Multi-Channel RF Converter ICs Meet Wireless Carrier Needs

Analog Devices has introduced a mixed-signal front-end (MxFE) RF data converter platform designed to meet the performance needs for a range of wireless equipment such as 4G LTE and 5G millimeter-wave (mmWave) radios. ADI’s new AD9081/2 MxFE platform allows system developers to install multiband radios in the same footprint as single-band radios, which as much as triples call capacity available in today’s 4G LTE base stations. With a 1.2 GHz channel bandwidth, the new MxFE platform also enables wireless carriers that are adding more antennas to their cell towers to meet the higher radio density and data-rate requirements of emerging mmWave 5G.

The AD9081 and AD9082 MxFE devices integrate eight and six RF data converters, respectively, which are manufactured using 28 nm CMOS process technology. Both MxFE options achieve the industry’s widest instantaneous signal bandwidth (up to 2.4 GHz), which simplifies hardware design by reducing the number of frequency translation stages and relaxing filter requirements. This new level of integration addresses the space constraints of wireless device designers by lowering chip count and yielding a 60 percent reduction in printed-circuit-board (PCB) area compared to alternative devices.

By shifting more of the frequency translation and filtering from the analog to the digital domain, the AD9081/2 provides designers with the software configurability to customize their radios. The new multi-channel MxFE platform meets the needs of other wide-bandwidth applications in 5G test and measurement equipment, broadband cable video streaming, multi-antenna phased array radar systems and low-earth-orbit satellite networks.

The MxFE platform processes more of the RF spectrum band and embeds DSP functions on-chip to enable the user to configure the programmable filters and digital up and down conversion blocks to meet specific radio signal bandwidth requirements. This results in a 10X power reduction compared to architectures that perform RF conversion and filtering on the FPGA, while freeing up valuable processor resources or allowing designers to use a more cost-effective FPGA.

The AD9081 is priced at $1,487 (1,000s) and the AD9082 at $1,500. Both will be available for sampling in September 2019.

Analog Devices | www.analog.com

Compact Apollo-Lake Box PC Targets Mobile Comms

MEN Micro has announced its BC51M box PC based on the Intel Atom E3900 series, optionally with two or four cores, up to 1.6 GHz. The fanless and maintenance-free device is used in graphics and memory intensive applications in trains, buses or commercial vehicles and, thanks to its numerous communication interfaces, is highly variable.

With 8 GB DDR3 SDRAM memory, a rear accessible SD card, an integrated eMMC memory and an optional SATA HDD/SSD, the box PC has the necessary storage capacity for entertainment servers or video surveillance systems.  The BC51M was designed for mobile use in trains, buses or commercial vehicles and takes over wireless on-board functions such as Internet on board, positioning via GNSS, entertainment or predictive maintenance.

The box PC supports up to two DisplayPort interfaces with a maximum resolution of 4K, as well as two Gigabit Ethernet interfaces, one USB 2.0, one HD audio and two variable connections for serial I/O, CAN bus, MVB or IBIS. Two PCI Express Mini Card slots and two micro-SIM slots provide flexibility in implementing mobile service standards up to 4G LTE or WLAN. The system is designed for fanless operation at temperatures from -40°C to +85°C. Thanks to the integrated 30 W/24 VDC wide-range power supply, the box PC complies with the railway standard EN 50155 and ISO 7637-2 for road vehicles.

  • Intel Atom E3900 Series
  • Up to 8 GB DDR3 DRAM, ECC
  • 32 GB eMMC
  • 2 DisplayPorts, each up to 4096 x 2160 pixels
  • 2 Gigabit Ethernet, 1 USB 2.0
  • 2 slots for IBIS, GPS, RS232, RS485, RS422
  • WLAN, 4G LTE, GNSS via PCI Express Mini Cards
  • -40°C to +85°C operating temperature, fanless
  • Complies with EN 50155 and ISO 7637-2

MEN Micro | www.menmicro.com

Nordic BLE SoC Selected for Cloud-Connected Thermostat

Nordic Semiconductor has announced that Sikom, a developer of GSM-based IoT platforms, employs Nordic’s nRF52840 Bluetooth 5/Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) in its ‘Bluetooth Thermostat EP’ to support smartphone connectivity and smart-home networking. The thermostat is available to consumers and OEMs developing their own heating control systems.

The Nordic SoC’s Bluetooth 5 long-range capability enhances connection stability, boosting range, and allowing the thermostat to be configured and controlled from anywhere in the house. From a companion app on a Bluetooth 4.0 (and later) smartphone the user can control thermostat features such as comfort and economy temperature set points, week programs, vacation modes and temperature logs.

Because the thermostat can be controlled and configured directly from the smartphone, there is no requirement for a proprietary gateway between mobile device and thermostat, lowering the cost and complexity of installation and setup. In addition, the thermostat’s Bluetooth 5 connectivity enables it to join a Sikom smart-home network and communicate directly with other wireless devices to support advanced features such as power control and limiting. The thermostat also integrates with 4G/LTE (cellular) technology to enable remote control via Sikom’s Cloud platform.

Enabled by the nRF52840 SoC’s 32-bit Arm Cortex M4F processor, 1 MB Flash memory, and 256 KB RAM, the Bluetooth Thermostat EP platform can support a variety of complex remote thermostat/heating applications. The processor has ample power to run the Bluetooth 5 RF software protocol (“stack”) and Sikom’s application software and bootloader. The SoC also supports Over-the-Air Device Firmware Updates (OTA-DFU) for future improvements.

Nordic’s nRF52840 Bluetooth 5/Bluetooth LE SoC is Nordic’s most advanced ultra low power wireless solution. The SoC supports complex Bluetooth LE and other low-power wireless applications that were previously not possible with a single-chip solution. The SoC combines the Arm processor with a 2.4 GHz multiprotocol radio architecture featuring -96dB RX sensitivity and an on-chip PA boosting output power to a maximum of 8 dBm. The SoC is supplied with the S140 SoftDevice, a Bluetooth 5-certified stack which supports all the features of the standard and provides concurrent Central, Peripheral, Broadcaster and Observer Bluetooth LE roles.

Nordic Semiconductor | www.nordicsemi.com