NXP to Make Security Chips in its US Facilities

NXP Semiconductors has announced a $22 million dollar program that expands its operations in the United States, enabling the Company’s US facilities to manufacture security chips for government applications that can support critical US national and homeland security programs. Upon completion of the expansion project, NXP facilities in Austin, TX and Chandler, AZ will be certified to manufacture finished products that exceed the highest domestic and international security and quality standards.

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NXP R&D manufacturing facilities in San Jose, Austin and Chandler have also undergone a thorough security site certification process to produce Common Criteria EAL6+ SmartMX microcontroller family products. Common Criteria is an international set of guidelines and specifications developed for evaluating information security products to ensure they meet a rigorous security standard for government deployments.

NXP’s SmartMX microcontroller platform is designed for highly secure and fast data transactions. It is ,a proven solution for contact, contactless and dual interface applications. with over six billion ICs deployed in the field. It secures transactions for over one-third of chip-based payment cards in circulation, serving banks all over the world.

More SmartMX info:

  • It serves as the core component in a variety of digital identity schemes and is deployed in nearly 120 out of 145 countries implementing e-Government programs.
  • Used in many sovereign electronic documents such as ePassports, citizen cards, national ID cards, driving licenses, social security cards and health cards.
  • SmartMX is the 6th generation in the market, with NXP holding the most security certificates in the industry.
  • It is the preferred technology for the secure element of NFC-enabled phones.

 

NXP Semiconductors | www.nxp.com

DesignCon 2014 in Santa Clara

DesignCon 2014, an educational conference and technology exhibition for electronic design engineers in the high speed communications and semiconductor fields, will be held in late January at the Santa Clara Convention Center in Santa Clara, CA.

DesignCon is the largest gathering of chip, board, and systems designers in the world and focuses on signal integrity at all levels of electronic design, according to the website www.designcon.com.

The event features the conference, which runs Tuesday through Friday, January 28–31, and the expo on Wednesday and Thursday, January 29–30.

To see the schedule of planned speakers, tutorials, panel discussions, and other events, click here. Information about passes, prices, and registration can be found here.
For more details or assistance, call (415) 947-6135 or (888) 234-9476 or e-mail designconregistration@ubm.com