Congatec has developed Computer-on-Modules (CoMs) that are small and reliable, as is usually the case.
The CoM is a small circuit board plugged into a standard connector on an application-specific carrier board. The CoM is a computer with a processor and all the vital peripherals in one place.
Most of the interface circuitry can be found on the module, including PCIe, Ethernet, SATA, display interfaces, and general-purpose I/Os. These interfaces get routed to the appropriate ports on the carrier board, where data collection of compute operations happen.
Designers can use the Congatec line to speed up time-to-market and develop in the new SMARC 2.1.1 environment.
One of the main CoMs at Congatec is the COM-HPC with an Intel Ice Lake-D Xeon Processor family, or the 12th Gen Intel Core Alder Lake processors. Supporting up to 1TB of DDR4 2933MT/s memory, the system is well-suited to server scenarios. Some of the main processor types that could be used include 5 Xeon options.
Key Processor Options
- conga-HPC/sILH – server size D – Intel Xeon D Ice Lake processor
- conga-HPC/sILL – server size D – Intel Xeon D Ice Lake processor
- conga-HPC/cALS – client size C – 12th Gen Intel Core Alder Lake processor
- conga-HPC/cALP – client size A – 12th Gen Intel Core Alder Lake processor
Key features of the COM-HPC
- Support the fastest I/O interfaces
- PCIe Gen 5
- USB4
- 25G Ethernet
- Increased I/O interfaces
- 64x PCIe
- 8x 25G Ethernet
- Up to 1TB DRAM 8x full-size DIMM
- Up to 300 Watt power consumption for a server-on-module server CPU performance
These edge computing modules carry more computing power than ever before. The COM-HPC and COM Express Computer-on-Modules feature the new Intel hybrid architecture with a mix of Performance P-cores and efficient E-cores. The BGA solderable processor variants are using just 15 to 28W and edge computing platforms.
This eliminates the need for expensive cooling systems and improves the overall ruggedness and MTBF of system designs.
These CoMs have lower energy consumption mainly achieved by reducing the number of P-cores while keeping the E-core count the same.
Target industrial markets for the new high-performance Computer-on-Modules with Intel Core i7/5/3 and Celeron processors can include
- Edge Computers
- IoT Gateways
- incorporating multiple virtual machines
- Smart Factories
- Process automation
- AI-based quality inspection
- industrial vision
- real-time robotics
- autonomous logistics vehicles
- warehouses
- shipping
These new variations on the COM-HPC series of Computer-on-Modules are designed for heavy computing, with high efficiency and low power consumption. Above all else High-performance computing.
For more information on the COM-HPC family of Computer-on-Modules from Congatec see the product family page here.
Congatech | congatech.com
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