypervisor technology of these robotics and automation experts,” concludes Lutz.

Coupled with the Technical Solution Center (TSC), in which congatec consolidates all its OEM services, this results in a complete package for customers such as the Service Robotics Research Center of Ulm University of Applied Sciences or Transpharm Logistik GmbH.


Intralogistics Application at Transpharm Logistik GmbH
Picking tasks are performed by a heterogeneous robot fleet in an intralogistics application at congatec’s industrial partner Transpharm Logistik GmbH. The autonomous picking robot Larry is equipped with a UR5 manipulator module and uses a Segway chassis. The transport robot Robotino has a conveyor belt instead of a manipulator to take the picking robot to any point. Orders are received directly from the warehouse management system via WLAN. The fleet management system selects two picking robots, which then execute the order. The application is based on results from the BMBF project “LogiRob – Multi-Robot Transport System in a Shared Human-Machine Workspace” and “ZAFH Intralogistics – Collaborative Systems to Increase Intralogistics Flexibility”
(Baden-Württemberg and EU ERDF 2014-2020).

About the Authors
Zeljko Loncaric is Marketing Engineer, congatec. Prior to joining congatec mid-2010, he held various positions with international companies in product management, marketing and sales marketing in Germany and Australia. Zeljko holds an MBA in business management and a degree in Media Technology from the University of Deggendorf.

Prof. Dr. Christian Schlegel is in the ,Service Robotics Research Group’ Ulm University of Applied Sciences. Christian Schlegel (45) has been a professor at the Faculty of Computer Science at Ulm University of Applied Sciences since 2004. Schlegel, who received the Science Prize of the City of Ulm in 2010, is the coordinator of the “Service Robotics” joint project.

congatec is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and EDM services.        

This article appeared in the September 350 issue of Circuit Cellar
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Mobile Robot Taps Jetson Xavier Via New Aetina Carrier Board

By Eric Brown

Aetina announced a partnership to build an autonomous, solar-powered mobile robot with GPS tracking, sensors, and 6x HD cameras, based on its “AX710” carrier for the Linux-driven Jetson AGX Xavier.

Taiwan-based Aetina and an undisclosed third party are developing the UGV (Unmanned Ground Vehicle) robot for border and shore patrol and other remote inspection and exploration applications. The robot will be built around Nvidia’s powerful, AI-enabled Jetson AGX Xavier module via Aetina’s new AX710 carrier board.

AX710, front and back
(click images to enlarge)

We missed the AX710 when it was announced in February, but have detailed it farther below. The AX710, which follows Aetina’s earlier ACE-N310 carrier for the Jetson TX1/TX2/TX2i modules, joins CTI’s Rogue and Mimic Adapter carriers for the Xavier.

Nvidia’s 105 x 87 x 16mm Jetson AGX Xavier module has greater than 10x the energy efficiency and more than 20x the performance of the Jetson TX2, claims Nvidia. The module is equipped with 8x ARMv8.2 cores and a high-end, 512-core Nvidia Volta GPU with 64 tensor cores with 2x Nvidia Deep Learning Accelerator (DLA) engines. The Xavier is further equipped with a 7-way VLIW vision chip, as well as 16GB 256-bit LPDDR4 RAM and 32GB eMMC 5.1.

The upcoming UGV built around Aetina’s AX710 board will use the deep learning algorithms running on the Xavier to “understand and react to the surroundings” in real time based on camera and environmental sensor input, says Aetina. The company’s chief partner in the project will provide a GPS-based vehicle tracking system.

The robot will be equipped with solar panels. Their facing orientation will be continually adjusted to the best solar zenith angle calculated by the Xavier with the help of an optical sensor. Other sensors include thermal, infrared sensor, and metal detection sensors.

The UGV will be equipped with 6x Full HD, 360-degree cameras. Other features include LED lighting and the third-party, cloud-connected GPS tracking system, which features geofencing. The system will support up to 5G cellular connectivity as well as Innodisk’s iCAP remote monitoring system.

AX710 carrier

Like CTI’s Rogue carrier, Aetina’s compact, 112 x 107mm AX710 is designed to stack nicely with the 105 x 87 x 16mm Xavier module for deployment on robots and other space-constrained devices. Available with -25 to 80°C or -40 to 85℃ support with 10% to 90% humidity tolerance, the carrier board has a 9-20V DC input.

AX710 block diagram and Jetson AGX Xavier
(click images to enlarge)

The AX710 carrier provides coastline ports including 2x HDMI, 2x USB 3.1, and single USB 3.1 Type-C and micro-USB ports. There’s also a GbE port via RJ45, as well as two more GbE ports via an extension adapter.

AX710 portside view

The AX710 is equipped with 2x CANBus, 2x UART, 5x GPIO, and single RS-232, I2C, and “front panel” interfaces. There are also 4x I-PEX connectors, as well as M.2 M-Key and M.2 E-Key slots.

The board also provides a 60-pin extension slot. It’s unclear if that is the source of the MIPI-CSI-2 connections for Aetina’s optional camera modules. Although the robot will offer 6x HD cameras, the AX710 supports up to 8x HD cams. Alternatively, you can have 4x 4K cameras or an undisclosed number of GSML/FPD-LINK III SerDes(PDF) cameras.

The AX710 is available with an “iNAVI” optimization service featuring an embedded OS based on Linux, including secure boot and system recovery features. Aetina pre-integrates the necessary driver porting and and can customize OS specifications. Other technical services are also available.

Further information

No ship date or name was listed for the upcoming AX710-based UGV. Aetina Corporation will share a booth with its UGV partner at DSEI (Defence & Security Equipment International) at the Exhibition Centre London UK (EXCEL) from Sep. 10-13 at booth S4-205.

The AX710 carrier board appears to be available at an undisclosed price. More information may be found on Aetina’s AX710 product page.

This article originally appeared on on August 20.

Aetina |

Linaro Launches Two 96Boards SOM Specifications

Linaro has launched two SOM specifications for 96Boards—a Compute Module spec and a Wireless spec. It has also released two board designs based on the Compute spec, along with a 96Boards SOM Carrier board compatible with those two boards.

Linaro, the Arm-backed open source collaborative engineering organization, has announced the publication of version 1.0 of 96Boards System-on-Module (SOM) specifications. 96Boards is Linaro’s initiative to build a single software and hardware community across low-cost development boards based on Arm technology. Along with the new specifications, the company has rolled out two board designs: the TB-96AI based on a Rockchip RK3399Pro processor, and the TB-96AIoT based on the newer Rockchip RK1808 processor.

We’ve [] covered a couple RK3399Pro-based boards just within that last four months, including Geniatech’s DB3399 Pro, Vamrs’ Toybrick RK3399Pro SBC and crowdfunded Khadas Edge-1S SBC from Shenzhen Wesion’s Khadas project. The newer Rockchip RK1808, announced in January at CES, is basically a “lite”, lower power version of the RK3399Pro with the same Network Processing Unti (NPU). See further down for more details on the RK1808.

The launch of the new 96Boards specifications provides developers with a SOM solution that is compatible across SoCs. According to Linaro, SOM solutions today use a variety of different connector solutions including SO-DIMM connectors used in DRAM and Mini Module Plus (MMP) connectors for certain specialist boards. Up until now, there has been no solution offering flexible IO and a robust mounting mechanism, nor a standard form factor, says Linaro. The goal of new 96Boards SOM specifications is to enable plug and play compatibility between a whole range of different SOM solutions.

Two 96Boards SOM specifications have been launched: The Compute Module Specification and the Wireless Specification. Both specifications encourage the development of reliable and cost-effective embedded platforms for building end-products. The specifications have been proposed, created and reviewed by the current 96Boards Steering Committee Members.

The Compute Module Specification defines a SOM with generic module-to-carrier board interface, independent of the specific SoC choice on the module. The Compute module addresses the application requirements of segments including industrial automation, smart devices, gateway systems, automotive, medical, robotics and retail POS systems. Two form factors are defined as SOM-CA and SOM-CB with a maximum of four 100 pin Connectors. The X1 connector is mandatory on all SOMs. The defined interfaces are shown in the table below.

Compute Module Spec — Defined Interfaces
(click image to enlarge)
The Wireless specification designs a SOM for interchangeable wireless module applications, supporting standard and/or proprietary wireless standards such as 802.15.4, BLE, WiFi, LoRa, NB-IoT, LTE-M etc. The specification is designed to enable evolution that will support multiple products and future wireless standards. The two form factors are defined as SOM-WA/SOM-WB with the pinouts to the specification shown in the table below.

Wireless Spec Pinouts
(click image to enlarge)

The TB-96AI can be combined with the backplane to form a complete industry application motherboard, and be applied to various embedded artificial intelligence fields. The TB-96AI’s RK3399Pro processor has an Arm dual-core Cortex-A72+quad-core Cortex-A53 architecture. The processor has frequencies is up to 1.8 GHz and integrates a Mali-T860 MP4 quad-core graphics processor. The chip’s integrated NPU supports 8Bit/16Bit operation. With computing power of 3.0 Tops, the NPU can meet various AI application needs such as vision, audio and so on.

TB-96AI, front and back
(click images to enlarge)
The TB-96AI supports DP1.2, HDMI 2.0, MIPI-DSI, eDP multiple display output interfaces, dual-screen co-display/dual-screen heterodyne, 4K VP9, 4K 10bits H265/H264 and 1080P multi-format (VC-1, MPEG-1/2/4, VP8) video decoding, 1080P (H.264, VP8 format) video coding. The board is compatible with multiple AI frameworks, the design supports TensorFlow Lite/Android NN API, AI software tools support import, mapping and optimization of Caffe / TensorFlow models, allowing developers to easily use AI technology.


The TB-96AIoT meanwhile is equipped with the RK1808 AIoT chip. According to Linaro, the TB-96AIoT also provides rich interfaces and strong scalability. Aside from this, little other detail on the TB-96AIoT is provided in the announcement.

The Rockchip RK1808 processor used on the TB-96AIoT features a dual-core Cortex-A35 CPU architecture, NPU computing performance up to 3.0 Tops, VPU supporting 1080P video codec, microphone array with hardware VAD function, and camera video signal input with built-in ISP. The RK1808 boasts lower power consumption thanks in part to being built on an 22nm FD-SOI process. This shrinks power consumption by about 30%, compared with mainstream 28nm processes under the same performance, according to Rockchip. The device features DDR-free operation of the always-on device with built-in 2MB system-level SRAM. A hardware VAD function provides low-power monitoring and far-field wake-up, features all suited to IoT applications.

Both the TB-96AI and TB-96AIoT SOM designs are available for purchase from—sign in required. A story by cnx-software points out that Vamrs is also involved because of the “ToyBrick” reference on the boards’ silkscreen.

96Boards SOM Carrier Board

The 96Boards SOM Carrier Board is compatible with both the TB-96AI and TB-96AIoT. It is designed to suit different markets and demonstrates how easy it is to support multiple different SOMs.

96Boards SOM carrier board
(click image to enlarge)
There wasn’t much detailed on the carrier board spelled-out in the announcement, although this detail graphic was provided:

96Boards SOM carrier board detail
(click image to enlarge)
 Further information

More information on the new SOM specifications can be found on the announcement page. You can learn more about Linaro’s engineering work on the Linaro and 96Boards websites. Beiqicloud is 96Boards Compute SOM Lead partner. For more information about SOM boards and Carrier board visit Beiqicloud’s products page.

This article originally appeared on on April 2.

Linaro |

Linux-Powered Jetson Xavier Module Gains Third-Party Carriers

By Eric Brown

Connect Tech (CTI) has released two new developer options for Nvidia’s octa-core Jetson AGX Xavier computer-on-module, which is already supported by Nvidia’s innovative, $1,299 Jetson Xavier Developer Kit. Like the official dev kit, CTI’s 105 mm x 92 mm Rogue board is approximately the same size as the 105 mm x 87 mm x 16 mm Xavier, making it easier to use for robotics applications.

Rogue carrier with Xavier module (equipped with fan)
(click images to enlarge)
CTI also launched a Jetson AGX Xavier Mimic Adapter board that mediates between the Xavier and any CTI carrier for the Jetson TX1, TX2, and the latest industrial-focused version of the TX2 called the Jetson TX2i. These include the three TX2 boardsannounced in early 2017: the Cogswell carrier with GigE Vision, the Spacely carrier designed for cam-intensive Pixhawk drones, and the tiny, $99 Sprocket. CTI’s Jetson TX1 boards include the original Astro, as well as its later Orbitty and Elroy.

Jetson AGX Xavier Mimic Adapter with Xavier and Elroy carrier (left) and exploded view
(click images to enlarge)
The Jetson Xavier “enables a giant leap forward in capabilities for autonomous machines and edge devices,” says CTI. Nvidia claims the Xavier has greater than 10x the energy efficiency and more than 20x the performance of its predecessor, the Jetson TX2. The module — and the new CTI carriers — are available with a BSP with Nvidia’s Linux4Tegra stack. Nvidia also offers an AI-focused Isaac SDK.

The Xavier features 8x ARMv8.2 cores and a high-end, 512-core Nvidia Volta GPU with 64 tensor cores with 2x Nvidia Deep Learning Accelerator (DLA) — also called NVDLA — engines. The module is also equipped with a 7-way VLIW vision chip, as well as 16 GB 256-bit LPDDR4 RAM and 32GB eMMC 5.1.

Nvidia Drive AGX Xavier Developer Kit
(click image to enlarge)
Since the initial Xavier announcements, Nvidia has added AGX to the Jetson Xavier name. This is also applied to the automotive version, which was originally called the Drive PX Pegasus when it was announced in Nov. 2017. This Linux-driven development kit recently began shipping as part of the Nvidia Drive AGX Xavier Developer Kit, which supports a single Xavier module or else a Drive AGX Pegasus version with dual Xaviers and dual GPUs.


CTI’s Rogue carrier board provides 2x GbE, 2x HDMI 1.4a, 3x USB 3.1, and a micro-USB OTG port. Other features include MIPI-CSI, deployable either as 6x x2 lanes or 4x x4 lanes, and expressed via a high-density camera connector breakout that mimics that of the official dev kit. CTI will offer a variety of rugged camera add-on expansion boards with options described as “up to 6x MIPI I-PEX, SerDes Inputs: GMSL or FPD-Link III, HDMI Inputs).”

Rogue, front and back
(click images to enlarge)

For storage, you get a microSD slot with UFS support, as well as 2x M.2 M-key slots that support NVMe modules. There’s also an M.2 E-key slot with PCIe and USB support that can load optional Wi-Fi/BT modules.

Other features include 2x CAN 2.0b ports, 2x UARTs, 4-bit level-shifted, 3.3 V GPIO, and single I2C and SPI headers. There’s a 9-19 V DC input that uses a positive locking Molex Mini-Fit Jr header. You also get an RTC with battery connector and power, reset, and recovery buttons and headers.

Mimic Adapter

The Jetson AGX Xavier Mimic Adapter has the same 105 x 92mm dimensions as the Rogue, but is a simpler adapter board that connects the Xavier to existing CTI Jetson carriers. It provides an Ethernet PHY and regulates and distributes power from the carrier to the Xavier.

Mimic Adapter, front and back
(click images to enlarge)

The Mimic Adapter expresses a wide variety of interfaces detailed on the product page, including USB 3.0, PCIe x4, SATA, MIPI-CSI, HDMI/DP/eDP, CAN, and more. Unlike the Rogue, it’s listed with an operating range: an industrial -40 to 85°C.

Further information

The Rogue carrier and Mimic Adapter for the Nvidia AGX Xavier are available now with undisclosed pricing. More information may be found in Connect Tech’’s Xavier carrier announcement, as well as its Rogue and Mimic Adapter product pages.

This article originally appeared on on October 17.

Connect Tech |

M-Module Serves Up Four Serial Interfaces

The M-Module M77N from MEN Micro has been developed according to the ANSI Mezzanine standard and extends carrier boards by four electrically isolated serial interfaces, which can be adapted to the respective requirements by software. M-Modules—an ANSI-VITA standard since 1997—are ideally suited for the connection of binary and analog process I/O, robotics, motion and measurement functions. As an extension to all common bus systems such as CompactPCI, ComapctPCI Serial, VME or independent SBCs, mezzanine modules complement each application in a tailor-made and modular manner.

The M-Module M77N supports four high-performance UARTs with RS232 or RS422 / 485 interfaces – implemented in the FPGA. These are accessible via a D-Sub connector at the front and can be connected to the carrier card, and thus to the backplane of the system via a 24-pin onboard connection if required. The interface mode of the M-Module can be changed by the software.

The serial lines have been optically isolated, which is essential for use in automotive or industrial applications as well as in mobile environments, for example, to protect the control system from external disturbances such as high voltage pulses. All components of the M77N are firmly soldered against shock and vibration, and are approved for a temperature range of -40°C to +85°C.

MEN Micro |