MCU-Based Solution is Qualified with Alexa Voice Service

NXP Semiconductors has unveiled an MCU based voice control solution qualified with Amazon’s Alexa Voice Service (AVS). This enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add voice control to their products, giving their customers access to rich voice experiences with Alexa. Built on an NXP i.MX RT crossover platform, this MCU-based AVS solution enables low latency, far-field, “wake word” detection; embeds all necessary digital signal processing capabilities; runs on Amazon FreeRTOS; and includes an Alexa client application.
This MCU-based AVS solution provides OEMs with a self-contained, turnkey offering that enables them to quickly add Alexa to their products. It includes the MCU, the TFA9894D smart audio amplifier, optional A71CH secure element and comes with fully integrated software. It also features noise suppression, echo cancellation, beam forming and barge-in capabilities that enable use in acoustically difficult environments.

NXP offers at its Mougins, Sophia-Antipolis facilities a product testing service for Alexa Built-in products, available to its customers desiring to test their devices before submitting to Amazon for final evaluation. If a customer’s product supports music and/or is far-field enabled and uses a “wake word” to initiate interactions with Alexa, additional testing is required prior to submitting products to Amazon for evaluation. This is where Pro-Support Audio Voice Services helps to complete the self-test checklists.

NXP Semiconductors | www.nxp.com

 

960 W DIN Rail Supply Boasts 95% Efficiency

TDK has announced the addition of a 960 W rated model to its DRF series of AC-DC DIN rail mount power supplies. The high 95% efficiency produces less internal waste heat enabling electrolytic capacitors to run cooler, providing a calculated life of in excess of eleven years with a 75% load at 230Vac input. The unit can supply a peak load of 1440W (24V 60A) for up to 4 seconds to power capacitive and inductive loads. Applications include industrial process control, factory automation, and test and measurement equipment.The power supply has a 24 V output, adjustable from 24 V to 28 V, using either the front panel mounted trim potentiometer or an external 5 to 6V source. The input range is 180 to 264 VAC, withstanding surges of up to 300 VAC for 5 seconds. The operating ambient temperature is -25°C to +70oC, -40°C cold start, derating linearly above 50°C to 75% load at 70°C. The DRF series warranty is five years.

The DRF960-24-1 is 123.4 mm tall, 139 mm deep and has a narrow 110 mm width saving both space on the rail and in the cabinet. Remote on/off and a 30 V 1 A rated DC OK relay contact are provided as standard. When in standby mode using the remote on/off function, the power consumption is less than 1 W. Up to five units can be connected in parallel using the droop mode current share, for systems requiring additional power.

Input to output isolation is 3,000 VAC, input to ground 1500 VAC and output to ground 500 VAC. The DRF960 is certified to the safety standards of IEC/UL/CSA/EN 60950-1, UL508 and is CE marked in accordance to the Low Voltage, EMC and RoHS Directives. The unit is compliant to EN 55032-B (radiated and conducted emissions), EN 61000-3-2 harmonics and IEC 61000-4 immunity standards.

TDK-Lambda | www.tdk-lambda.com

 

IoT Monitoring System for Commercial Fridges

Using LoRa Technology

IoT implementations can take many shapes and forms. Learn how these four Camosun College students developed a system to monitor all the refrigeration units in a commercial kitchen simultaneously. The system uses Microchip PIC MCU-based monitoring units and wireless communication leveraging the LoRa wireless protocol.

By Tyler Canton, Akio Yasu, Trevor Ford and Luke Vinden

In 2017, the commercial food service industry created an estimated 14.6 million wet tons of food in the United States [1]. The second leading cause of food waste in commercial food service, next to overproduction, is product loss due to defects in product quality and/or equipment failure [2].

While one of our team members was working as the chef of a hotel in Vancouver, more than once he’d arrive at work to find that the hotel’s refrigeration equipment had failed overnight or over the weekend, and that thousands of dollars of food had become unusable due to being stored at unsafe temperatures. He always saw this as an unnecessary loss—especially because the establishment had multiple refrigeration units and ample space to move product around. In this IoT age, this is clearly a preventable problem.

For our Electronics & Computer Engineering Technologist Capstone project, we set forth to design a commercial refrigeration monitoring system that would concurrently monitor all the units in an establishment, and alert the chefs or managers when their product was not being stored safely. This system would also allow the chef to check in on his/her product at any time for peace of mind (Figure 1).

Figure 1
This was the first picture we took of our finished project assembled. This SLA printed enclosure houses our 10.1″ LCD screen, a Raspberry Pi Model 3B and custom designed PCB.

We began with some simple range testing using RFM95W LoRa modules from RF Solutions, to see if we could reliably transmit data from inside a steel box (a refrigerator), up several flights of stairs, through concrete walls, with electrical noise and the most disruptive interference: hollering chefs. It is common for commercial kitchens to feel like a cellular blackout zone, so reliable communication would be essential to our system’s success.

System Overview

We designed our main unit to be powered and controlled by a Raspberry Pi 3B (RPi) board. The RPi communicates with an RFM95W LoRa transceiver using Serial Peripheral Interface (SPI). This unit receives temperature data from our satellite units, and displays the temperatures on a 10.1″ LCD screen from Waveshare. A block diagram of the system is shown in Figure 2. We decided to go with Node-RED flow-based programming tool to design our GUI. This main unit is also responsible for logging the data online to a Google Form. We also used Node-RED’s “email” nodes to alert the users when their product is stored at unsafe temperatures. In the future, we plan to design an app that can notify the user via push notifications. This is not the ideal system for the type of user that at any time has 1,000+ emails in their inbox, but for our target user who won’t allow more than 3 or 4 to pile up it has worked fine.

Figure 2
The main unit can receive temperature data from as many satellite units as required. Data are stored locally on the Raspberry Pi 3B, displayed using a GUI designed by Node-RED and logged online via Google Sheets.

We designed an individual prototype (Figure 3) for each satellite monitoring unit, to measure the equipment’s temperature and periodically transmit the data to a centralized main unit through LoRa communication. The units were intended to operate at least a year on a single battery charge. These satellites, controlled by a Microchip Technology PIC24FJ64GA704 microcontroller (MCU), were designed with an internal Maxim Integrated DS18B20 digital sensor (TO-92 package) and an optional external Maxim

Figure 3
This enclosure houses the electronics responsible for monitoring the temperatures and transmitting to the main unit. These were 3D printed on Ultimaker 3 printers.

Integrated DS18B20 (waterproof stainless steel tube package) to measure the temperature using the serial 1-Wire interface.

Hardware

All our boards were designed using Altium Designer 2017 and manufactured by JLCPCB. We highly recommend JLCPCB for PCB manufacturing. On a Tuesday we submitted our order to the website, and the finished PCB’s were manufactured, shipped, and delivered within a week. We were amazed by the turnaround time and the quality of the boards we received for the price ($2 USD / 10 PCB).

Figure 4
The main unit PCB’s role is simply to allow the devices to communicate with each other. This includes the RFM95W LoRa transceivers, RPi, LCD screen and a small fan

Main Unit Hardware: As shown in Figure 4, our main board’s purpose is communicating with the RPi and the LCD. We first had to select an LCD display for the main unit. This was an important decision, as it was the primary human interface device (HID) between the system and its user. We wanted a display that was around 10″—a good compromise between physical size and readability. Shortly after beginning our search, we learned that displays between 7″ and 19″ are not only significantly more difficult to come by, but also significantly more expensive. Thankfully, we managed to source a 10.1″ display that met our budget from robotshop.com. On the back of the display was a set of female header pins designed to interface with the first 26 pins of the RPi’s GPIO pins. The only problem with the display was that we needed access to those same GPIO pins to interface with the rest of our peripherals.

Figure 5
Our main board, labeled Mr. Therm, was designed to attach directly to the LCD screen headers. RPi pins 1-26 share the same connectivity as the main board and the LCD.

We initially planned on fixing this problem by placing our circuit board between the RPi and the display, creating a three-board-stack. Upon delivery and initial inspection of the display, however, we noticed an undocumented footprint that was connected to all the same nets directly beneath the female headers. We quickly decided to abandon the idea of the three-board-stack and decided instead to connect our main board to that unused footprint in the same way the RPi connects to display (Figure 5). This enabled us to interface all three boards, while maintaining a relatively thin profile. The main board connects four separate components to the rest of the circuit. It connects the RFM95W transceiver to the RPi, front panel buttons, power supply and a small fan.

Read the full article in the April 345 issue of Circuit Cellar
(Full article word count: 3378 words; Figure count: 11 Figures.)

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RF-Sampling Transceivers Embed Four ADCs and Four DACs

Texas Instruments (TI) has introduced two new RF-sampling transceivers that integrate four analog-to-digital converters (ADCs) and four digital-to-analog converters (DACs) in a single chip. TI says the device offers the industry’s widest frequency range, highest instantaneous bandwidth and 75% smaller design footprint than a discrete solution. The quad-channel AFE7444 (shown) and dual-channel AFE7422 transceivers help engineers more easily achieve multiantenna, direct RF sampling for radar, software defined radio and wireless 5G applications.

Offering the highest IBW among radio frequency (RF)-sampling transceivers according to TI, the AFE7444 and AFE7422 enable engineers to achieve up to 600% more data throughput. While sampling up to 9 Gsamples per second (GSPS) per DAC and up to 3 GSPS per ADC, the AFE7444 receives and transmits up to 800 MHz of information from each of the four antennae, and the AFE7422 receives and transmits 1.2 GHz from each of the two antennae. The new RF-sampling wideband transceivers give engineers flexibility to design applications covering any frequency from 10 MHz to 6 GHz.

The AFE7444 and AFE7422 enable engineers to support up to eight antennae and 16 RF bands with only one device. The AFE7444 and AFE7422 also allow engineers to directly sample input frequencies into C-band without the need for additional frequency conversion stages, eliminating local oscillators, mixers, amplifiers and filters in designs. Additionally, the two transceivers’ architecture allows for greater programmability than traditional RF solutions, and flexible decimation options enable optimization of data bandwidth. With four ADCs and four DACs in one chip, the AFE7444 and AFE7422 help engineers significantly reduce design cycles that are associated with the manufacturing and testing phases required when designing with discrete components.

Measuring 17 mm by 17 mm, TI’s RF-sampling transceivers help save engineers 75% of board space when compared to using discrete RF-sampling data converters. The integration and small size of the AFE7444 and AFE7422 enable engineers to optimize transceiver proximity to the antenna, enabling digital beam forming in high-frequency and high-density antenna arrays.

The AFE7444EVM and AFE7422EVM evaluation modules, available today from the TI store and authorized distributors. The evaluation modules are priced at $2,499 and $1,999 respectively. Pricing for the AFE7444 quad-channel, wideband RF-sampling transceiver in 100-unit quantities starts at $1,749.90. That’s for a 17-mm-by-17-mm, FCBGA package. Pricing for the AFE7422 dual-channel, wideband RF-sampling transceiver in a 17-mm-by-17-mm FCBGA package starts at $1,249.90 for 100 units.

Texas Instruments | www.ti.com

 

 

BLE Multicore MCUs Embed Arm Cortex M33 CPU

Dialog Semiconductor has announced its SmartBond DA1469x family of Bluetooth low energy SoCs, a range of multi-core MCUs for wireless connectivity. The devices’ three integrated cores have each been carefully chosen for their capabilities to sense, process and communicate between connected devices, says Dialog. To provide the devices’ processing power, the DA1469x product family is the first wireless MCU in production with a dedicated application processor based on the Arm Cortex-M33 CPU, according to Dialog.

The M33 is aimed at compute intensive applications, such as high-end fitness trackers, advanced smart home devices and virtual reality game controllers. The DA1469x devices have a new integrated radio that offers double the range compared to its predecessor together with an Arm Cortex-M0+ based software-programmable packet engine that implements protocols and provides full flexibility for wireless communication.

On the connectivity front, an emerging application is for manufacturers to deploy accurate positioning through the Angle of Arrival and Angle of Departure features of the newly introduced Bluetooth 5.1 standard. With its world-class radio front end performance and configurable protocol engine, the DA1469x complies with this new version of the standard and opens new opportunities for devices that require accurate indoor positioning such as building access and remote keyless entry systems.

To enhance the sensing functionality of the DA1469x, the M33 application processor and M0+ protocol engine is complemented with a Sensor Node Controller (SNC), which is based on a programmable micro-DSP that runs autonomously and independently processes data from the sensors connected to its digital and analog interfaces, waking the application processor only when needed. In addition to this power-saving feature, a state-of-the-art Power Management Unit (PMU) provides best-in-class power management by controlling the different processing cores and only activating them as needed.

The SoCs feature up to 144 DMIPS, 512 KB of RAM, memory protection, a floating-point unit, a dedicated crypto engine to enable end-to-end security and expandable memories, ensuring a wide range of advanced smart device applications can be implemented using the chipset family and supporting a range of key value-add interfaces to extend functionality even further.

The PMU also provides three regulated power rails and one LDO output to supply external system components, removing the requirement of a separate power management IC (PMIC). Additionally, the DA169x product family come equipped with a range of key value-add interfaces including a display driver, an audio interface, USB, a high-accuracy ADC, a haptic driver capable of driving both ERM and LRA motors as well as a programmable stepping motor controller.

Developers working with the DA1469x product family can make use of Dialog’s software development suite – SmartSnippets – which gives them the tools they need to develop best-in-class applications on the new MCUs. The DA1469x variants will start volume production in the first half of 2019. Samples and development kits are available now.

Dialog Semiconductor | www.dialog-semiconductor.com

 

Tiny, Octa-Core Arm Module Targets AI on the Edge

By Eric Brown

Qualcomm’s octa-core Snapdragon 660 appeared on Intrinsyc’s Open-Q 660 HDK Mini-ITX dev kit back in 2017 and also showed up on an Inforce 6560 Pico-ITX SBC announced in February. Now Intrinsyc has returned with a tiny compute module implementation. The $225 Open-Q 660 µSOM (micro System on Module) measures only 50 mm x 25mm.


 
Open-Q 660 μSOM, front and back
(click images to enlarge)
Applications for the Open-Q 660 μSOM include on-device artificial intelligence, enhanced gaming, power optimization, device management, security, and advanced photography and image processing jobs such as camera and audio tuning. Intrinysc mentions a development kit that will connect to the module via its 3x 100-pin board to board connectors, but there were no further details.

The module runs Android 9.0 on the Snapdragon 660 (Qualcomm SDA660), which is claimed to offer up to 20 percent higher CPU performance and 30 percent higher graphics performance compared to the similarly octa-core Snapdragon 653. The Snapdragon 660 is also faster than the octa-core Snapdragon 625 and almost identical Snapdragon 626 thanks to its use of Cortex-A73-like “Kryo” cores.

The 14nm fabricated SoC has 4x Kryo cores clocked to 2.2 GHz and 4x clocked to 1.84 GHz, as well as a 650 MHz Adreno 512 GPU. The module’s AI potentiality is unlocked via dual Spectra 160 ISPs and a Hexagon 680 DSP with Hexagon Vector eXtensions (HVX), which supports Caffe2 and Tensorflow for machine learning and image processing.



Open-Q 660 μSOM
(click image to enlarge)
The Open-Q 660 μSOM has the same footprint as the Snapdragon 820 based Open-Q 820 µSOM. The module ships with a combo eMCP chip with 32GB eMMC and 4GB of dual-channel, 1866MHz LPDDR4 SDRAM.

The module integrates a 2.4/5GHz 802.11a/b/g/n/ac 2×2 MU-MIMO WiFi radio via a Qualcomm WCN3990 module supported with 5GHz external PA and U.FL antenna connectors. Bluetooth 5.x is also on board.

The Open-Q 660 μSOM is equipped with 2x 4-lane MIPI-DSI interfaces for up to 2560 x 1600 displays plus DP 1.4 for up to [email protected] or [email protected] The up to 24-megapixel camera support is derived from 3x 4-lane MIPI-CSI connections with I2C controllers for each camera port plus 2x camera flash control signals.

Audio features include a SLIMBus interface for external Qualcomm codecs plus optional Qualcomm Fluence support. You also get 4- and 2-lane MI2S interfaces for external audio devices, a Soundwire link for digital amps, and 2x PDM-based digital mic interfaces.

The Open-Q 660 μSOM supports single USB 3.1 Gen1 Type-C and USB 2.0 host ports plus 4-bit SD 3.0, 8x BLSP (UART, I2C, SPI), and configurable GPIOs. The module provides a PMIC and battery charging circuitry and offers a 3.6V to 4.2V input and a -10 to 70°C operating range.

Further information

The Open-Q 660 µSOM is available for pre-order at $225 in single quantities, with shipments due in April. More information may be found in Intrinsyc’s Open-Q 660 µSOM announcementproduct page, and shopping page

This article originally appeared on LinuxGizmos.com on March 25.

Intrinsyc | www.intrinsyc.com

Next Newsletter: Embedded Boards

Coming to your inbox tomorrow: Circuit Cellar’s Embedded Boards newsletter. Tomorrow’s newsletter content focuses on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

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Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Analog & Power. (4/2) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (4/9) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

IoT Technology Focus. (4/16) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Up and Downconverter Pair Offers 24- to 44-GHz Frequency Range

Analog Devices has announced the ADMV1013 and ADMV1014, a paired highly integrated microwave upconverter and downconverter, respectively. These ICs operate over a very wide frequency range with 50 Ω-match from 24 GHz up to 44 GHz, facilitating ease of design and reducing the costs of building a single platform that can cover all 5G mm Wave frequency bands including 28 GHz and 39 GHz.

Additionally, the chipset is capable of flat 1 GHz RF instantaneous bandwidth supporting all broadband services as well as other ultra-wide bandwidth transceiver applications. Each upconverter and downconverter is highly integrated, comprising I (in-phase) and Q (quadrature-phase) mixers with on-chip programmable quadrature phase-shifter configurable for direct conversion to/from baseband (operable from DC to 6 GHz) or to an IF (operable from 800 MHz to 6 GHz).

Also included on-chip are voltage variable attenuators, transmit PA driver (in the upconverter) and a receive LNA (in the downconverter), LO buffers with x4 frequency multiplier and programmable tracking filters. Most programmability functions are controlled via an SPI serial interface. Through this port, these chips also provide a unique capability for each upconverter and downconverter to correct its respective quadrature phase imbalance, hence the usually difficult to suppress sideband emission can be improved from a typical value of 32 dBc, by 10 dB or more.

The highly integrated ADMV1013 microwave upconverter and the ADMV1014 microwave downconverter are well suited for the microwave radio platforms that operate in the emerging 28 GHz and 39 GHz 5G wireless infrastructure bands. The converters’ 1GHz bandwidth capability, along with the upconverter’s OIP3 of more than 20 dBm that supports stringent modulation schemes such as 1024QAM, are necessary to enable multi-Gigabit wireless data. Moreover, the chipset benefits other applications such as satellite and earth station broadband communication links, aircraft radios, RF test equipment and radar systems. Their superb linearity and image rejection performance are particularly compelling for improved range of microwave transceivers.

The ADMV1013 is offered in a 40-pin, 6 mm x 6 mm LGA, and the ADMV1014 is in a 32-pin, 5 mm x 5 mm LGA package. Samples and production quantities are available immediately. Pricing per 1,000 each for the ADMV1013 starts at $90.79 in a 40-pin, 6 mm x 6 mm CSP package. Pricing per 1,000 each for the ADMV1014 starts at $88.37 in a 32-pin, 5 mm x 5 mm CSP package.

Analog Devices | www.analog.com

 

i.MX8M-Driven Pico-ITX SBC Features Dual-DSP Audio Module

By Eric Brown

Estone is launching an “EMB-2238” Pico-ITX board for audio and voice control applications that runs Linux on an i.MX8M and offers a dual-DSP audio hub and DAC, 40-pin GPIO, and optional PoE and second GbE.

Toledo, Ohio based Estone Technology (known for its former Habey brand) offers a variety of Linux-friendly Pico-ITX boards, including boards based on the i.MX6 (EMB-2230), i.MX6 UL (EMB2200) models, and Intel Cherry Trail EMB-2610. The company recently announced (via Electronics Weekly) an EMB-2238 board with the same 100 x 72mm form factor. The SBC builds on the audio strengths of NXP’s i.MX8M SoC with the help of high-end audio circuitry from Cirrus Logic.


 
EMB-2238
(click images to enlarge)
The EMB-2238 uses the quad-core version of the 1.5GHz, Cortex-A53 equipped i.MX8M, which also includes a GPU and 266MHz Cortex-M4 chip. Estone provides a Yocto Project stack based on Linux kernel 4.9, Qt, and Wayland. It also supports Android 8.1.0.

Other i.MX8M Pico-ITX boards we’ve seen include Kontron’s dual-GbE pITX-iMX8Mand F&S Elektronik Systeme’s up to 8GB LPDDR4 armStone MX8M. There’s also a larger, 136.7 x 87mm Nitrogen8M SBC from Boundary Devices.

All these boards tap the i.MX8M’s extensive digital audio skills to varying degrees, but the EMB-2238 is even more focused on audio and voice control applications. It adds a Cirrus Logic CS47L24 smart codec module with a dual-core, 300-MIPS DSP and audio hub. The triple-DAC device offers a 115 dB dynamic range, an 8-192kHz sample rate, and Enhanced DRE processing (eDRE) for 121dB SNR.


 
EMB-2238 (left) and Cirrus Logic CS47L24 audio module block diagram
(click images to enlarge)
The CS47L24 drives the EMB-2238’s dual digital MEMS microphone header, which features multi-mic noise suppression and acoustic echo cancellation (AEC). A 40-pin expansion header provides omni-directional, spatial 8-channel digital audio/DMIC inputs (SAI5) for the mic array, among other I/O including PCIe. Additional audio features on the SBC include a Class D, 2W mono speaker, an 8-channel digital input and output (SAI1), and SPDIF and QSPI audio interfaces.

The EMB-2238 ships with the Amazon AVS (Alexa Voice Service) Device SDK, as well as Sensory’s TrulyHandsfree wake word engine. It also supports the Snips AI voice control assistant, including support for off-line operation (see video demo farther below).

You can purchase the SBC with 2GB to 4GB LPDDR4, and a microSD slot and 8GB iNAND are also available. For communications there’s a WiFi/BT module and a GbE port with optional an Power-over-Ethernet (IEEE 802.3af) or PoE+ (802.3at) module that can also power an attached LCD panel. A separate option provides a second GbE port via a PCIe add-on card that also integrates a 9-36V DC input, GPIO, an ambient sensor, and an LED control for light bars.


 
Optional PoE (left) and GbE add-ons
(click images to enlarge)
The EMB-2238 is equipped with a 4K-ready micro-HDMI port and HD-ready MIPI-DSI with optional 10.1-inch touch-panel. Other features include a MIPI-CSI camera interface, USB 3.0 OTG Type-C port, dual USB 2.0 host ports, and 2x internal USB interfaces.

The SBC provides a RS-232/RS-485 terminal block, RS-232 header, and the 40-pin header. A 5V DC header offers an alternative to the optional PoE and 9-36V input. The board also provides a watchdog and 0 to 60°C support. As usual with Estone, you get comprehensive documentation.

Specifications listed for the EMB-2238 include:

  • Processor — NXP i.MX8M (4x Cortex-A53 @ 1.5GHz); Vivante GC7000Lite/GC7000VLX for OpenGL/ES 3.1, OpenGL 3.0, Vulkan, OpenCL 1.2 GPU; Cortex-M4 @ 266MHz
  • Memory/storage:
    • 2GB to 4GB LPDDR4 RAM
    • 8GB iNAND flash
    • MicroSD slot
  • Wireless — 802.11 b/g/n and Bluetooth 4.10 module (USB-based)
  • Networking — GbE port with optional PoE; optional second GbE via PCIe add-on with GPIO, 9-36V input, LED control etc.
  • Display/camera I/O:
    • Micro-HDMI port for up to 4096 x 216 0 @60Hz
    • MIPI-DSI (4-lane) for up to 1920 x 1200 and I2C-based support for LCD touchpanels
    • MIPI-CSI (4-lane)
  • Audio/voice control I/O:
    • Class D 2W mono speaker
    • 2x HP out header
    • 8-channel digital in and out (SAI1) with 32-bit @ 384 kHz fs and TDM support
    • SPDIF, QSPI
    • Cirrus CS47L24 smart codec with 2x-core, 300-MIPS DSP with 3x DAC and audio hub with SoundClear Control
    • 2x digital MEMS mic header (via CS47L24) with multi-mic noise supp., AEC
    • Omni-directional spatial 8 ch. digital audio/DMIC inputs (SAI5) for mic array (via 40-pin)
  • Other I/O:
    • USB 3.0 OTG Type-C port
    • 2x USB 2.0 host ports
    • 2x USB 2.0 headers
    • RS-232/RS-485 terminal block
    • RS232 header
    • 4x+ GPIO, 2x I2C for TP and MIPI CSI
  • Expansion — 40-pin connector with PCIe x1, GPIO, font panel control, PoE, 8 ch. audio in etc.
  • Other features — Watchdog timer; 10 to 15-year support longevity
  • Power — 5V DC header or optional PoE or optional 9-36V input (GbE add-on)
  • Operating temperature — 0 to 60°C
  • Dimensions — 100 x 72mm; Pico-ITX form factor
  • Operating system — Yocto Project (Linux kernel 4.9, Qt, Wayland); Android 8.1.0; ships with Amazon AVS and Sensory TrulyHandsfree Wake Word Engine


EMB-2238 Snips and AVS voice control demos

Further information

No pricing or availability information was provided for the EMB-2238 SBC. More information may be found at the Estone Technology EMB-2238 product page.

Estone Technology is demostrating the board at Embedded World in Nuremberg (Feb 26-28) at Hall 1 stand 1-129.

This article originally appeared on LinuxGizmos.com on February 15.

Estone Technology | www.estonetech.com

Flex PCB Design Services

Building Boards that Bend

While not exactly a brand-new technology, flexible printed circuit boards are a critical part of many of today’s challenging embedded system applications from wearable devices to mobile healthcare electronics. The PCB production service vendors listed here feature a variety of Flex PCB manufacturing services to help bring your embedded system design from prototype to production.

By Jeff Child, Editor-in-Chief

Accutrace
www.pcb4u.com
Location: Santa Clara, CA
Accutrace serves the electronics industry’s needs for quick turn PCB fabrication from prototype to production. They can manufacture only what is needed, when it’s needed—and in the amount needed. No need to worry about long shelf life or tying up your capital in bare board inventory.
Services Summary: PCB capabilities: Capabilities: Up to 50 layers; any layer HDI; blind and buried vias; 2-mil line width and spacing; copper up to 16 oz. Materials supported: FR4, Rogers, ISOLA, Polymide-flex, Metal core, Taconic and Magtron
Flexible PCB Services: Flex and Rigid-Flex

 

Beta Layout’s Flex-Pool PCBs use polyimide foils as their base material.

Beta Layout
uk.beta-layout.com
Location: Shannon, Ireland
Beta Layout’s PCB-POOL operation is Europe’s largest manufacturer of PCB prototypes, with over 36,000 customers worldwide. PCB-POOL cost sharing principle enables system designers to benefit from low prices. You can calculate the prices instantly online using the PCB-POOL’s Online price calculation. PCBs using special technologies and materials can also be sourced directly from the company, from prototype to series production quantities.
Services Summary: Prototype PCBs or small series PCBs in 1-6 working days; Laser-cut SMD-Stencils in 1-3 working days; Fully populated SMD and THT prototype boards in 2 working days; Support for PCBs with embedded UHF RFID modules
Flexible PCB Services: All of Beta Layout’s Flex-Pool PCBs are manufactured exclusively in Germany. Only polyimide foils are used as the base material. These provide different benefits compared to other foils, differing substantially from rigid PCB materials.

EzPCB
www.ezpcb.com
Location: Shenzhen, China
EzPCB is an online provider of PCB manufacture and PCB assembly products and services. Based in China, the company’s worldwide business has been growing rapidly since its launch in 2004. EzPCB has supplied high quality PCBs—and related products and services—for over 2,000 customers from more than 40 countries. Its customers include amateurs, small businesses, universities and many world-class companies and organizations including Jet Propulsion Laboratory, Micron, Siemens, STMicroelectronics and Rohm.
Services Summary: PBC manufacturing, PCB assembly, cabling, enclosures, keypads, stencils and components, one-stop turnkey services and design consultation
Flexible PCB Services: Flex PCB support: Components mounted on flexible plastic substrates, such as polyimide, PEEK or transparent conductive polyester film. Additionally, flex circuits can be screen printed silver circuits on polyester. Flexible electronic assemblies may be manufactured using identical components used for rigid printed circuit boards, allowing the board to conform to a desired shape, or to flex during its use. Rigid-Flex PCB support: Flexible and rigid board structures are bonded together in the same units as one part of so called rigid-flex boards. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. Rigid-Flex PCBs contain a flexible part with an insulating layer and a conductor layer, and a rigid part with circuit wiring.

Epec
www.epectec.com
Location: New Bedford, MA
Epec specializes in custom, build to print electronics. It has a global team of engineers, designers, R & D innovators, product managers, manufacturing/supply chain professionals, quality assurance personnel and sales/customer service staff, all of whom are experts in their fields. Rather than limit its production capacity to its US and UK manufacturing centers, Epec has developed UL certified world class production facilities which are ISO-9001, QS-9002, TS-16949, with aligned technology roadmaps and quality systems.
Services Summary: Provides complete engineering and design services, from concept through production, in a quick and efficient time frame. Capabilities include: battery pack design and assembly, PCB electronic design, cable assembly design, flex and rigid-flex circuit design, user interface and more.
Flexible PCB Services: Epic’s flex and rigid-flex solutions and capabilities span from single- or double-sided circuitry to higher technology multilayer designs up to 6 layers. Its flexible circuits are built to withstand the rigors of aerospace, medical and military applications. As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.

 

Shown here is an example of Flexible Circuit Technology’s multi-layer flex PCB. It combines several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi-layer design. The layers may or may not be continuously laminated together throughout the production process.

Flexible Circuit Technologies
www.flexiblecircuit.com
Location: Minneapolis, MN
Flexible Circuit Technologies (FCT) has an internationally recognized flex circuit Application Engineering and Design Team offering over 250 years of combined industry expertise, allowing FCT to provide customers with superior design services and attentive overall support. By co-chairing the IPC (Association Connecting Electronics Industries) Flexible Circuit Design committee, FCT stays abreast of industry standards and helps set standards the industry.
Services Summary: Supports multiple types of flexible PCBs; value added Assembly, Testing Services to complete box builds; Design consultation, optimization, DFM (Design for Manufacturing), to final flex design; Supply chain management for components and materials; Prototypes through production; Low mix-high volume and high mix-low volume program support; Assembly services; Testing Services.
Flexible PCB Services: Supports single, double, multi-layer flex, rigid flex, flexible heaters, flat flex and membrane switches. Heat sinks can be laminated to flex circuits to dissipate heat away from sensitive components such as LEDs. Supports through hole and surface mount capabilities on Flex PCBs, as well as in circuit testing, conformal coating, and electrostatic protective packaging. Graphic overlays can be placed over flexible circuits, rigid boards or membrane switches.

Imagineering
www.pcbnet.com
Location: Elk Grove Village, IL
Imagineering acts as a reliable source for high quality and on time PCBs. Its quick turn prototypes not just intended for testing and verification of designs. Every one of its boards meet IPC-A-600 F (Class2) standard, be it prototype or production. Specializes in quick turn prototypes, as well as rapid turn production.
Services Summary: PCB assembly capabilities summary: SMT, Flip chip, thru hole, Flex circuit assembly, cable assemblies, lead-free assembly and wire harness assembly. Full Turnkey service for all customers if needed as well as partial turn-key and consignment orders. PCB capabilities include: 22-layer fabrication, hole sizes down to 8 mil plated and 5 mil laser drilled, 3 mil line width and spacing, 6 oz. copper and a maximum PCB thickness up to .300″.
Flexible PCB Services: Supports Multi-Layer, Rigid and Flex PCBs.

OurPCB
www.ourpcb.com
Location: Shijiazhuang Hebei, China
OurPCB is a multi-national PCB manufacturing and PCB assembly company that provides global service and support while using its own Chinese manufacturing capabilities. Company has provided professional PCB production and assembly services for more than 2,500 customers around the globe.
Services Summary: Assembly capabilities include BGA, LGA, QFN, QFP, DIP and SIP. The smallest SMT footprint it can mount is 0201. Factory can also provide programming and wiring as well as injecting and conformal coating services.
Flexible PCB Services: Can fulfill flex PCB orders of 20 layers maximum; high-quality, quick turn flexible PCB manufacturing services.
Processes and services include:
• Line Width/Space in the Inner Layer: 3/3 mil
• Min. Drilling Hole Diameter: 6 mil
• Tolerance for Impedance Control (+/-): 10% rts

PCBCart
www.pcbcart.com
Location: Hangzhou, China
PCBCart is a professional PCB production service provider with more than 10 years of experience in the electronics manufacturing industry. It has manufactured printed circuit boards for more than 10,000 companies and over 80 countries around the world. Fast, affordable prototype assembly they take your unique PCB designs, prepare them for the assembly process and perform comprehensive testing to ensure they meet your precise performance requirements. Can provide a complete turnkey PCB prototype assembly featuring a one-stop shop approach.
Services Summary: Development, manufacturing, assembly and testing of custom PCBs; Rapid PCB prototyping; Circuit boards manufacturing: PCB assembly; Components sourcing services
Flexible PCB Services: Specializes in the fabrication and assembly of flexible PCB products for use in the manufacturing of medical devices and various types of telecommunication and industrial equipment. Can also work with customers to produce a custom flex PCB prototype.
Specifications:
• Quality Grade Standard IPC 2
• Number of Layers 1 – 8layers
• Order Quantity 1 pc – 10,000+pcs
• Build Time 2 days – 5 weeks
• Material DuPont PI, Domestic Shengyi PI
• Board Size Min. 6 mm x 6 mm, Max. 406 mm x 610 mm
• Board Thickness 0.1 mm – 0.8 mm

PCB Unlimited
www.pcbunlimited.com
Location: Tualatin, OR
In 2003, PCB Unlimited’s sister company Stencils Unlimited pioneered the internet SMT stencil quote and order process. In 2008, PCB Unlimited took it one step further by providing a one-stop-shop where engineers can quote and order online US and offshore PCB services and everything else they need for their PCB projects.
Services Summary: US PCB fabrication including Rigid, Flex and Rigid-Flex PCBs; Offshore PCB Fabrication; US Quick-Turn Prototype PCB Assembly and Low Volume Production followed by our offshore operation to service your high-volume production needs
Flexible PCB Services: Flex and Rigid-Flex PCBs from prototype to production.
Specifications:
• Trace and space capabilities down to .003″/.003″ (0.5 oz.), .004″/.004″ (1 oz.)
• Microvia diameter from .003”
• Lead times as short as 5 days
• Multiple offshore partners quoting system to offer excellent pricing (ISO:9001 certified)
• Selective plating of gold on the same flexible circuit
• Minimum tolerance of ZIF connector to edge of flex +/- .003″

San Francisco Circuits
www.sfcircuits.com
Location: San Mateo, CA
Specializes in the complex, advanced technology of PCB fabrication and assembly, producing high quality multi-layered PCBs from elaborate layouts. Expertise in circuit boards is not limited to PCB manufacturing, but extends to PCB layout & PCB assembly.
Services Summary: PCB fabrication, PBC assembly and PCB layout services. Supports Mil-SPEC PCBs, Flex PCBs, Metal Core PCBs and many others.
Flexible PCB Services: Supports Flex PCBs and Rigid-flex PCBs. Can provide heavy copper flex circuit boards that can also be coupled with flexible thin copper layers designed to handle heavier power currents. Your heavy copper boards can be built with flex portions for lower voltage additions and applications.
Flex PCB specifications:
• Drill to copper – Outer layers 8 mil
• Drill to copper – Inner layers 10 mil
• Copper Thickness 0.5 oz. – 4 oz.
• Minimum Hole Size 0.004″
• Minimum Trace/Space 0.003″/0.003″
• Minimum Pitch 0.5 mm

Sierra Circuits can quickturn Flex PCBs in two days or less.

Sierra Circuits
www.protoexpress.com
Location: Sunnyvale, CA
Sierra Circuits is an ISO 9001:2015, ISO 13485:2016 and MIL-spec MIL-PRF-55110 certified, Silicon Valley-based, high-technology PCB manufacturer and assembler. It specializes in quick turn PCBs and medium production. By owning its manufacturing and assembly facilities, the company controls every aspect of the production schedule and quality.
Services Summary: Micro/fine line PCBs, PCB assembly, flexible PCBs, lead-free PCBs, high-reliability PCBs, no-touch PCBs, burn-in PCBs, R&D PCBs, MIL-spec PCBs, PCB design
Flexible PCB Services: Latest offerings include Flex PCBs, Rigid-flex PCBs, and microelectronics PCBs down to 1 mil trace/space (some restrictions apply). Offers high-quality, high-reliability quickturn flexible printed circuit boards in two days or less.
Flex PCB specifications:
• Max. Layer Count 12
• Min. Core Thickness .001″
• Min. Starting
Cu Foil Thickness O.L. 9 micron
• Max. Finished Cu Weight I.L. 2 oz.
• Smallest Mech. Drill Diameter .0079″
• Smallest Laser Drill Diameter .003″

This article appeared in the March 344 issue of Circuit Cellar

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Note: We’ve made the October 2017 issue of Circuit Cellar available as a free sample issue. In it, you’ll find a rich variety of the kinds of articles and information that exemplify a typical issue of the current magazine.

April (issue #345) Circuit Cellar Article Materials

Click here for the Circuit Cellar article code archive

 

p.6: Build a Prescription Reminder: Using Raspberry Pi, By Devlin Gualtieri

References:
[1]  Raspian Download Page www.raspberrypi.org/downloads/raspbian/

US FDA Medical Devices Website www.fda.gov/MedicalDevices/DigitalHealth/MobileMedicalApplications/ucm368744.htm.

microEngineering Labs PIC Basic Professional http://melabs.com

Microchip Technology | www.microchip.com
Raspberry Pi Foundation | www.raspberrypi.org

Author links:
Dr. Gualtieri writes a science and technology blog at http://www.tikalon.com/blog/blog.php. He is the author of three science fiction novels, and books about science and mathematics. See http://www.tikalonpress.com for details.

p.14: IoT Monitoring System for Commercial Fridges: Using LoRa Technology,
By Tyler Canton, Akio Yasu, Trevor Ford and Luke Vinden

References:
[1] US. Dept of. Energy, “Amount of food waste in the United States in 2017, by source (in million wet tons),” Statista – The Statistics Portal, 2017. www.statista.com/statistics/694148/volume-of-food-waste-by-source-us/
[2] A. F. N. M. Martin Gooch, “Food Waste in Canada,” George Morris Centre, November 2010. http://vcm-international.com/wp-content/uploads/2013/04/Food-Waste-in-Canada-112410.pdf
[3] Maxim Integrated Products, “DS18B20 Datasheet,” Maxim Integrated Products, I2018. https://datasheets.maximintegrated.com/en/ds/DS18B20.pdf

Raspberry Pi 3 Model B
Raspberry Pi Trading | https://www.raspberrypi.org

RFM95W LoRa TRX Module
RF Solutions | https://www.rfsolutions.co.uk

PIC24FJ64GA704 Microcontroller
Microchip Technology | https://www.microchip.com

915 MHz Dome Antenna
Linx Technologies Inc. | https://linxtechnologies.com/wp/

10.1” Resistive LCD Touch Screen w/ HDMI Interface
Waveshare | https://www.waveshare.com

Analog Devices | www.analog.com
Altium | www.altium.com
Coilcraft | www.coilcraft.com
JLCPCB | jlcpcb.com
Linx Technologies | linxtechnologies.com/wp
Maxim Integrated | www.maximintegrated.com
Microchip Technology | www.microchip.com
ON Semiconductor | www.onsemi.com
Raspberry Pi Trading | www.raspberrypi.org
RF Solutions | www.rfsolutions.co.uk
Waveshare | www.waveshare.com

p. 22: High-Voltage Differential Probe: Amplifiers in Action, By Andrew Levido

To make your own label sticker for the differential probe, a pdf with the artwork is available on the Circuit Cellar code & files download webpage

ADA4817 Op Amp
Analog Devices
www.analog.com

LM6611 Op Amp, TPS65133 Dual Boost Switcher
Texas Instruments
www.ti.com

MAX1555 Dual-Input, 1-Cell Li+ Battery Charger
Maxim Integrated
www.maximintegrated.com

Analog Devices | www.analog.com
Maxim Integrated | www.maximintegrated.com
Texas Instruments | www.ti.com

p. 28: Build a PIC32-Based Recording Studio: Music from Micros,
By Radhika Chinni, Brandon Quinlan and Raymond Xu

References:
[1] ECE 4760 Course Website: http://people.ece.cornell.edu/land/courses/ece4760/
[2] PIC32 Pinout: http://people.ece.cornell.edu/land/courses/ece4760/StudentWork/McNicoll/PIC32_Pinout_brl.pdf
[3] Bruce Land- Protothreads: http://people.ece.cornell.edu/land/courses/ece4760/PIC32/index_Protothreads.html
[4] SPI: http://people.ece.cornell.edu/land/courses/ece4760/PIC32/index_SPI.html

Sources/Parts:

  1. Microphone: Digikey 102-1720-ND
  2. MicroStickII
  3. PIC32MX250F128B
  4. TFT LCD
  5. Piano C Major Scale: https://www.youtube.com/watch?v=FCLzuQS5arI
  6. Guitar C Major Scale: https://www.youtube.com/watch?v=8ykeN4JC_O8
  7. Bass C Major Scale: https://www.youtube.com/watch?v=uYf7RN_PHkk
  8. Various Drum Sounds: https://www.youtube.com/watch?v=5UH7ydJddYI

PIC32 Family Reference Manual: http://www.microchip.com/pagehandler/en-us/family/32bit/

PIC32 Peripheral Libraries for MPLAB C32 Compiler:
http://ww1.microchip.com/downloads/en/DeviceDoc/32bitPeripheralLibraryGuide.pdf

PS1024ALRED Push Button Datasheet: https://media.digikey.com/pdf/Data%20Sheets/E-Switch%20PDFs/PS1024ALRED.pdf

CMA-6542PF Microphone Datasheet: https://media.digikey.com/pdf/Data%20Sheets/CUI%20Inc%20All%20Brands%20PDFs/CMA-6542PF.pdf

MCP6242 Op Amp Datasheet: http://ww1.microchip.com/downloads/en/DeviceDoc/21882d.pdf

Digi-Key | www.digikey.com
Mathworks | www.mathworks.com
Microchip Technology | www.microchip.com

Here is the YouTube video of the project:

p.34: Drone Video Technologies are Flying High: Cameras, Boards and Kits,
By Jeff Child

Aerialtronics | www.aerialtronics.com
Aetina | www.aetina.com
FLIR Systems | www.flir.com
Gumstix | www.gumstix.com
Intel | www.intel.com
Intrinsyc Technologies | www.intrinsyc.com
Lucint Systems | www.lucintsystems.com
Nvidia | www.nvidia.com
Qualcomm | www.qualcomm.com

p.40: Low-Power Wireless Solutions Feed IoT Edge Needs: Integration Meets Innovation, By Jeff Child

Cypress Semiconductor | www.cypress.com
Microchip Technology | www.microchip.com
Nordic Semiconductor | www.nordicsemi.com
Semtech | www.semtech.com
STMicroelectronics | www.st.com
Texas Instruments | www.ti.com

p.46: PRODUCT FOCUS: 32-Bit Microcontrollers: Wireless Workhorse,
By Jeff Child

Analog Devices | www.analog.com
Cypress Semiconductor | www.cypress.com
Infineon Technologies | www.infineon.com
Maxim Integrated | www.maximintegrated.com
Microchip Technology | www.microchip.com
NXP Semiconductor | www.nxp.com
Renesas Electronics America | www.renesas.com
STMicroelectronics | www.st.com
Texas Instruments | www.ti.com

p.50: EMBEDDED IN THIN SLICES: Bluetooth Mesh (Part 2):
Provisioning Pondered,
By Bob Japenga

References:
[1] The images are both public domain and no copyright from https://en.wikipedia.org/wiki/Public-key_cryptography
[2]Bluetooth SIG’s glossary of terms:  https://www.bluetooth.com/bluetooth-technology/topology-options/le-mesh/mesh-glossary#nonce
[3] https://www.us-cert.gov/

p.54: THE CONSUMMATE ENGINEER: Improving Software Quality: By the Book,
By George Novacek

References:
[1] Software Engineering Body of Knowledge SWEBOK

p.58: THE DARKER SIDE: The Art of Current Probing: Mindful Measuring,
By Robert Lacoste

EasyPIC V7 development board
www.mikroe.com

U1253B multimeter
www.keysight.com

WaveRunner 610Zi oscilloscope
www.teledynelecroy.com

Teledyne LeCroy DA1822A differential amplifier
www.teledynelecroy.com

Tektronix P6042 current probe (obsolete)

I-prober 520 positional current probe
www.aimtti.com

“Teardown: The Tektronix P6042 current probe is a classic” Paul Rako -October 04, 2016, EDN Network https://www.edn.com/design/test-and-measurement/4442795/Teardown–The-Tektronix-P6042-current-probe-is-a-classic

Aim-TTi | www.aimtti.com
Keysight | www.keysight.com
Microchip Technology | www.microchip.com
MikroElektronika | www.mikroe.com
Tektronix | www.tekronix.com
Teledyne Lecroy | www.teledynelecroy.com

p.66: FROM THE BENCH: Building an All-in-One Serial Terminal:
               With a Tiny Touchscreen, By Jeff Bachiochi

gen4-IoD-24T:  2.4″ TFT LCD module with Resistive Touch
4D Systems
www.4dsystems.com.au

Paul Eilio  forum.4dsystems.com.au/forum/forum-aa/4d-systems-software/workshop-4-visi-genie-environment-picaso/65909-the-big-picture

GFX4d-master\Examples\_4Dos –              in the GFX4d Library
This intrigued me.  So I played with it for a while and realized I could be stripped of the BASIC interpreter and I would have the guts of just what I was looking for.  Thanks to the unknown author.-J.B,

Arduino Library Reference    www.4dsystems.com.au/productpages/gen4-IoD/downloads/IoD_Arduino_Libraries_R_1_0.pdf

4D Systems | www.4dsystems.com.au
Espressif Systems | www.espressif.com

p.79: The Future of Robotics: Dealing with Challenges and Tradeoffs
in Motion Control, 
By James English

Energid Technologies | www.energid.com

RPi-Based IoT gateway Offers Cellular, Zigbee, Z-Wave or LoRa

By Eric Brown

Newark Element14 and Avnet have announced a Raspberry Pi based “SmartEdge Industrial IoT Gateway” with 2x Ethernet, Wi-Fi/BT, CAN, serial and optional Zigbee, Z-Wave or LoRa.

Avnet, which last year launched the Zynq UltraScale+ based ‘Ultra96 96Boards CE SBC, announced plans for the Avnet SmartEdge Industrial IoT Gateway at the CES show in early January. At Embedded World last month, Premier Farnell revealed more details on the Raspberry Pi based IoT gateway, which will launch this summer at Newark Element14 in North America and Farnell Element14 in Europe.


Avnet SmartEdge Industrial IoT Gateway 
(click image to enlarge)
The Avnet SmartEdge Industrial IoT Gateway will support Avnet’s IoT Connectplatform to enable cloud connectivity to Microsoft Azure. The Linux-driven embedded PC will support industrial automation applications such as remote monitoring, predictive maintenance, process control, and automation.

Premier Farnell did not say which Raspberry Pi is under the hood, but based on the WiFi support, it would appear to be the RPi 3 Model B rather than the B+. The limited specs announced for the gateway include 8GB eMMC, an HDMI port, and TPM 2.0 security. The image suggests there are also at least 2x USB ports and a coincell battery holder for a real-time clock.

For communications, you get dual 10/100 Ethernet ports as well as 2.4GHz WiFi and BLE 4.2 with an integrated antenna and external mount. The gateway also provides a mini-PCIe interface for optional cellular modems. In addition, the enclosure “features space for an additional internal accessory to provide Zigbee, Z-Wave, or LoRa capabilities, for example, or for multiple accessories through case expansion,” say Premier Farnell.

The system is further equipped with CAN-BUS and RS-232/485 interfaces with Modbus and DeviceNet support, as well as isolated digital I/O. There’s also a 40-pin expansion header for Raspberry Pi HATs and other add-on boards. The system has a wide-range 12-24V DC input plus DIN rail and wall mounting.

Further information

The Avnet SmartEdge Industrial IoT Gateway will launch this summer at Newark Element14 in North America and Farnell Element14 in Europe, with pricing undisclosed. More information is available in the Premier Farnell announcement and more may eventually appear on the Avnet website.

This article originally appeared on LinuxGizmos.com on March 4..

Avnet | www.avnet.com

Farnell Element14 | www.element14.com

Newark Element14 | www.newark.com

Encapsulated AC-DC Supplies Offer Multiple Mounting Options

CUI’s Power Group has announced the addition of 3 W and 5 W models to its line of low power, encapsulated AC-DC power supplies. Available in board mount, chassis mount, wire lead, and DIN rail configurations, the single output PSK-S3 and PSK-S5B series are housed in compact packages measuring as small as 1.46” x 0.97” x 0.71” (37 mm x 24.5 mm x 18 mm), making them well suited for space-constrained low power ITE, industrial control, automation, and consumer electronics applications. Designed for easy installation, the wire lead PSK-S3-L and PSK-S5B-L series, chassis mount PSK-S3-T and PSK-S5B-T series, and DIN rail mount PSK-S3-DIN and PSK-S5B-DIN series afford engineers additional options for simpler design implementation.

These encapsulated modules feature 4 kVac input to output isolation, a universal input voltage range of 85 to 264 VAC, and a wide operating temperature range from -40°C up to +70°C. The series also offer single output voltages of 3.3, 5, 9, 12, 15 and 24 VDC, along with over current, over voltage and continuous short circuit protections.

All models are certified to the new IEC 62368-1 safety standard for ICT and AV equipment, while meeting CISPR32/EN55032 Class A limits for conducted and radiated emissions. Featuring class II construction, these encapsulated ac-dc power supplies further carry a minimum MTBF of 300,000 hours at +25°C ambient, per MIL-HDBK-217F.

The PSK-S3 and PSK-S5B series are available immediately with prices starting at $8.01 per unit at 120 pieces through distribution.

CUI | www.cui.com

 

Rugged Touch Panel Computer Targets Railway System Designs

ADLINK Technology has released its latest Driver Machine Interface (DMI) touch panel computer, the DMI-1210, designed specifically for train control and driver information display. Powered by the Intel Atom x5-E3930 processor (formerly Apollo Lake) and featuring a 12.1” (4:3) high resolution color display, 5-wire resistive touch screen and securable I/O interface, the DMI-1210 can be deployed as an HMI unit for driver’s desks, control panel for passenger information systems, surveillance system control/display unit or in railway diagnostics and communications applications.
The DMI-1210 is an EN 50155 certificated, cost-effective, commercial-off-the-shelf (COTS) driver interface that offers train radio display, electronic timetable, and diagnostic display functions and additional functionality such as train data recorder. The DMI-1210 supports full range DC power input from +16.8 V to +137.5 V DC. Optional MVB, GNSS, 3G/LTE, WLAN and Bluetooth through add-on modules give system integrators the necessary tools to expand use case possibilities.

With ADLINK’s built-in Smart Embedded Management Agent (SEMA) management and status LEDs on the front panel, the DMI-1210 provides easy and effective health monitoring and system maintenance. In addition, system robustness and reliability are provided by careful component selection for extended temperature operation, isolated I/Os, conformal coated circuit boards, securable I/O connectors and high ingress protection rating (IP65 front, IP42 rear).

ADLINK Technology | www.adlinktech.com

 

Tuesday’s Newsletter: IoT Tech Focus

Coming to your inbox tomorrow: Circuit Cellar’s IoT Technology Focus newsletter. Tomorrow’s newsletter covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

Already a Circuit Cellar Newsletter subscriber? Great!
You’ll get your IoT Technology Focus newsletter issue tomorrow.

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Don’t be left out! Sign up now:

Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Embedded Boards.(3/26) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Analog & Power. (4/2) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (4/9) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.