Congatec announced a new series of rugged vehicle computing platforms for smart mobility applications, and able to handle extended temperature ranges. These solutions are meant to simplify and speed up digitization and autonomous driving in harsh environments, such as transportation, logistics construction, and agriculture. The smart mobility products range from computing platforms for real-time 5G connected, unmanned functionally safe vehicles, to a series of solutions designed to digitize the kinematics of existing fleets.
The main goal is to provide high accuracy in orientation data, improve situational awareness, and ultimately optimize the movement and operation of autonomous vehicles.
Aimed at mobility OEMs and Tier 1 suppliers, to help them tackle a variety of challenging tasks when designing next-generation smart autonomous mobility controllers.
The need to integrate vision and various other sensors to gather situational raw data, plus implementing data preprocessing and AI to improve data analytics, and also design controller logic for autonomous vehicle movement and operation, was a top priority for Congatec. But that is not all, they needed to address 5G network sliced device connectivity, for vehicle-to-vehicle and vehicle-to-x (network or infrastructure) communication. This the OEMs and Tier 1 suppliers need to implement with real-time capabilities and functionally safe.
The Real-Time Kinematic Platform
Based on Congatec’s computer-on-modules, the real-time kinematic Etteplan platform features an RTK-enabled GNSS unit, with a magnetometer, gyroscope, and accelerometer. The module is designed for automotive voltage ranges of up to 36V. and an operating temperature range of -40°C to +85°C, with IP65/67 protection. Connectivity is a large portion of vehicle communication and the networks being developed, so the COM has Ethernet (TSN), RS282, RS485, and CAN. Edge connectivity options include Wi-Fi, Bluetooth, and LTE/5G. The features are rounded off with Ambient pressure, humidity, and temperature. The COM is based on the Intel Atom processor system.
COM-HPC Server Modules With Intel Xeon D Processors
The new COM-HPC server modules in Size E and Size D with Intel Xeon D processors are designed to accelerate next-generation real-time microserver workloads in more rugged vehicles and harsher mobility environments, with extended temperature ranges. Improvements include up to 20 cores, up to 1TB of RAM, double throughput per PCIe lane, compared to Generation 4, and up to 100 GbE connectivity with TCC/TSN support.
Use cases include traffic applications that can range from outdoor servers deployed in 5G Tactile internet applications, to edge servers in trains. Included can be vision-based public and infrastructure safety applications. For further information on the Intel Xeon D based COMs, access the Congatec website module page.
For further reading and information check out Congatec’s COM-HPC Product Overview for updates and datasheets on the COMs being delivered at this time.
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