Secure Wi-Fi MCU Provides IoT Connectivity Solution

Espressif Systems has announced the release of the ESP32-S2 Secure Wi-Fi MCU, a highly integrated, low-power, 2.4 GHz Wi-Fi SoC supporting Wi-Fi HT40 and 43 GPIOs. Based on the Xtensa single-core 32-bit LX7 processor, ESP32-S2 can be clocked at up to 240 MHz.

With state-of-the-art power management and RF performance, IO capabilities and security features, ESP32-S2 is well suited for a wide variety of IoT or connectivity-based applications, including smart home and wearables. With an integrated 240 MHz Xtensa core, ESP32-S2 is sufficient for building the most demanding connected devices without requiring external MCUs.

Features:

  • CPU and Memory
    • Xtensa single-core 32-bit LX7 microcontroller
    • 7-stage pipeline
    • Clock frequency of up to 240 MHz
    • Ultra-low-power co-processor
    • 320 kB SRAM, 128 kB ROM, 16 KB RTC memory
    • External SPIRAM (128 MB total) support
    • Up to 1 GB of external flash support
    • Separate instruction and data cache
  • Connectivity
    • Wi-Fi 802.11 b/g/n
    • 1×1 transmit and receive
    • HT40 support with data rate up to 150 Mbps
    • Support for TCP/IP networking, ESP-MESH networking, TLS 1.0, 1.1 and 1.2 and other networking protocols over Wi-Fi
    • Support Time-of-Flight (TOF) measurements with normal Wi-Fi packets
  • IO Peripherals
    • 43 programmable GPIOs
    • 14 capacitive touch sensing IOs
    • Standard peripherals including SPI, I2C, I2S, UART, ADC/DAC and PWM
    • LCD (8-bit parallel RGB/8080/6800) interface and also support for 16/24-bit parallel
    • Camera interface supports 8 or 16-bit DVP image sensor, with clock frequency of up to 40 MHz
    • Full speed USB OTG support
  • Security
    • RSA-3072-based trusted application boot
    • AES256-XTS-based flash encryption to protect sensitive data at rest
    • 4096-bit eFUSE memory with 2048 bits available for application
    • Digital signature peripheral for secure storage of private keys and generation of RSA signatures
  • Power Consumption
    • ESP32-S2 supports fine resolution power control through a selection of clock frequency, duty cycle, Wi-Fi operating modes and individual power control of its internal components.
    • When Wi-Fi is enabled, the chip automatically powers on or off the RF transceiver only when needed, thereby reducing the overall power consumption of the system.
    • ULP co-processor with less than 5 uA idle mode and 24 uA at 1% duty-cycle current consumption. Improved Wi-Fi-connected and MCU-idle-mode power consumption.
  • Software
    • ESP32-S2 supports Espressif’s software development framework (ESP-IDF), which is a mature and production-ready platform, already used by millions of devices deployed in the field. Availability of common cloud connectivity agents and common product features shortens the time to market.

Engineering samples of ESP32-S2 beta are available this month (June).

Espressif Systems | www.espressif.com

8 GHz 12-bit ADC Boasts 10.5 GSPS Sampling Rate

Texas Instruments (TI) has introduced a new ultra-high-speed ADC with what it claims is the industry’s widest bandwidth, fastest sampling rate and lowest power consumption. The ADC12DJ5200RF helps engineers achieve high measurement accuracy for 5G testing applications and oscilloscopes, and direct X-band sampling for radar applications, says TI. The company is demonstrating the ADC12DJ5200RF in booth No. 1272 at the International Microwave Symposium (IMS) in Boston this week (June 4-6).
The ADC12DJ5200RF’s 8 GHz bandwidth enables engineers to achieve as much as 20 percent higher analog input bandwidth than competing devices, which gives engineers the ability to directly digitize very high frequencies without the power consumption, cost and size of additional down-conversion. In dual-channel mode, the ADC12DJ5200RF samples at 5.2 GSPS and captures instantaneous bandwidth (IBW) as high as 2.6 GHz at 12-bit resolution. In single-channel mode, the new ultra-high-speed ADC samples at 10.4 GSPS and captures IBW up to 5.2 GHz.

As the first standalone GSPS ADC to support the JESD204C standard interface, according to TI, the ADC12DJ5200RF helps minimize the number of serializer/deserializer lanes needed to output data to field-programmable gate arrays (FPGAs), enabling designers to achieve higher data rates.

TI says the ADC12DJ5200RF has the highest available dynamic performance across power-supply variations, even at minimum specifications, which improves signal intelligence by providing ultra-high receiver sensitivity to detect even the smallest and weakest signals. In addition, the device includes internal dither which improves spurious-free performance.

High measurement accuracy means the device greatly minimizes system errors with offset error as low as ±300 µV and zero temperature drift. Engineers designing test and measurement equipment can achieve high measurement repeatability by taking advantage of the extremely low code error rate (CER) of the ADC12DJ5200RF, which is more than 100 times better than competing devices.

At 10 mm by 10 mm – 30 percent smaller than discrete solutions – the ADC12DJ5200RF helps engineers save board space. This ADC also requires a reduced number of lanes, which further allows for a smaller printed circuit board design. Engineers can minimize heat dissipation and simplify overall thermal management in their designs with the ADC12DJ5200RF 4-W power consumption, 20 percent lower than competitive ADCs.

The ADC12DJ5200RF is pin-compatible with the following other TI GSPS ADCs to provide an easy upgrade path from 2.7 GSPS to 10.4 GSPS, and minimizes the time and cost of redesign: ADC12DJ3200, ADC12DJ2700 and ADC08DJ3200. The ADC12DJ5200RF dual- and single-channel ultra-high-speed ADC is available for sampling through the TI store. The device is in a 144-ball, 10-by-10-mm flip-chip ball grid array (FCBGA) package.

Texas Instruments | www.ti.com

Dual-Core MCUs Blend High Performance and Enhanced Security

STMicroelectronics has announced new STM32H7 MCUs which it claims are the industry’s highest-performing Arm Cortex-M general-purpose MCUs, combining dual-core performance with power-saving features and enhanced cyber protection. The new devices leverage a 480 MHz version of the Cortex-M7, the highest performing member of Arm’s Cortex-M family, and add a 240 MHz Cortex-M4 core.

With ST’s smart architecture, efficient L1 cache, and adaptive real-time ART Accelerator, the MCUs set new speed records at 1327 DMIPS and 3224 CoreMark executing from embedded flash. ST’s Chrom-ART Accelerator provides a boost to graphics performance. To maximize energy efficiency, each core operates in its own power domain and can be turned off individually when not needed.
Developers can easily upgrade existing applications through flexible use of the two cores. They can add a sophisticated user interface to an application such as a motor drive formerly hosted on a single-core Cortex-M4 MCU by migrating legacy code to the STM32H7 Cortex-M4 with the new GUI running on the Cortex-M7. Another example is to boost application performance by offloading intensive workloads such as neural networks, checksums, DSP filtering or audio codecs.

The dual-core architecture also helps simplify code development and accelerate time to market in projects where user-interface code may be developed separately from real-time control or communication features.

STM32H7 MCUs come with pre-installed keys and native secure services including Secure Firmware Install (SFI). SFI lets customers order standard products anywhere in the world and have the encrypted firmware delivered to an external programming company without exposing unencrypted code. In addition, built-in support for Secure Boot and Secure Firmware Update (SB-SFU) protects Over the Air (OTA) feature upgrades and patches.

Compared to flash-less processors, STM32H7 MCUs deliver high performance with the extra advantage of up to 2 MB Flash and 1 MB SRAM on-chip, says ST. This helps to better handle space constraints and simplify the design of smart objects in industrial, consumer and medical applications with real-time performance or AI-processing requirements. Moreover, the Cortex-M7 level 1 cache and parallel and serial memory interfaces offer unlimited and fast access to external memory.

Additional advanced features include Error Code Correction (ECC) for all flash and RAM memory to increase safety, multiple advanced 16-bit ADCs, external ambient-temperature range up to 125°C allowing use in severe environments, an Ethernet controller and multiple FD-CAN controllers giving communication-gateway capabilities, and ST’s latest high-resolution timer for generating precision waveforms.

ST has already extended the STM32Cube ecosystem by adding STM32CubeH7 firmware modules with application source code, including graphical solutions based on TouchGFX and STemWin graphical-stack library. There are also new Evaluation, Discovery and Nucleo boards. Developers can leverage all the standard elements of the STM32Cube development environment, including the ST-MC-SUITE motor-control toolkit, STM32Cube.AI machine-learning toolkit, STM32CubeMX, STM32CubeProgrammer and certified partner solutions for STM32.

STM32H7 dual-core MCUs are entering production and samples are available now. A broad selection of packages is offered, including WLCSP. Budgetary pricing starts at $8.19 for orders of 10,000 pieces The STM32H7 single-core MCUs including the Value line are also available at a budgetary pricing starting from $3.39 for orders of 10,000 pieces.

STMicroelectronics | www.st.com

SiC Power Device Family Targets Electric Vehicle Needs

Microchip Technology, via its Microsemi subsidiary, has announced the production release of a family of Silicon Carbide (SiC) power devices that leverage the ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip’s broad range of MCUs and analog solutions, the SiC devices join the company’s family of SiC products designed to meet the needs of Electric Vehicles (EVs) and other high-power applications in fast-growing markets.

Microchip’s 700 V SiC MOSFETs and 700 V and 1200 V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC power modules. The more than 35 discrete products that Microchip has added to its portfolio are available in volume, supported by development services, tools and reference designs.. The company’s family of SiC die, discretes and power modules span a wide range of voltage, current ratings and package types.

The SiC MOSFETs and SBDs offer more efficient switching at higher frequencies and pass ruggedness tests at levels considered critical for guaranteeing long-term reliability, says Microchip. The company’s SiC SBDs perform approximately 20 percent better than other SiC diodes in these Unclamped Inductive Switching (UIS) ruggedness tests that measure how well devices withstand degradation or premature failure under avalanche conditions, which occur when a voltage spike exceeds the device’s breakdown voltage. Microchip’s SiC MOSFETs also outperform alternatives in these ruggedness tests, demonstrating excellent gate oxide shielding and channel integrity with little lifetime degradation in parameters even after 100,000 cycles of Repetitive UIS (RUIS) testing.

Microchip Technology | www.microchip.com

Tiny Snapdragon 820E Module Boasts Long Lifecycle Support

By Eric Brown

Intrinsyc’s $259 “Open-Q 820Pro μSOM” module runs Android 9 or Debian Linux on a quad-core, up to 2.34GHz Snapdragon 820E and offers long lifecycles, 4GB LPDDR4, 32GB flash, WiFi-ac, and an optional $499 dev kit.

The Open-Q 820Pro μSOM is a pin-compatible drop-in replacement for the two-year old Open-Q 820 µSOM and offers a similar layout and 50 x 25mm footprint. The biggest difference is an upgrade from Qualcomm’s Snapdragon 820 to the faster, second-gen Snapdragon 820E, an embedded-focused version with long lifecycle support. As a result, the Open-Q 820Pro μSOM has a 9 percent faster CPU and 5 percent faster GPU at the same power consumption, claims Intrinsyc.

 
Open-Q 820Pro μSOM (left) and Open-Q 820Pro µSOM Development Kit 
(click images to enlarge)
The Snapdragon 820E clocks two of its Cortex-A72-like Qualcomm Kryo cores to 2.342GHz, up from 2.0GHz, and the other two at the same 1.593GHz rate. The SoC’s Adreno 530 GPU has bumped up to 652.8MHz and the Hexagon 680 DSP is clocked at 825MHz.

The Open-Q 820Pro μSOM, which supports Debian Linux and Android 9, further improves performance by advancing from 3GB to 4GB LPDDR4 RAM. As before, there’s 32GB UFS 2.0 flash, as well as 2×2 MU-MIMO 802.11a/b/g/n/ac via a Qualcomm QCA6174A chipset. You also get Bluetooth 4.2 BLE, up from 4.1, and the same Qualcomm IZat Gen 8C GNSS location module.

Otherwise, the 820Pro module is pretty much the same as the 820. For displays, you get an HDMI port and dual MIPI-DSI ports for triple display support at up to 4K @ 60fps video. Three MIPI-CSI connectors can drive cameras at up to 28 megapixels.

 
Open-Q 820Pro μSOM, front and back
(click images to enlarge)
The Open-Q 820 µSOM is further equipped with USB 3.0 and USB 2.0 client and host ports, dual PCIe 2.1 expansion interfaces, an SDIO interface, and an 8x BLSP 4-pin port configurable as I2C, SPI, UART, or GPIO.

For audio, the module provides Slimbus and 2x or 3x I2S digital audio connections. There’s no longer any mention of the 3x digital mic connections or the 6x analog in and 6x analog out interfaces. However, the dev kit does offer analog audio I/O. Intrinsyc also lists a sensor interface defined as “SPI, UART, I2C to sensor DSP core.”

The module runs on 3.6V to 4.2V power, and supports extended temperatures of -10 to 70°C. No details were listed for the long lifecycle claims, but the Snapdragon 820E was announced with 10-year support. Software updates are required to achieve the long-term and performance improvements.

Open-Q 820Pro µSOM Development Kit

The Mini-ITX form-factor, open-frame dev kit for the module appears to be similar to the earlier model. The 170 x 170mm Open-Q 820Pro µSOM Development Kit is equipped with an HDMI port and there’s an optional $150 4K touch panel with a smartphone form factor.

 
Open-Q 820Pro µSOM Development Kit, front and back
(click images to enlarge)
The triple MIPI-CSI interfaces are supported with an optional, 13-megapixel camera for $159. Audio features include a 3.5mm headset jack, a 20-pin header with 3x analog in and 3x digital in, and a 20-in audio output with 5x analog out and 1x digital in.

The Open-Q 820Pro µSOM Development Kit offers 2x USB 2.0 host ports and 2x USB 3.0 via an expansion header. There’s also a micro-USB 2.0 client port and a micro-USB based UART debug port. Other features include a microSD slot, 8-bit DIO, and mini-PCIe 1.2 and PCIe x1 2.1 expansion slots.

The dev kit supplies a 12V/3A input but can run on a single-cell Li-ion battery. There’s also a haptic output and LEDs.

Further information

The $259 Open-Q 820Pro μSOM and $499 Open-Q 820Pro µSOM Development Kit are available for order with shipments due in July. More information may be found in Intrinsyc’s announcement, as well as the Open-Q 820Pro μSOM and dev kit product pages, which link to shopping pages.

This article originally appeared on LinuxGizmos.com on June 12.

Intrinsyc | www.intrinsyc.com

Next Newsletter: Embedded Boards

Coming to your inbox tomorrow: Circuit Cellar’s Embedded Boards newsletter. Tomorrow’s newsletter content focuses on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

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Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Analog & Power. (7/2) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AC-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (7/9) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

IoT Technology Focus. (7/16) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Low-Profile 180 W AC-DC Power Supplies Provide 94% Efficiency

XP Power has launched a new range of 180-Watt U-channel AC-DC power supplies that are intended for space-constrained medical (BF), industrial and IT applications. The low-profile devices are just 29.5 mm high and occupy a small 107.6 mm x 62.8 mm footprint, allowing them to be used in high-density designs. The units are suitable for Class I and Class II operation and offer 2 x MOPP (Means of Patient Protection) of isolation while delivering up to 94% efficiency.

The UCP180 series PSUs have an integrated 12 V, 500 mA fan output, eliminating the need for any external driver circuitry. When used in conjunction with a fan delivering 10 CFM airflow, they can deliver 180 W of power to a load – a power density of 14.2 W/in³. They are also suited for use in convection cooled applications where they deliver 120W (9.4 W/in³). The U-channel construction provides a robust housing, an optional cover is available for applications where the unit may be user-accessible.

Suitable for medical (BF) applications, the PSUs are approved to EN60601-1 and offer 2xMOPP of isolation (4kV) and low leakage current (50µA), making them suitable for use in BF applied part applications. Additional approvals including IEC60950-1-1 and IEC62368-1, and EMC performance that meets EN61000-4, make them suitable for a wide range of applications including ITE and industrial.

There are a total of seven variants offering single outputs of 12 V, 15 V, 18 V, 24 V, 28 V, 36 V and 48 V in the series. All devices have a universal input range of 85 to 264VAC and offer up to 94% efficiency while consuming <0.5W with no load. The operating temperature range is -40°C (-20°C for 180W load) to +70°C with no derating required below +50°C in either force cooled or conduction cooled applications.

The UCP180 is available from Allied Electronics, Digi-Key, element14, Farnell, Newark, RS Components, approved regional distributors, or direct from XP Power and come with a 3-year warranty.

XP Power | www.xppower.com

 

EOG-Controlled Video Game

Eyes as Interface

There’s much be to learned about how electronics can interact with biological signals—not only to record, but also to see how they can be used as inputs for control applications. With ongoing research in fields such as virtual reality and prosthetics, new systems are being developed to interpret different types of signals for practical applications. Learn how these three Cornell graduates use electrooculography (EOG) to control a simple video game by measuring eye movements.

By Eric Cole, Evan Mok and Alex Huang

The human eye naturally acts as a dipole, in which the retina at the back of the eye is negatively charged, and the cornea at the front of the eye is positively charged. EOG is a recording technique that measures this potential difference, and can be used to

Figure 1
Electrode placement for recording. An Ag-AgCl (silver-silver chloride) electrode was placed at each of the labeled points. Points A and B record the EOG signal for the right and left eyes, and point C provides a ground reference.

quantify eye movement [1]. A typical electrode placement pattern for EOG is shown in Figure 1. Each of the electrodes A and B records a voltage related to eye movement, and an electrode at point C serves as a ground reference.

When a user looks left, the cornea is close to electrode B and it records a positive voltage, while the retina is closer to electrode A, yielding a negative voltage. Similarly, looking right produces a negative voltage at B and a positive voltage at A. The difference between VB and VA relative to ground at C changes monotonically with gaze direction, and can be reliably used to model horizontal eye movement.

System Overview

The system we designed uses eye movements to play a video game on a display screen. Electrodes are placed on a player’s head to record only the horizontal EOG signal as shown in Figure 2. This signal is then filtered and amplified via an analog circuit and sent to an ADC on a Microchip Technology PIC32 microcontroller (MCU) (Figure 3). The PIC32 MCU stores the reading as a digital value and uses it to control a cursor on an LCD display screen. A program on the PIC32 continually displays obstacles that move across the screen, and the player moves his or her eyes to control the cursor and avoid obstacles.

Figure 2
Characterization of EOG signal. An example signal output is shown for a gain of approximately 885.

Figure 3
System overview. “Eye recording” is accomplished with the raw electrode signal.

This system is entirely powered without connection to an AC power source, instead using a 9 V battery to provide power for amplification and a chargeable power source to power the PIC32. This choice of a power source was important, because it enforces necessary safety considerations for biomedical recording. Connecting a high voltage source to a human user and accidentally completing a circuit path to AC ground could result in serious injury, so great care was taken to use battery power for this project.

A secondary oscilloscope program was also necessarily designed to satisfy a key safety need: The ability to view the recorded EOG signal and test the recording hardware while the circuit is isolated. A normal oscilloscope cannot be used for this purpose for the reasons stated earlier. Care was also taken to apply and fasten the electrodes properly before every session.

Recording and Application

Three Ag-AgCl (silver-silver chloride) electrodes are placed around the eyes using a skin-safe adhesive gel—one beside each eye, and one on the forehead as a ground reference—at points A, B, and C respectively, in Figure 1. These electrodes provide the gateway between the biological signal and the digital world, detecting the voltage generated by ions at the skin surface and transducing it into an equivalent electron-based signal.

This voltage is generated directly at the eye, and has some attenuation through the skin surface. A typical magnitude of the raw EOG signal is several millivolts. The voltage readings from the two eye electrodes are sent to a Texas Instruments (TI) INA121 differential amplifier, which amplifies the difference between the two input signals. This yields a negative or positive voltage based on direction of eye movement. The INA121 provides low noise, a high common-mode rejection ratio, and is suitable for the high-input impedance requirement associated with recording biological signals. Figure 4 shows the full schematic of the implementation.

A second amplification stage using a TI LM358-based balanced subtractor configuration provides further amplification. This stage reduces the DC voltage component output from the differential amplifier, while further amplifying the difference to a range of 0 to 3.3 V—the scale allowed by the PIC32 MCU’s on-chip ADC. The resulting signal is a voltage centered at approximately 1.6 V when the user looks straight, with about a 1 V increase or decrease when the user looks left or right, respectively. …

Read the full article in the July 348 issue of Circuit Cellar
(Full article word count: 3023 words; Figure count: 6 Figures.)

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Note: We’ve made the October 2017 issue of Circuit Cellar available as a free sample issue. In it, you’ll find a rich variety of the kinds of articles and information that exemplify a typical issue of the current magazine.

July (issue #348) Circuit Cellar Article Materials

Click here for the Circuit Cellar article code archive

p.6: EOG-Controlled Video Game: Eyes as Interface, By Eric Cole, Evan Mok
                   and Alex Huang

References:
[1] Merino M, Rivera O, Gomez I, Molina I, Dorronzoro E. 2010. A Method of EOG Signal Processing to Detect Eye Movement. 2010 First International Conference on Sensor Device Technologies and Applications, Venice, 2010, pp. 100-105.
[2] ProtoThreads, Adam Dunkels: http://dunkels.com/adam/pt/
[3] AdaFruit TFT Graphics Library. Ported by Syed Tahmid Mahbub.

Adafruit | www.adafruit.com
Microchip Technology | www.microchip.com
Texas Instruments | www.ti.com

p.12: Macros for AVR Assembler Programming: Tools of the Machine Code Trade,
By Wolfgang Matthes

Table supplementing Figure 3:

References:
[1] Hyde, Randall: Writing Great Code, Voume 2: Thinking Low-Level, Writing High-Level. No Starch Press, San Francisco, 2006.
[2]  Dalrymple, Monte: Microprocessor Design Using Verilog HDL.
available from KCK Media, purchase it here.
[3] Li, Yamin: Computer Principles and Design in Verilog HDL. Wiley, 2015.
[4] Hyde, Randall: The Art of Assembly Language. No Starch Press, San Francisco, 2003.
[5] Margush, Timothy S.: Some Assembly Required: Assembly Language Programming with the AVR Microcontroller. CRC Press, 2016.
[6] Lyashko, Alexey: Mastering Assembly Programming. Packt Publishing, 2017.
[7] Matthes, Wolfgang: Microcontroller Modules for the Ambitious.
Circuit Cellar 312, July 2016, p. 24-33.

Files available on Circuit Cellar code and files download page.

The author’s project homepages:
https://www.controllersandpcs.de/projects.htm
https://www.realcomputerprojects.dev

The AVR microcontrollers:
www.microchip.com

Microchip Technology | www.microchip.com

p.26: Building a Smart Frying Pan: Connected Control for Chef, By Joseph Dwyer

References:
[1] Sean Carroll’s Board on the ECE Site
https://people.ece.cornell.edu/land/courses/ece4760/PIC32/target_board.html
[2] Spark fun MAX Board Tutorial:
https://github.com/sparkfun/SparkFun_MAX31855K_Thermocouple_Breakout_Arduino_Library
[3] Bluetooth nr8001 Tutorial
https://learn.adafruit.com/getting-started-with-the-nrf8001-bluefruit-le-breakout/introduction
[4] Bluefruit App
https://learn.adafruit.com/getting-started-with-the-nrf8001-bluefruit-le-breakout/software-bluefruit

Xbee Tutorial
http://www.instructables.com/id/How-to-Use-XBee-Modules-As-Transmitter-Receiver-Ar/

Bill of Materials:

Part Number (PN) Vendor Cost Quantity
Small PIC32 Board Course Laboratory 4 2
XBP24-AWI-001-ND Digikey 19.29 2
MAX31855K Sparkfun 14.95 2
HH-K-20 Thermocouple OMEGA 4.95 2
PIC32MX250F128B Course Laboratory 5 2
9V Battery Amazon 2 2
Bluetooth nRF8001 1697 Adafruit 19.95 1
Breadboards Amazon 6 2

Adafruit | www.adafruit.com
Microchip Technology | www.microchip.com
Nordic Semiconductor | www.nordicsemi.com
Sparkfun | www.sparkfun.com

p.32: Inrush Current Limiters in Action: Circuit Guardians, By Matt Reynolds

TDK Electronics | www.tdk-electronics.tdk.com

p.36: Embedded Solutions Enable Smarter Railway Systems:
Computing, Connectivity and Control,  
By Jeff Child

ADLINK Technology | www.adlinktech.com
Advantech | www.advantech.com
Axiomtek | us.axiomtek.com
Cincoze | www.cincoze.com
Ibase Technology | www.ibase.com.tw
Kontron | www.kontron.com
MEN Micro | www.menmicro.com
Neousys Technology | www.neousys-tech.com
SYSGO | www.sysgo.com

p.44: FPGAs Flex Their DSP Muscles: Pros at Signal Processing, By Jeff Child

Achronix Semiconductor | www.achronix.com
Flex Logix Technologies | www.flex-logix.com
Intel | www.intel.com
Lattice Semiconductor | www.latticesemi.com
Xilinx | www.xilinx.com

p.48: PRODUCT FOCUS:  IoT Interface Modules: Smart Solutions, By Jeff Child

Device Solutions | www.device-solutions.com
Digi | www.digi.com
Espressif | www.espressif.com
InnoComm Mobile Technology | www.innocomm.com
Jorjin Technologies | www.jorjin.com
NXP Semiconductor | www.nxp.com
Rigado | www.rigado.com
Telit | www.telit.com
U-blox | www.u-blox.com

p.52: PICKING UP MIXED SIGNALS: Variable Frequency Drive (Part 1):
               Washing Machine Repurposed, By Brian Millier

Analog Devices | www.analog.com
Cypress Semiconductor | www.cypress.com
Digi-Key | www.digi-key.com
Infineon Technologies | www.infineon.com
NXP Semiconductor | www.nxp.com
Tektronix | www.tektronix.com
Siglent Technologies | www.siglent.com
Silicon Labs | www.siliconlabs.com

p.58: EMBEDDED SYSTEM ESSENTIALS: A Look at Cores
                  with TrustZone-M: Security Scrutinized, By Colin O’Flynn

The paper “Cross-Domain Power Analysis Attacks” is available there:
https://github.com/colinoflynn/xdomain-dpa-m23

The Return Oriented Programming attack was discussed in Colin’s article “The Populist Side-Channel Attack: An Overview of Spectre” in Circuit Cellar 334, May 2018.

NXP Semiconductors | www.nxp.com
Microchip Technology | www.microchip.com
Nuvoton | www.nuvoton.com
STMicroelectronics | www.st.com

p.64: THE CONSUMMATE ENGINEER: Energy Monitoring (Part 2):
              Tracking Electric Power, By George Novacek

References:
[1] Current Transformer SCT019-200A – http://www.yhdc.us/ENpdf/SCT019-200-0-200A-0-0.33V_en.pdf
[2] Logger Device Tracks Amp Hours by William Wachsmann, Circuit Cellar 327 (October 2017) and Circuit Cellar 328 (November 2017).

Microchip Technology | www.microchip.com

p.68: FROM THE BENCH: Windless Wind Chimes (Part 2): My MIDI Upgrade,
By Jeff Bachiochi

References:
[1] www.midi.org
[2] www.homedepot.com/p/Alexandria-Moulding-1-in-x-1-in-x-96-in-Metal-Mira-Lustre-Round-Tube-Moulding-AT012-AM096C03/205576699

Figure 1                source:   www.midi.org
Figure 2                source:   www.midisolutions.com

Adafruit | www.adafruit.com
Microchip Technology | www.microchip.com

p.79: The Future of Autonomous Cars: Sensors, Software and More Sensors,
By James Fennelly

References:
[1] SAE Levels of Automation

ACEINNA | www.aceinna.com/inertial-systems

VersaLogic’s New Android Demo/Eval Kit – Enter to win

VersaLogic’s new Android Eval Kit provides an easy way to evaluate Arm/Android performance for rapid design and application development. It includes everything needed to run the Android OS on a high-reliability embedded system, including a Arm-based embedded computer board, and a touch-screen display. No additional carrier cards, companion boards, or other add-ons are needed.

The Android Eval Kit is designed to save start-up time and allow the user to focus on their product development.

Win one of your own! – Enter Here

The kit includes:
• 7″ 1024 x 600 HDMI Touch-screen flat panel display
• Tetra Single Board Computer (SBC) with Quad-core i.MX6
• Pre-loaded Android (Oreo 8.0) on MicroSD card
• Wall power adapter
• USB Hub
• Start-up guide
• Required cables

mmWave Chipset Solution Eases 5G System Design

Analog Devices has introduced a new solution for millimeter wave (mmWave) 5G featuring high-integrations for next gen cellular network infrastructure. The solution combines ADI’s advanced beamformer IC, up/down frequency conversion (UDC) and additional mixed signal circuitry. ADI is calling this an optimized “Beams to Bits” signal chain.

The new mmWave 5G chipset includes the 16-channel ADMV4821 dual/single polarization beamformer IC, 16-channel ADMV4801 (shown) single-polarization beamformer IC and the ADMV1017 mmWave UDC. The 24- to 30-GHz beamforming + UDC solution forms a 3GPP 5G NR compliant mmWave front-end to address the n261, n257 and n258 bands.

The high channel density, coupled with the ability to support both single- and dual-polarization deployments, greatly increases system flexibility and reconfigurability for multiple 5G use cases while best-in-class equivalent isotropically radiated power (EIRP) extends radio range and density. According to ADI, the company’s experience in mmWave enables system designers to take advantage of world class applications and system design to optimize complete lineups for thermal, RF, power and routing considerations.

Analog Devices | www.analog.com

 

Small Form Factor SBC Serves Up Kaby Lake Processors

American Portwell Technology has launched the WUX-7x00U, a small form factor (SFF) embedded board featuringIntel Core i5 7300U and i3 7100U processors, formerly codenamed Kaby Lake. The Intel processors integrate the Intel HD 620 graphics engine with 24 execution units, enabling enhanced 3D graphics performance and higher speed for 4K encode and decode operations. Portwell says the embedded board is well suited for applications such as medical equipment, IoT gateway, industrial automation, warehouse automation, digital signage and more.

Portwell’s WUX-7x00U embedded board, designed with a compact footprint (101.6 mm x 101.6 mm; 4˝x 4˝), features up to 32 GB DDR4 (2133 MHz) SDRAM and multiple storage interfaces like 1x SATA III port and 1x M.2 Key M for SSD. For functionality extension, it provides 3x USB 3.0 ports and 1x USB 3.0 Type-C port. The powerful Intel 620 HD graphics engine can support triple display with onboard 1x DisplayPort (DP) and 2x HDMI connector with resolution up to 4096 x 2304. Moreover, WUX-7x00U integrates with 1x M.2 Key E for wireless module connectivity including Wi-Fi and Bluetooth which makes it become an ideal solution for communication and IoT applications.

The Portwell WUX-7x00U delivers efficient computing and graphic performance, yet it operates with thermal design power (TDP) of 15 W. The integrated low-profile fan ensures long-time and stable operation. With the wide voltage power input from 12V to 19V, it provides the flexibility for various power sources. With its ingenious design and multi-core processing power via Intel Core processors the Portwell WUX-7x00U embedded board is equipped with the ability to execute an extensive array of applications that demand processing power as well as I/O and wireless connectivity such as digital signage, industrial automation, video analytics-based appliances and IoT gateway devices.

American Portwell Technology | www.portwell.com

 

 

Arm-Based Industrial Panel PC is Designed for IoT Applications

Advantech has announced the TPC-71W, the new generation of its industrial panel PCs aimed at machine automation and web-terminal applications. TPC-71W is a cost-efficient, Arm-based industrial panel PC that features a 7” true-flat display with P-CAP multi-touch control and an NXP Arm Cortex-A9 i.MX 6 dual/quad-core processor to deliver high-performance computing. The system also features a serial port with a termination resistor that supports the CAN 2.0B protocol and offers a programmable bit rate of up to 1 Mb/s.

Equipped with the Google Chromium embedded web browser and support for various operating systems, including Android, Linux Yocto and Linux Ubuntu with QT GUI toolkits, TPC-71W allows system integrators to easily develop and deploy a wide range of industrial applications. The provision of wireless communication technologies, such as Bluetooth, Wi-Fi and NFC, via a mini PCIe interface simplifies networking and ensures connectivity for data transfers.

TPC-71W also features Power over Ethernet (PoE) functionality for powering devices via Ethernet, thereby eliminating the need to build a power infrastructure. Furthermore, the TPC-71W panel PC supports VESA and panel mounting for flexible and convenient installation. Compared to other similar products, TPC-71W is one of the most competitively priced rugged industrial panel PCs currently available on the market. Overall, this powerful, reliable, and cost-effective computing platform provides the ideal solution for IoT implementation and expansion.

Aimed at the industrial market, TPC-71W is a rugged yet compact, fanless panel PC equipped with an NXP® Arm® Cortex-A9 i.MX 6 dual/quad-core processor, 2 GB DDR3L RAM, and 8 GB eMMC storage to provide high-performance computing and improved efficiency for high-tier industrial applications. The 7” true-flat display with 16:9 aspect ratio features P-CAP multi-touch control for easy and intuitive operation. Moreover, to ensure reliable operation in harsh industrial environments, TPC-71W supports a wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F) and is IP66 rated for protection from dust, oil, and water ingress.

TPC-71W supports various OS, including Android 6, Linux Yocto 2.1, and Linux Ubuntu 16.04 with QT GUI toolkits. Linux is an open-source OS specifically designed to assist system integrators with developing unique applications. The ability to support both Android and Linux eliminates software porting efforts and ensures easy deployment. Moreover, TPC-71W features the Google Chromium embedded web browser that simplifies programming and further facilitates application development.

To ensure connectivity for web-based management, TPC-71W offers Bluetooth, Wi-Fi, and NFC wireless communication capabilities via a mini PCIe interface. The inclusion of a serial port that supports industrial communication interfaces, such as RS-232/485 and the CAN 2.0B protocol, and a LAN port that supports speeds of up to 1000 Mbps (10/100/1000 Mbps) accelerates data transfer rates, while also enabling Wake-on-LAN functions. Furthermore, the TPC-71W panel PC can be equipped with optional PoE functionality for powering devices via Ethernet; this greatly streamlines installations and reduces overall equipment costs.

Key Features:

  • 7” WSVGA LCD with 16:9 aspect ratio and P-CAP multi-touch control
  • NXP Arm Cortex®[C1] -A9 i.MX 6 dual/quad-core processor
  • Up to 2 GB DDR3L RAM and 8 GB of eMMC storage onboard
  • 10/100/1000 Mbps LAN Optional PoE functionality for powering devices via Ethernet
  • Supports Linux Yocto, Linux Ubuntu, and Android OS

Advantech’s TPC-71W 7” industrial panel PC is available for order now.

Advantech | www.advantech.com

 

Tuesday’s Newsletter: IoT Tech Focus

Coming to your inbox tomorrow: Circuit Cellar’s IoT Technology Focus newsletter. Tomorrow’s newsletter covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

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Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Embedded Boards.(6/25) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Analog & Power. (7/2) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (7/9) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

Firms Team for IoT Effort that Nixes Need for Physical SIM Cards

Telit has announced that it is a key partner for Deutsche Telekom’s nuSIM initiative. This is the latest milestone in Telit’s longstanding partnership with Deutsche Telekom to grow the IoT market by providing breakthrough technologies and services, says Telit. The nuSIM initiative takes a fundamentally new approach to IoT system design by moving the subscriber identity module’s (SIM) functionality to the cellular chipset. The IoT device has the mobile operators’ credentials securely programmed during manufacturing, eliminating the need for the traditional physical SIM card.
As a result, the nuSIM architecture streamlines design and manufacturing processes by eliminating the need for contacts, circuit paths, card holders and other components associated with physical SIMs. It also enables ultra-compact device form factors that would not be possible with a physical SIM card, such as healthcare wearables and industrial sensors. nuSIM also maximizes battery life by leveraging advanced power saving methods that are achievable only when the modem and SIM share the same underlying hardware. Each module ships with a fully operational integrated SIM. The solution eliminates overhead costs related to SIM logistics, such as stock keeping and handling.

Telit is a longtime Deutsche Telekom partner and was the first module supplier to become an active contributor in the nuSIM initiative. Telit’s role includes contributing to the nuSIM design process and serving as a test bed for the technology.

Telit | www.telit.com