Apex Microtechnology has released an analog module series that provides Silicon Carbide (SiC) technology in a functional package design. The modules are half-bridge mounted on the surface expanding thermal efficiency and power density.
The Apex SA111 has a surface-mounted 20mm x 20mm body and can provide continuous output currents at 32A, is able to reach switching frequencies up to 1MHz, and manage supply voltages up to 650V. This makes the unit thermally efficient and with top-side heat sinking. This allows for better board designs and development.
The SA111 Silicon Carbide MOSFETs allow for a higher level of thermal stress, with the management of junction temperatures of up to 175 ℃. This power module is a fully integrated solution with increased device control as well as protection. The SA111 SiC MOSFETs offer an integrated gate driver, under-voltage lockout, and active Miller clamping.
“The SA111 underlines again Apex Microtechnology’s ability to provide leading-edge high power solutions in a very compact footprint.”, says Director of Business Development, Jens Eltze. “Apex’s patented PQ package addresses the demand from the market for surface mountable devices with top-side cooling.”
The SA111 has a compact design, with the surface mount package, designers are able to maximize the board landscape offerings. This allows for use of multiple devices in circuit designs with high power requirements.
The applications the SA111 could be used for include, MRI gradient coil drive, motor drives, testing and measurement equipment, magnetic bearings, Power Factor Correction (PFC), server fans, and AC-DC and DC-DC converters.
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