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ST and Virscient Team Up for Connected-Car Effort

STMicroelectronics has teamed up with Virscient to help system designers build automotive solutions using ST’s Telemaco3P secure telematics and connectivity processors. Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a comprehensive development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor.

MTP enables the rapid prototyping and development of smart-driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles. Virscient brings a deep understanding of wireless connectivity technologies and protocols ideal for architecting connected-car systems that rely on technologies such as GNSS (Precise Positioning), LTE/cellular modems, V2X technologies, Wi-Fi, Bluetooth and Bluetooth Low Energy (BLE).

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded Hardware Security Module (HSM), an independent Arm Cortex-M3 subsystem, and a rich set of connectivity interfaces. With security at its core, and considerable flexibility in both hardware and software configurations, the Telemaco3P provides an excellent platform for connectivity within the vehicular environment.

ST’s Telemaco3P system-on-chip is designed as a solution for ensuring a secure connection between the vehicle and the Cloud. Its asymmetric multi-core architecture provides powerful application processors as well as an independent CAN control subsystem with optimized power management. Its ISO 26262 silicon design, its embedded Hardware Security Module, and automotive-grade qualification up to 105°C ambient temperature make it well suited for implementing a wide range of secure telematics applications supporting high-throughput wireless connectivity and over-the-air firmware upgrades.

STMicroelectronics | www.st.com
Virscient | www.virscient.com

 

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