Tool Helps Embed Type-C Port Manager on STM32 MCUs

Helping engineers leverage the latest USB Power Delivery capabilities and versatile USB Type-C connections in new or legacy product designs, STMicroelectronics has introduced new software for implementing a Type-C Port Manager (TCPM) on any general-purpose STM32 microcontroller.

Compliant with the USB Type-C Port Controller Interface (TCPCi) specification, and designed to manage a separate single- or multi-port Type-C Port Controller (TCPC) chip, ST’s X-CUBE-USB-PD stack implements the protocol layer and policy engine of the USB Power Delivery Specification (USB-PD 3.0 v1.1). The stack demands minimal STM32 resources, having a low memory footprint and using only a single I2C bus address and one alert pin per port. In addition, standard register maps ensure easy interoperability with any connected TCPC device.
X-CUBE-USB-PD supports all USB-PD 3.0 options, including Programmable Power Supply (PPS) for connecting fast chargers, Fast Role Swap (FRS) for seamless user experiences during cable insertion or removal, and authentication-message exchange to allow data or power transfer only with genuine devices or chargers.

By supporting Provider, Consumer, and Dual-Role (DRP) modes, the stack enables product designers to leverage the benefits of USB Type-C in a wide variety of equipment types, such as power hubs or power banks, docking stations, game controllers, PC peripherals, multi-function accessories, and small appliances such as cordless vacuum cleaners, portable speakers, lighting products, proprietary chargers, and many other applications.

ST has tested the stack with ON Semiconductor’s FUSB307B, a USB-PD 3.0 v1.1-certified TCPC chip, creating a fully certified and ready-to-use solution that centralizes the TCPM for multiple USB-PD ports. The FUSB307B provides a 1 Mbps I2C microcontroller interface and handles functionality such as plug-insertion/orientation detection and dead-battery power-up. Time-critical Power-Delivery functions that offload the microcontroller effectively enable any STM32 including entry-level devices to manage multi-port, multi-role USB-PD interfaces. X-CUBE-USB-PD currently contains libraries tested on STM32 Arm Cortex-M0 and Cortex-M4 microcontrollers, giving developers a choice of over 420 different part numbers. Libraries for other STM32 series will be introduced by the end of 2018.

An ON Semiconductor FUSB307B evaluation board, ON-FUSB3-STM32, is also available to help streamline development. The board, which features a STM32F072 microcontroller and a USB-C connector, demonstrates control of a single port. The X-CUBE-USB-PD stack, part of the STM32Cube software-development ecosystem, can be downloaded now, free of charge, from www.st.com/x-cube-usb-pd

STMicroelectronics | www.st.com

Promoter Group Announces USB 3.2 Spec Update

The USB 3.0 Promoter Group has announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices, effectively doubling the bandwidth to extend existing USB Type-C cable performance. During the upcoming USB Developer Days 2017 event, the promoters will provide detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other topics.

20170726120126_USB-Type-cFrontWeb

While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

Key characteristics of the USB 3.2 solution include:

– Two-lane operation using existing USB Type-C cables

– Continued use of existing SuperSpeed USB physical layer data rates and encoding techniques

– Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation

For users to obtain the full benefit of this performance increase, a new USB 3.2 host must be used with a new USB 3.2 device and the appropriate certified USB Type-C cable. This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published. The USB 3.2 specification is now in a final draft review phase with a planned formal release in time for the USB Developer Days North America event in September 2017.

The USB 3.0 Promoter Group, comprised of Apple, Hewlett-Packard, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST Microelectronics, and Texas Instruments, continues to develop the USB 3.x family of specifications to meet the market needs for increased functionality and performance in SuperSpeed USB solutions. Additionally, the USB 3.0 Promoter Group develops specification addendums (USB Power Delivery, USB Type-C, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.x technology will be beneficial in delivering a more ubiquitous, richer user experience.

USB 3.0 Promoter Group | www.usb.org

New USB 3.0 UVC Class Bridge ICs

FTDI Chip recently introduced a new series of USB 3.0 UVC class bridge ICs. The FT602 devices support streaming of video from HD camera equipment. Imaging systems that once could only deliver low-resolution material can now have improved video quality while still running at 60-fps frame rates.FTDIPR74 FTDI

The FT602 devices’ characteristics, benefits, and specs:

  • Improved performance while viewing captured imaging data via standard UVC-enabled hardware and common media player platforms
  • Plug-and-play implementationl; custom drivers aren’t required
  • Complements FTDI’s FT600 and FT601 capable of providing both USB 3.0 SuperSpeed (5 Gbps) and USB 2.0 High Speed (480 Mbps) interfacing
  • Key applications: surveillance/security, machine vision, home/building automation, metrology, and real-time microscopy

Source: FTDI Chip