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Firms Team to Craft Single-Chip for Next-Gen IoT Networks

GlobalFoundries and VeriSilicon have inked a deal to deliver the industry’s first single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF’s 22FDX FD-SOI technology, the companies plan to develop IP that could enable a complete cellular modem module on a single chip, including integrated baseband, power management, RF radio and front-end module combining both Narrowband IoT (NB-IoT) and LTE-M capabilities.

Global Foundries Picture4

GF and VeriSilicon are developing a suite of IP to enable customers to create single chip cost- and power-optimized solutions for worldwide deployment, based on a dual-mode carrier-grade baseband modem with integrated RF front-end module. The design will be fabricated using GF’s 22FDX process, which leverages a 22nm FD-SOI technology platform. The technology provides cost-effective scaling and power reduction for IoT applications. According to GlobalFoundries, 22FDX is the only technology that allows efficient single-chip integration of RF, transceiver, baseband, processor, and power management components. This integration is expected to deliver more than an 80 percent improvement in both power and die size compared to today’s 40nm technologies.

GF and VeriSilicon expect to tape out a test chip based on the integrated solution, with silicon validation in Q4 2017. The companies plan to pursue carrier certification in mid-2018.

GlobalFoundries | www.globalfoundries.com


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