The BIS-3922 improves on HABEY’s BIS-6922 system by offering additional I/O for more applications and solutions. The system is well suited for automation, digital signage, network security, point of sale, transportation, and digital surveillance applications.
The BIS-3922 system includes six DB9 COM ports on the front panel, one of which supports RS-232/-422/-485. HABEY’s proprietary ICEFIN design ensures maximum heat dissipation and a true fanless system.
The BIS-3922 system is built with the Intel QM77 chipset and is compatible with the third-generation Ivy Bridge Core processors. The BIS-3922 system’s additional features include a HM77 chipset that supports third-generation Intel Core i3/i5/i7 processors; dual gigabit Ethernet ports; High-Definition Multimedia Interface (HDMI), video graphics array (VGA), and low-voltage differential signaling (LVDS) display interfaces; one mini-PCI Express (PCIe) and one mSATA expansion; and a 3.5” single-board computer (SBC) form factor.
The ECM-DX2 is a highly integrated, low-power consumption micromodule. Its fanless operation and extended temperature are supported by the DMP Vortex86DX2 system-on-a-chip (SoC) CPU. The micromodule is targeted for industrial automation, transportation/vehicle construction, and aviation applications.
The ECM-DX2 withstands industrial operation environments for –40-to-75°C temperatures and supports 12-to-26-V voltage input. Multiple OSes, including Windows 2000/XP and Linux, can be used in a variety of embedded designs.
The micromodule includes on-board DDR2 memory that supports up to 32-bit, 1-GB, and single-channel 24-bit low-voltage differential signaling (LVDS) as well as video graphics array (VGA) + LVDS or VGA + TTL multi-display configurations. The I/O deployment includes one SATA II interface, four COM ports, two USB 2.0 ports, 8-bit general-purpose input/output (GPIOs), two Ethernet ports, and one PS/2 connector for a keyboard and a mouse. The ECM-DX2 also provides a PC/104 expansion slot and one MiniPCIe card slot.
The CPU-162-14 is a high-performance COM Express module based on the Intel Core i7 Processor. The COM is designed to work in harsh environments. It includes features to provide extra resilience to vibrations, making it well suited for transportation applications.
The CPU-162-14 includes extended temperature versions for –40°-to-85° operation; direct-mounted RAM and a CPU to withstand stress and vibration; up to 8 GB double data rate type three synchronous dynamic RAM (DDR3 SDRAM); and three video ports including video graphics array (VGA), Intel’s Serial Digital Video Out (SDVO), and low-voltage differential signaling (LVDS).