Skylake-Based SBC Runs on 15 Watts

VersaLogic has released the Condor—a high-performance embedded computer that measures only 95 mm x 95 mm x 37 mm and is built around Intel’s 6th generation “Skylake” Core processor. The Condor provides up to six times the processing power of Intel’s Bay Trail processors, while keeping power consumption as low as 15 Watts.The Condor’s on-board TPM security chip can lock out unauthorized hardware and software access. It provides a secure “Root of Trust.” Additional security is provided through built-in AES (Advanced Encryption Standard) instructions.

PR_EPU-4460_HICondor is the latest addition to VersaLogic’s line of EPU (Embedded Processing Unit) format computers. EPUs are designed around COM Express form factors, but are complete board-level computers. They provide all the future flexibility of separate CPU and I/O modules, and are delivered as complete fully assembled and tested units (including heat plate), ready to bolt into a system.

On-board I/O includes two Gbit Ethernet ports with network boot capability, two USB 3.0 ports, four USB 2.0 host ports and two serial ports. One SATA III interface supports high-capacity rotating or solid-state drives. Eight digital I/O lines, I2C and SPI are also available. Two Mini PCIe sockets (one with mSATA capabilities) provide flexible solid-state drive (SSD) options. Systems can be easily enhanced by leveraging the Mini PCIe sockets with plug-in Wi-Fi modems, GPS receivers, MIL-STD-1553, Ethernet, Firewire and other mini cards.

The Condor is designed and tested for industrial temperature (-40° to +85°C) operation and meets MIL-STD-202G specifications to withstand high impact and vibration. For additional reliability, the Condor includes on-board power conditioning which accepts an input of 8 to 30 volts to greatly simplify system power supply design. For additional protection, the conditioner includes Reverse Voltage Protection (RVP) and Over Voltage Protection (OVP) functions.

The Condor, part number VL-EPU-4460, is in stock now. OEM quantity pricing for starts at $1,304 for the Core i3 model with 8 GB RAM.

Versalogic | www.versalogic.com

Stainless Steel Panel PCs Meet Food Industry Needs

Axiomtek has introduced the release of two new IP66/IP69K stainless steel touch panel computers: the 15″ GOT815L-511 and 17″ GOT817L-511 (shown). These Intel Kaby Lake processor-based stainless steel touch panel PCs are especially designed for use in extreme humidity, moist, dusty or wet environments. The highly reliable stainless touch got817-511panel computers adopt a high brightness LCD display with 420 nits (GOT815L-511) and 350 nits (GOT817L-511) brightness to ensure visibility in harsh environments with varying light intensity and come with options for projected capacitive touch or 5-wire flat resistive touchscreen display. The SUS316 stainless steel case can prevent bacteria growth and rust brought on by prolonged usage in moist and wet environments. Furthermore, the flat panel design prevents accumulation of dust and moisture and also makes cleaning easier.

The 15” XGA and 17” SXGA stainless steel panel computers come with rich I/O interfaces with M12-type connectors including two RS-232/422/485 ports, four USB 2.0 ports and one gigabit Ethernet port. They both support one DDR4-2133 SO-DIMM slot with up to 16GB system memory, and one 2.5″ SSD or 2.5″ SATA HDD for storage. Additionally, two PCI Express Mini Card slots are available for wireless network connections. The NEMA 4X Intel Core-based rugged touch panel computers are compatible with Windows 10 and Windows 10 IoT. Mounting ways include suspension and VESA arm.

Axiomtek’s 15-inch GOT815L-511 and 17-inch GOT817L-511 are going to be available in January, 2018.

Axiomtek | www.axiomtek.com

Intel & Micron Expand Manufacturing Effort

Intel and Micron have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

Intel-Optane-SSD-900P-Series

The Intel Optane SSD 900P Series half-height half-length add-in card is available in 480 GB and 280 GB capacities.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.

Intel recently announced the Intel Optane SSD 900P Series for use in desktop and workstation PCs. It delivers incredibly low latency and best-in-class random read and write performance at low queue depths. Additionally, Intel expanded the Intel Optane technology offerings for the data center, introducing 750GB capacity and 2.5-inch U.2 form factor versions of the Intel Optane SSD DC P4800X Series. For details on these products and all Intel SSDs, visit Intel’s solid state drives website.

Intel | www.intel.com

Micron Technology | www.micron.com

New 3D NAND SSDs for Embedded Applications

Interested in wafer-packaged NAND flash storage solutions?  ATP Electronics recently launched a new generation of storage solutions using the  latest 3D NAND flash technologies. These new 3D NAND-based SSDs are targeted at the industrial and embedded markets for industrial, IoT, medical, automotive, and telecom applications.ATP NAND SSDs

ATP provides various chip densities using DDP, QDP, and even ODP die-stacking while using the same wafer stock. This offers flexibility in supply chain, and also enables ATP to ramp multiple product densities quickly. The new 3D NAND solutions are reliable, cost-effective storage solutions.

Source: ATP Electronics

Embedded SSDs For Long-Life Applications

GreenliantGreenliant Systems’s eMMC NANDrive GLS85VM embedded solid state drive (SSD) product family is available to select customers. The SSDs combine Greenliant’s internally developed NAND controller with NAND flash die, providing a fully integrated SSD in a multi-chip package. The SSDs are available with two bits per cell (MLC) or one bit per cell (SLC) NAND to meet varying customer requirements for lifespan, endurance, and performance.

The 14-mm × 180-mm eMMC NANDrives are offered in a 100 ball grid array (BGA) package with 1-mm ball pitch for increased long-term reliability. The SSDs offer data storage in a small BGA form factor capable of withstanding severe conditions. The NANDrive devices support the JEDEC eMMC 4.4 standard and are backward compatible with the eMMC 4.3 standard.

The eMMC NANDrives feature advanced wear-leveling, bad block management, and error correction code (ECC) capabilities. They also include power interrupt data protection and enhanced security features to safeguard sensitive data.

Contact Greenliant for pricing.

Greenliant Systems, Ltd.
www.greenliant.com