Intel and Micron have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.
The Intel Optane SSD 900P Series half-height half-length add-in card is available in 480 GB and 280 GB capacities.
The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.
Intel recently announced the Intel Optane SSD 900P Series for use in desktop and workstation PCs. It delivers incredibly low latency and best-in-class random read and write performance at low queue depths. Additionally, Intel expanded the Intel Optane technology offerings for the data center, introducing 750GB capacity and 2.5-inch U.2 form factor versions of the Intel Optane SSD DC P4800X Series. For details on these products and all Intel SSDs, visit Intel’s solid state drives website.
Intel | www.intel.com
Micron Technology | www.micron.com
Interested in wafer-packaged NAND flash storage solutions? ATP Electronics recently launched a new generation of storage solutions using the latest 3D NAND flash technologies. These new 3D NAND-based SSDs are targeted at the industrial and embedded markets for industrial, IoT, medical, automotive, and telecom applications.
ATP provides various chip densities using DDP, QDP, and even ODP die-stacking while using the same wafer stock. This offers flexibility in supply chain, and also enables ATP to ramp multiple product densities quickly. The new 3D NAND solutions are reliable, cost-effective storage solutions.
Source: ATP Electronics
Greenliant Systems’s eMMC NANDrive GLS85VM embedded solid state drive (SSD) product family is available to select customers. The SSDs combine Greenliant’s internally developed NAND controller with NAND flash die, providing a fully integrated SSD in a multi-chip package. The SSDs are available with two bits per cell (MLC) or one bit per cell (SLC) NAND to meet varying customer requirements for lifespan, endurance, and performance.
The 14-mm × 180-mm eMMC NANDrives are offered in a 100 ball grid array (BGA) package with 1-mm ball pitch for increased long-term reliability. The SSDs offer data storage in a small BGA form factor capable of withstanding severe conditions. The NANDrive devices support the JEDEC eMMC 4.4 standard and are backward compatible with the eMMC 4.3 standard.
The eMMC NANDrives feature advanced wear-leveling, bad block management, and error correction code (ECC) capabilities. They also include power interrupt data protection and enhanced security features to safeguard sensitive data.
Contact Greenliant for pricing.
Greenliant Systems, Ltd.