Plessey Demos MicroLEDs for VR Displays

Plessey Semiconductors has successfully demonstrated how its monolithic microLED technology can be used to deliver the next-generation of Head-Up Displays (HUDs), enabling new AR and VR applications. According to the company, MicroLEDs are emerging as the only technology that can provide high luminance in a small format. All leading manufacturers of wearable technologies are currently pursuing manufactures that can deliver an ideal microLED solution. With this demonstrator, Plessey has confirmed it is ready to enable its partners to move into production of a monolithic display based on microLEDs using the company’s proprietary GaN-on-Silicon approach.

The demonstrator, which has been produced in collaboration with Artemis Optical, combines Plessey’s monolithic display, based on an array of microLEDs integrated alongside an active matrix backplane, with the patented film technology and a single lens arrangement from Artemis. The combination of technologies removes ambient light in the wavelength matching the microLED display output, resulting in a HUD that delivers very high display brightness with low power consumption, in a format that is considerably smaller than existing HUD designs, yet still offers significant cost savings.

During CES 2018, Plessey Semiconductor and Artemis Optical presented the demonstrator to many leading companies developing VR and AR electronics. Headsets and eyewear outfitted for AR and VR applications are set for record sales this year of $1.2 billion in the US market alone, according to the Consumer Technology Association (CTA).

Plessey Semiconductor | www.plesseysemiconductors.com

3-D Image Sensor Chips for Virtual Reality

Infineon Technologies AG and pmdtechnologies gmbh recently announced the development of REAL3 3-D image sensor chips for virtual and augmented reality applications, spatial measurement, photo effects, and more. The new sensors have improved optical sensitivity and power comsumption in comparison to the previous version.REAL3_Infineon
Features and specs:

  • Specifically designed for mobile devices, where most applications only need a resolution of 38,000 pixels.
  • Small sensor chip area
  • Each sensor chip features microlenses
  • The chips operate with infrared light and use the time-of-flight (ToF) measuring principle

The IRS1125C will be available in volume as of first quarter of 2016. The IRS1645C and IRS1615C are slated for the second quarter of 2016.

Source: Infineon Technologies