Article Materials and Resources

July (issue #336) Circuit Cellar

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p. 6: Op Amp Design Techniques: Analog Adventures, By Stuart Ball

Analog Devices |

p. 12: MCU-Based Motor Condition Monitoring: Sensors and Signals, By Amit Ashara

Texas Instruments |

p. 18: Wire Wrapping Revisited: For Prototypes and Projects, By Wolfgang Matthes

[1]   Matthes, Wolfgang: Microcontroller Modules for the Ambitious. Circuit Cellar, Issue 312, July 2016, S. 24-33.
[2]   Solderless Wrapping Manual. Doc-No. 130031371A. Honeywell Computer Control Division, November 1967.
[3]   Design Parameters for Wire-Wrap. Gardner-Denver Company, 1962.
[4]   Kilgrease, D. L.: Mechanization of Engineering Design Data. IBM, 1962.
[5]   Winters, Ryan: Wire wrapping vs. soldering: How and When to Use Wire Wrapping.
[6]   Xcelite Catalog. Apex Tool Group, LLC, 2014.
[7]   Tools for Telecom, Datacom, Electrical, and Electronics. JDV Products, Inc., 2018.[8]   Jonard Tools Catalogue No. 114. Jonard Tools, 2018.
[9]   Hookup Wire Catalog. Lit. No. HUW-Bro-1501. Alpha Wire, 2015.
[10] Wire-Wrap-Draht. Rollenware und konfektioniert. Catalog sheet (German).
[11] BPS BusBoard Prototype Systems 2016 Fall Product Catalog Rev 1610. BPS BusBoard Prototype Systems Ltd., 2016.
[12] Prototyping Products and accessories for the Eurocard/19″ Technology Market. Vero Catalogue 05.1. Vero Technologies Limited, 2005.
[13] Uncommitted and Microbus backplanes are an effective interconnect technology for general purpose small systems (16 05 Backplane white paper V2 25 May 16.).  Vero Technologies Limited, 2016.

Extra Information:

The author’s project homepage:

Historical documents ([2] to [4)]:

Tools ([6] to [8]):

Wire ([9]):

Pre-cut and pre-stripped wire [10]:

Prototyping Boards ([11] to [13]):

Alpha Wire |
BusBoard Prototype Systems |
Seltronics |
Vero Technologies |

Scroll down to the end of this web page to see the ADDENDUM  where we’ve posted several extra photos. These are photos that we were unable to fit into the print issue of Wolfgang Matthes’ article.

p. 26: MPEG-H Audio Brings New Dimensions to TV Sound, By Stefan Meltzer

Information on the MPEG-H Audio System is available at

Fraunhofer IIS |
upHear |

p. 30: EMC Analysis During PCB Layout: Catch Issues Earlier, By Craig Armenti

Mentor, A Siemens Business |

p. 34: Wireless Standards and Solutions for IoT: Protocol Choices Abound, By Jeff Child

Cypress Semiconductor |
Nordic Semiconductor |
NXP Semiconductor |
STMicrolectronics |
Texas Instruments |

p. 40: IoT Drives Extreme Low-Power Demands: Enabling “Always On”, By Jeff Child

Eta Compute |
Imprint Energy |
Nikola Labs |
Semtech |
Wiliot |

p. 44: IoT Interface Modules: Ready to Connect, By Jeff Child

Device Solutions |
Digi |
Espressif |
InnoComm Mobile Technology |
Jorjin Technologies |
NXP Semiconductor |
Rigado |
Telit |
U-blox |

p. 48: EMBEDDED SYSTEM ESSENTIALS: Verifying Code Readout Protection Claims: Think Like an Attacker, By Colin O’Flynn

ST Microelectronics. “STM32F303xB/C/D/E Reference Manual RM0316”.

ST Microelectronics. “USART protocol used in the STM32 bootloader. Application Note AN3155”.

Chris Gerlinsky. “Breaking Code Read Protection on the NXP LPC-family Microcontrollers”. RECON Brussels 2017.

Johannes Obermaier and Stefan Tatschner. “Shedding too much Light on a Microcontroller’s Firmware Protection”. WOOT ’17.

NXP Semiconductors |
STMicroelectronics |

p. 54: ABOVE THE GROUND PLANE: BLDC Fan Current: Motors and Measurements, By Ed Nisley

Background Circuit Cellar columns:

  • 2014-11 Universal Motor Control vs. Transistor SOA
  • 2015-01 Brute-force Motor Control
  • 2018-03 Stepper Motor Waveforms

Background blog posts:


p. 60: THE CONSUMMATE ENGINEER: Thermoelectric Cooling (Part 1): Failure Analysis, By George Novacek

[1] Peltier module TEC12706 Specification
[2]  Circuit Cellar 310, May 2016, George Novacek “Electronics Cooling”
[3] Adafruit Peltier Module Assembly
[4] Peltier Application Note
[5] Texas Instruments: Closed Loop Temperature Regulation

Adafruit |
Maxim Integrated |
Peltier Modules |
Texas Instruments |

p. 64: FROM THE BENCH: Electronic Speed Control (Part 1): Motor Evolution,
By Jeff Bachiochi

Figure 1 and Figure 2:

Figure 3:

PIC12F1822: 8-pin Flash Microcontroller : Microchip Technology

ESC-30A: 30A Brushless Motor Speed Controller RC BEC ESC:
Various brands available

2408 Brushless Outrunner Motor: Various brands available

Microchip Technology |
Propwashed |
Renesas Electronics |

ADDENDUM:  Provided here are several photos that we were unable to fit into the print version of “Wire Wrapping Revisited” by Wolfgang Matthes

More modules examples (similar to Figure 1):

Relay and power modules to be stacked onto a microcontroller module. Obviously, such a module must be located at the top. Therefore, it is no call to provide additional stackable connectors.

Stackable modules with housings that match. It looks fine. However, one can only use the respective module. Multi-module configurations are obviously not supported.


The small application system to the left consists of a microcontroller board and an LCD module. Obviously, it is not that easy to add further modules. But what to do if the two buttons are not enough? Here, a keypad and a connector for a PS/2 keyboard are shown. However, the parts have to be connected by jumper wires. They must be deposited loosely on the table or held in the hand because the boards do not even have mounting holes.

More application examples (similar to Figure 4 and Figure 5:

Experimenting with LEDs and relays.


LED-array modules can be inserted horizontally or vertically (the latter, for example, to demonstrate bar graph displays).

Article Materials for Circuit Cellar Magazine Issue 336 • July 2018 — Get a PDF of the Issue

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July (issue #336) Circuit Cellar

by Circuit Cellar Staff time to read: 4 min