Nordic Semiconductor’s new Aruduino Uno shield-compatible nRF51 DK development kit supports Bluetooth Smart, ANT, and 2.4-GHz designs. Nordic also announced the availability of its nRF51 Dongle, which is a 16 mm × 28 mm USB dongle for the testing, analysis, and development of Bluetooth Smart, ANT, and 2.4-GHz applications.
The nRF51 DK is based on Nordic’s nRF51 Series SoC, which combines a 2.4-GHz multiprotocol radio, 32-bit ARM Corte M0 processor, flash memory, and 16- or 32-KB RAM. The SoCs can support a wide range of peripherals and are available in quad flat no-lead (QFN) and wafer level chip scale package (WLCSP) options.
Key points about the nRF51 DK and nRF51 Dongle
- You can use the nRF51 DK with a variety of third-party Arduino shield expansion boards. It also supports ARM mbed for rapid prototyping projects.
- The nRF51 DK allows access to all device peripherals, interfaces, and I/Os.
- The nRF51 DK includes four user-programmable buttons and LEDS plus voltage and current pins to measure device power consumption.
- nRF51 DK and nRF51 Dongle are supported by standard tool-chain options including Keil, IAR, and Gnu Compiler Collection (GCC).
- The 63 mm × 101 mm nRF51 DK includes a coin-cell battery holder for field testing
- You can use nRF51 DKhe DK as a programmer for other target boards that use the nRF51 Series SoC.
The nRF51 DK costs $69. The nRF51 Dongle is $49.
Source: Nordic Semiconductor
Early Bird Registration is now open for the 12th International System on a Chip (SoC) Conference, which will take place at the University of California, Irvine (UCI) from October 22–23, 2014. Early Bird Registration ends October 10, 2014.
The conference will include technical presentations, exhibits, networking opportunities, panel discussions, and keynotes.
About the conference:
- Dr. Takahiro Hanyu, New Paradigm VLSI System Research Group, Laboratory for Brainware Systems Research Institute of Electrical Communication, Tohoku University, Japan
- Jim Aralis, Chief Technology Officer (CTO), and Vice President of R&D, Microsemi
- Dr. Peter L. Gammel, Chief Technology Officer (CTO), Skyworks Solutions, Inc.
- Hughes Metras, VP, Strategic Partnerships CEA-LETI, France.
- Special IC Technology Tutorial
- “IC Technology at New Nodes Made Easy!,” Dr. Alvin Loke, IEEE Solid-State Circuits Distinguished Lecturer, Qualcomm Technologies, Inc.
- “Optical Computing with Silicon Photonics.” Yunshan Jiang, Peter DeVore, Jacky Chan, Bahram Jalali, UCLA
- “Widely Tunable MMMB Wireless Front-Ends Using RF-CMOS MEMS,” Jeffrey L. Hilbert, CEO & Founder, WiSpry, Inc.
- “Packaging and Assembly for Internet of Things Electronics: SoC Performance at SiP Cost,” Dr. Jayna Sheats, CEO, Terecircuits
- “Full SoC Emulation from Device Drivers to Peripheral Interfaces,” Jim Kenney, Marketing Director for Mentor Mentor Graphics’ Emulation Division
- And more.
Source: 2014 SoC Conference
Microsemi Corp. has announced a new larges-density, low-power SmartFusion2 150K LE SoC FPGA Advanced Development Kit. It’s meant for board-level designers and system architects who need to rapidly create system-level designs.
Source: Microsemi Corp.
The kit’s features include:
- Largest 150K LE development device
- 2x FMC connectors (HPC and LPC)
- Purchase of kits comes with a free one-year Libero SoC design software platinum license (valued at $2,500)
- DDR3, SPI flash
- 2× Gigabit Ethernet connectors
- SMA connectors
- PCIe x4 edge connector
- Power measurement test points
Intel, Microsoft, and Circuit Co. have teamed up to produce a development board designed for the production of software and drivers used on mobile devices such as phones, tablets and similar System on a Chip (SoC) platforms running Windows and Android operating systems with Intel processors.
The 6″ × 4″ Sharks Cove board and features a number of interfaces including GPIO, I2C, I2S, UART, SDIO, mini USB, USB, and MIPI for display and camera.
Its main features include:
- Intel ATOM Processor Z3735G , 2M Cache, 4 Core, 1.33 GHz up
to 1.88 GHz
- Intel HD Graphics
- 1 GB 1×32 DDR3L-RS-1333, 16-GB EMMC storage, micro SD Card
- HDMI full size connector, MIPI display connector
- Twelve (5 × 2) Shrouded pin header connectors, 1 (2 × 10) sensor header, 2 × 60 pin MIPI connector for display, camera and 5 (2 × 2) headers for power
- One USB 2.0 type A connector
- One micro USB type A/B for debug
- Audio Codec Realtek ALC5640, speaker output header and onboard digital mic
- Ethernet or WiFi via USB
- Intel UEFI BIOS
- Power, volume up, volume down, home screen and rotation lock
- One micro USB type A/B for Power
- SPI debug programming header
You can preorder the board for $299. It includes a Windows 8.1 image together with all the necessary utilities for it to run on Sharks Cove.
eSOL has started offering the eT-Kernel Evaluation Kit for Xilinx’s Zynq-7000 All Programmable SoC, which combines the dual-core ARM Cortex-A9 MPCore processor with Xilinx’s 28-nm programmable logic fabric. The Evaluation Kit integrates eSOL’s eT-Kernel Multi-Core Edition real time operating system (RTOS), its dedicated eBinder integrated development environment (IDE), middleware components, and device drivers. This complimentary 30-day Evaluation Kit permits developers to easily and quickly evaluate the performance and quality of Xilinx Zynq-7000 All Programmable SoC and eT-Kernel. Since eT-Kernel inherited the functions and architecture of uITRON, the most popular RTOS in Japan and Asian countries, developers can reuse their uITRON-based software assets without further work.
Run-time software in the Evaluation Kit includes the eT-Kernel Multi-core Edition, eSOL’s PrFILE2 FAT file system, the SD memory card driver, and the HDMI display driver, all of which are integrated and immediately run on the Zynq-7000 All Programmable SoC Evaluation Board. The eBinder IDE is available for eT-Kernel Multi-Core Edition-based software development. Besides ARM’s genuine compiler, eBinder offers various development tools and functions to strongly support multi-programming, debugging, and analysis for complex multi-core software development.
Zynq-7000 All Programmable SoC tightly integrates two ARM Cortex-A9 MPCore processors and FPGA fabric. The hardware and software programmability of Zynq-7000 AP SoC enables system development with high performance, flexibility, and scalability, while achieving lower power consumption and cost.
The eT-Kernel/Zynq-7000 All Programmable SoC Evaluation Kit allows developers to jump-start their evaluation using packaged device drivers, which saves the time and money of developing them. Zynq-7000 All Programmable SoC and the eT-Kernel Platform are an ideal combination for advanced embedded systems in the automotive, industrial, and medical arenas, including Automotive Driver Assistance Systems (ADAS), high-resolution graphic systems, machine vision systems, and network systems.
[Source: eSOL Co., Ltd]