Congatec releases a COM-HPC that includes high-end variants. To expand even further the line up 13th Generation Intel Core processor Computer on Module (CoM) – High-Performance Computer (HPC) line, Congatec has launched a new series of CoMs that offer LGA Socket high-end variants.
The new Conga-HPC/cRLS Computer on Modules in a COM-HPC Size-C form factor 120×160 mm, is set to address applications requiring the greatest level of performance in multi-thread, multi-core performance, large cache size, and huge memory capacities. These will also address advanced I/O and high bandwidth needs.
Application areas that are being targeted by the company include Edge computing utilizing Artificial Intelligence and machine learning (ML), high-performance needs in industrial applications, and medical applications.
The other areas that Congatec is aiming these new LGA socket modules at include any type of embedded and edge computing solutions. Those solutions with workload consolidation requirements. In response to the consolidation, Congatec also supports real-time hypervisor technologies from Real-Time Systems,
“With currently up to 8 Performance cores in parallel to 16 Efficient cores, the socketed variants of the 13th Gen Intel Core processors empower our COM‑HPC modules to offer even more options for making edge computing more performant and efficient through workload consolidation,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec. “IoT-connected systems have many tasks to process in parallel, and if OEMs do not want to realize this connectivity through adaptive systems, OEMs need to embed virtual machines into their solutions. The more cores a Computer-on-Module provides, the easier this becomes.”
The new HPC modules can be deployed on the company’s Micro-ATX Application Carrier Board, the conga-HPC/mATX, where client modules can easily and quickly utilize all the benefits available in the new modules, through ultrafast PCIe connectivity.
For further information on the congatec HPC/cRLS Computer on Module in the COM-HPC Size C form factor, see the product about page found here.
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