Octavo Launches the OSD62x SiP family for speeds and performance. Octavo Systems has released its latest system in a package (SiPs) family based on the Texas Instruments (TI) AM623 and the AM625 processors, focusing on edge and small form factor embedded processing.
Applications that the company sees being suitable for the SiPs are building automation, IoT Gateways, AI at the edge, and industrial control. The company also mentions these SiPs are well-suited for low-power systems that require high-performance Linux processing.
So far this is the smallest AM62x module form factor. The OSD62x integrates such functions as power management, high-speed memory, and passive components, all in a single BGA package. overall the company is saying solution sizes can be reduced by 60%.
According to Octavo, this allows designs to make it to market up to 9 months faster than past systems.
There are simply two package options for the OSD62x family of SiPs. There is the Maximized Integrations (-MI) option that provides everything needed for an AM62x system. It comes in a 22x22mm, 1mm ball pitch BGA.
The MI option includes the TI AM62x processor with up to a 1.4 GHZ Quad Arm Cortex-A53 and a 400MHz Cortex-M4F. There is an LPDDR4 memory, power management, oscillator, passive components EEPROM, and a range of optional devices. Those devices include programmable logic, analog-to-digital converter (ADC), and real-time clock (RTC).
The other option for the OSD62x SiP family is called Size Optimized (-SO) and is a 14 x 9mm, 0.5 mm ball pitch BGA, package. This option integrates an AM62x processor, 1.4GHz Quad Coretex-A-53, and the 440 MHZ Cortex-M4F along with the LPDDR4 memory and passive components.
The final release date for production is at the end of 2023, but the beta program is underway for interested developers and designers.
For more on the OSD62x family of IoT SiPs see the product page at the Octavo website here.
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