Diamond Technologies, Inc. (DTI), a leading provider of embedded solutions to OEMs, announced the availability of three new additions to its growing line of embedded computing modules: the DEC i.MX 91-OSM, DEC i.MX 93-OSM, and the DEC MP2-OSM embedded computing modules.
Designed, engineered, and supported in the US, these embedded computing modules expand DTI’s embedded computing portfolio with advanced processing secure connectivity, and efficient edge computing giving OEMs more ways to simplify embedded development. By offering both critical data capture solutions and embedded computing modules, DTI helps customers reduce design complexity, shorten development cycles, and acceleration time to market, all from a single trusted source.
The DEC i.MX 91/93-OSM embedded computing modules, built on the NXP i.MX 91 and 93 processors deliver efficient edge computing with AI and machine learning acceleration for intelligent, always-on devices.
Technical Highlights:
- i.MX 91 Processor:
- Single Arm® Cortex® -A55 core for efficient application performance
- Integrated Arm® Cortex® -M33 for secure real-time control
- i.MX 93 Processor:
- Dual Arm® Cortex® -A55 cores plus Arm® Cortex® -M33 for combined application and real-time processing
- Integrated Arm® Cortex® -M33 for secure real-time control
- Integrated Ethos™ -U65 NPU for AI and ML acceleration
- Up to 2GB of 16-bit wide LPDDR4X memory
- Broad I/O support including Ethernet, USB, UART, SPI, and I²C
- Compact, low-power design ideal for fanless and space-limited systems
- Industry standard OSM form factor
The DEC MP2-OSM computing module, based on the STMicroelectronics STM32MP2 processor, provides robust connectivity and secure processing for industrial and control applications.
Technical Highlights of the DEC MP2-OSM computing module
- Dual-core Arm® Cortex®-A35
- Integrated Arm® Cortex®-M33 co-processor
- On-chip NPU delivering up to 1.35 TOPS for AI/ML inference
- Multiple connectivity options: Ethernet, USB 2.0/3.0, SD/MMC, CAN-FD, and UART
- Optimized for low-power operation
- Industry standard OSM form factor
Each module features an industry-standard OSM form factor, making them ready for quick adoption and future scalability. The OSM standard enables straightforward integration and drop-in replacement for a clear path forward as projects evolve.
“Adding the i.MX 91/93 and MP2 embedded computing modules to our product portfolio provides our customers with enhanced performance and expanded options to meet their design project requirements,” said Paul Tesini, President of Diamond Technologies Inc. “The goal is to reduce our customers design and development time by providing them with the platform of their choice and supporting them as a partner to ensure their projects are successful. Each embedded computing module is designed with long lifecycles in mind and are backed by DTI’s engineering support, including lifecycle and obsolescence management, ensuring stability throughout the device’s development and deployment.”
Diamond Technologies, Inc. | diamondt.com
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Kirsten Campbell is a Marketing Tornado and junk robot of information. Analytical and creative, she has been in marketing and communications since 2008 and worked with everyone from small businesses to your favorite household names.
Ask her about the time she made a numismatics blog interesting (yes, really) or wrote an obit for a family she never met.
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