MPU-Based SOM Meets Industrial IoT Linux Needs

Microchip Technology has unveiled a new System on Module (SOM) featuring the SAMA5D2 microprocessor (MPU). The ATSAMA5D27-SOM1 contains the recently released ATSAMA5D27C-D1G-CU System in Package (SiP). The SOM simplifies IoT design by integrating the power management, non-volatile boot memory, Ethernet PHY and high-speed DDR2 memory onto a small, single-sided printed circuit board (PCB). There is a great deal of design effort and complexity associated with creating an industrial-grade MPU-based system running a Linux operating system. Even developers with expertise in the area spend a lot of time on PCB layout to guarantee signal integrity for the high-speed interfaces to DDR memory and PHY while complying with EMC standards.

The SAMA5D2 family of products provides an extremely flexible design experience no matter the level of expertise. For example, the SOM—which integrates multiple external components and eliminates key design challenges around EMI, ESD and signal integrity—can be used to expedite development time. Customers can solder the SOM to their board and take it to production, or it can be used as a reference design along with the free schematics, design and Gerber files and complete bill of materials which are available online. Customers can also transition from the SOM to the SiP or the MPU itself, depending on their design needs. All products are backed by Microchip’s customer-driven obsolescence policy which ensures availability to customers for as long as needed.

The Arm Cortex-A5-based SAMA5D2 SiP, mounted on the SOM PCB or available separately, integrates 1 Gbit of DDR2 memory, further simplifying the design by removing the high- speed memory interface constraints from the PCB. The impedance matching is done in the package, not manually during development, so the system will function properly at normal and low- speed operation. Three DDR2 memory sizes (128 Mb, 512 Mb and 1 Gb) are available for the SAMA5D2 SiP and optimized for bare metal, RTOS and Linux implementations.

Microchip customers developing Linux-based applications have access to the largest set of device drivers, middleware and application layers for the embedded market at no charge. All of Microchip’s Linux development code for the SiP and SOM are mainlined in the Linux communities. This results in solutions where customers can connect external devices, for which drivers are mainlined, to the SOM and SIP with minimal software development.

The SAMA5D2 family features the highest levels of security in the industry, including PCI compliance, providing an excellent platform for customers to create secured designs. With integrated Arm TrustZone and capabilities for tamper detection, secure data and program storage, hardware encryption engine, secure boot and more, customers can work with Microchip’s security experts to evaluate their security needs and implement the level of protection that’s right for their design. The SAMA5D2 SOM also contains Microchip’s QSPI NOR Flash memory, a Power Management Integrated Circuit (PMIC), an Ethernet PHY and serial EEPROM memory with a Media Access Control (MAC) address to expand design options.

The SOM1-EK1 development board provides a convenient evaluation platform for both the SOM and the SiP. A free Board Support Package (BSP) includes the Linux kernel and drivers for the MPU peripherals and integrated circuits on the SOM. Schematics and Gerber files for the SOM are also available.

The ATSAMA5D2 SiP is available in four variants starting with the ATSAMA5D225C-D1M- CU in a 196-lead BGA package for $8.62 each in 10,000 units. The ATSAMA5D27-SOM1 is available now for $39.00 each in 100 units The ATSAMA5D27-SOM1-EK1 development board is available for $245.00.

Microchip Technology | www.microchip.com

Integrated Wi-Fi System in Package Module

EconaisThe EC19W01 is a small, smart, highly integrated 802.11b/g/n Wi-Fi system in package (SiP) module. The module is well suited for home automation and smart appliances; Wi-Fi audio speakers and headphones; wireless sensors and sensor networks; wireless monitoring (audio and video); smart appliances; health care and fitness devices; wearable devices; security, authentication, and admittance control; lighting; building/energy/industrial management/control; cloud-connected devices; remote control, data acquisition, and monitoring; and machine-to-machine (M2M) and Internet of Things (IoT) design.

The EC19W01’s features include an integrated 32-bit processor to support application customization, on-board flash and antenna, low power consumption, support for Serial-to-Wi-Fi and SPI-to-Wi-Fi, wireless transmit/receive rates of up to 20 Mbps, and a small 14-mm × 16-mm × 2.8-mm footprint.

Contact Econais for pricing.

Econais, Inc.
www.econais.com

Next-Generation Wi-Fi Modules

eConaisThe EC19D family is small, easily integrated, low-standby power single chip 802.11b/g/n Wi-Fi System In Package (SiP) modules for the Internet of Things (IoT).

The SiP modules help designers quickly and easily connect their devices to 802.11b/g/n Wi-Fi networks. At 8-mm × 8-mm, the EC19D modules can be embedded in almost any product or application. The EC19D will also include FCC, IC, and EC certifications to further simplify and speed up product design and production for use with Wi-Fi networks.

The EC19D incorporates the newest Wi-Fi 802.11b/g/n standards and features to provide designers with many options for embedding the module in their designs. The EC19D’s features include Wi-Fi Direct, ProbMeTM configuration, full TCP/IP stack, HTTPS/SSL, DHCP Client/Server, WPS, legacy Wi-Fi Client, and SoftAP modes with WPA/WPA2 support, serial to Wi-Fi, and Cloud service support.

Contact eConais for pricing.

eConais Inc.
www.econais.com