Samtec, Inc., a global leader in high-performance interconnect solutions and a service leader in the industry, announces the expansion of its AcceleRate HP product line with the release of 800-position APM6 and APF6 high-performance array connectors available in a low-profile 5mm stack height.
Engineered for next-generation demands, the new AcceleRate HP connectors deliver exceptional signal integrity and density, supporting data rates up to 112 Gbps PAM4 on a 0.635mm pitch. These connectors are optimized for high-throughput applications such as High-Performance Computing (HPC), Artificial Intelligence (AI), storage, and networking.
Key features include:
- Protocol compatibility with PCIe 6.0, CXL 3.2, and 100 GbE
- 800-position configuration (8 rows × 100 positions) in a dense footprint of 68.62mm × 18.20mm (2.701” × 0.717”)
- 5mm mated stack height, with a 10mm version planned for Q2 2026
- 5 Ohm impedance
- 2 A max current rating (one pin powered per row), and 150 VAC (212 VDC) max voltage rating
- Open pin field array design for maximum grounding and routing flexibility
The APM6 and APF6 connectors utilize Samtec’s Solder Column Termination, enhancing structural integrity. This IPC Class 3 compliant method is ideal for dense, high-speed interconnects and offers superior solder joint reliability and excellent insertion loss and return loss performance.
“These new 800-position connectors represent a significant advancement in high-density, high-speed interconnect technology,” said Eric Mings, Samtec’s High-Speed Board-to-Board Product Manager. “They’re designed to meet the rigorous demands of today’s data-intensive systems while maintaining reliability.”
Samtec, Inc | samtec.com
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Kirsten Campbell is a Marketing Tornado and junk robot of information. Analytical and creative, she has been in marketing and communications since 2008 and worked with everyone from small businesses to your favorite household names.
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