2U HPC Server Sports Dual Intel Xeon Scalable Processors

WIN Enterprises has announced the PL-81890, a high performance 2U server platform with support for dual Intel Xeon Scalable Series processors, Trusted Platform Module (TPM) and storage features including twenty four 2.5-inch hot-swappable U.2 SSDs. I/O support includes 10GBASE-T, two ports of 10 Gbit Ethernet, two ports of 25 Gbit Ethernet, four ports of 10 Gbit Ethernet SFP+, one 1GBASE-T port dedicated to IPMI, plus three USB 2.0 ports. Up to two GPGPU cards are supported to visualize decision support data. Two M.2 NVMe slots are supported for high performance SSDs.

n onboard Trusted Platform Module (TPM) ensures the integrity of network processing for critical applications. A choice of three TPM modules is provided: TPM Module 1.2 with LPC, TPM Module 2.0 with LPC or TPM Module with eSPI.
The unit’s high performance processors and memory capacity of 3 Terabytes makes the unit appropriate for high-end, latency-sensitive operations, including transaction processing, scientific/real-time analytics, IoT cloud computing, virtualization, data mining, data warehousing and other critical applications.

Features:

  • 2U, 12 Bays TPCS System
  • Dual Intel Xeon Scalable Processor Platforms
  • (12) DDR4 ECC-RDIMM/LRDIMM/3DS LRDIMM 2133
  • (4+2) 1G BaseT LAN ports / (4) 10GbE SFP+
  • 80+ Platinum Certified 550W/850W CRPS
  • Supports 1.2 and 2.0 Trusted Platform Modules (TPM)
  • Supports (2) GPGPU graphics cards for AI applications

WIN Enterprises | www.win-ent.com

COM Express Board Sports Intel 8th Gen Processors

Avnet Integrated Solutions (MSC Technologies) has introduced a COM Express module (MSC C6B-CFLH) that features Intel Core-i7, Core-i5 and Xeon processors. They are designed to provide more processing power for target applications like medical, gaming, in-broadcasting and also in-media production equipment, video surveillance, traffic enforcement and for toll collect systems. Based on the newly-announced 8th generation Intel Core processors, codenamed “Coffee Lake”, Intel’s new generation introduces six core processors and delivers considerably higher computing and graphics performance but at a similar power dissipation level to the previous 7th generation.

Engineering samples of the COM Express module (MSC C6B-CFLH) will be available in the 2nd quarter 2018 from Avnet Integrated Solutions. Like similar products, these new modules with Intel’s 8th generation Core processors come with a 15-year lifecycle from the date of introduction, and are designed and produced in Germany.

Technical Specifications

The MSC C6B-CFLH Type 6 COM Express modules in the “Basic” form factor of 125 mm x 95 mm round off the top end of the MSC product portfolio. The boards are offered with three processor variants: Intel Core i7-8850H with 6 CPU cores / 12 threads, i5-8400H with 4 CPU cores / 8 threads, and Intel Xeon E-2176M with 6 CPU cores / 12 threads. A total of up to 32Gbytes of DDR4-2666 DRAM can be inserted in the two SO-DIMM memory module slots on the modules.

For the Xeon-based module, security-enhanced ECC memory is supported by the use of corresponding ECC memory modules. The maximum power consumption of the modules falls between 35 W and 55 W depending on the usage model. The high-end processor boards operate between 0 and 60 °C. The processors integrate the powerful Intel UHD Graphics, and they are accompanied by the Intel QM370 or C246 Chipsets (PCH).

The integrated graphics controller allows triple independent display of max. 4k resolution each, and comes with hardware-based video encoding and decoding up to 4k. DirectX 11.3/12 are supported as well as Open CL 1.2/2.0/2.1 and OpenGL 4.3/4.4/4.5. The COM Express modules feature 3x DisplayPort/HDMI/DVI outputs as well as eDP/LVDS, 8x PCI Express Gen 3 x1 lanes and one PEG x16 Gen 3 interface. 4x SATA 6Gb/s, 4x USB 3.0 Gen 1 and 4x USB 2.0 are available plus the TPM 2.0 device for security and encryption.

MSC Technologies / Avnet Integrated | www.msc-technologies.eu

3.5″ SBC Serves up Skylake Processors

COMMELL has announced its LS-37K 3.5-inch embedded mini-board based on Intel 6th/7th generation FCLGA1151 Skylake / Kaby Lake Core processor family and Xeon E3-1200 v5 processor. The Skylake PC is claimed to deliver 30 percent better performance than a PC base on Ivy Bridge architecture, 20 percent better performance than a PC based on Haswell, and 10 percent better performance than a Broadwell PC.

LS-37K-3D8The LS-37K desktop 3.5-inch mini-board platform supports DDR4 memory DIMM 1866/2133 MHz up to 16 GB. The platform is based on Intel HD530 (Skylake) HD630, (Kaby Lake) and HD P530 (Xeon E3-1200v5). For graphics, the Skylake GPU offers 24 execution units (EUs) clocked at up to 1150Mhz (depending on the CPU model). The revised video engine now decodes H.265/HEVC completely in hardware and thereby much more efficiently than before, and HD Graphics 630 GPU is largely identical to the 530 found in Skylake, The only real upgrade here is the HEVC and VP9 support. LS-37K Displays can be connected via 1 VGA, 1 LVDS, 1 DVI, 1 HDMI and one DP port, up to three displays can be controlled simultaneously.

LS-37K offers lots of features including high-speed data transfer interfaces such as 4 x USB3.0 and 2 x SATAIII, equipped with dual Gigabit Ethernet (One of the dual LAN with iAMT 11.0 supported), and comes with PS/2 port, 5 x RS232 and 1 x RS232/422/485, 4 x USB2.0, Intel® High Definition Audio, and 1 Mini PCIe socket (supporting mSATA) and 9 to 30 VDC input.

COMMELL | www.commell.com