IIoT Evolution: An Approach To Reuse And Scale Your IIoT Technology Investment

FREE White Paper –
This white paper introduces an IoT framework that complements and extends the massive investments made by cloud vendors to provide comprehensive IIoT features that can be implemented down to the hardware of the edge or end node devices – and can be ported across platforms and clouds. The benefits of using a framework such as MEIF are abundantly clear: minimize learning curves, simplify implementations, increase code reuse, reduce porting costs, and reduce testing.

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Discover Unknown PCB Design Issues with DRC

FREE White Paper –
This paper addresses several of the pervasive myths within the PCB verification market, such as the need for post-layout PCB verification on high-speed designs only. Additionally, it discusses how a designer can seamlessly integrate with the PCB design process to find issues that are often missed by current PCB verification methods.

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Implementing an IoT Edge Device While Minimizing NRE

FREE White Paper –
One designer in a garage, a small startup and even small groups within large companies are designing IoT edge devices. These designers need to keep non-recurring expense (NRE) down by using affordable design tools that are easy to use to quickly produce results and by minimizing IP and fabrication costs. This white paper discusses an approach to minimize NRE for IoT edge device implementation.

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Preventing IoT Edge Device Vulnerabilities

FREE White Paper –
Security issues around IoT edge devices are rarely mentioned in the literature. However, the projected billions of IoT edge devices out in the wild makes for a vast attack surface. Should hardware designers be concerned about security for IoT edge devices? And, is it worth the effort and cost to ensure security at this level? We explore internal design vulnerabilities and 3rd-party attacks on IoT edge devices in this paper in order to answer that question.

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Preparing for an IoT Edge Project

FREE White Paper –
Before starting your IoT edge device development process, it is wise to spend time preparing for your new project. Planning before you start will limit frustration and save you time and money in the long run. Before diving into the task, study the 15 preparation considerations in this white paper.

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PCB Technology Leadership Awards

Mentor has announced its 27th annual PCB Technology Leadership Awards. Started in 1988, this program is the longest running competition of its kind in the electronic design automation (EDA) industry. It recognizes engineers and designers who use innovative methods and design tools to address today’s complex PCB systems design challenges and produce industry-leading products.

Prominent experts in the PCB industry judged entries from around the world in categories that represent a wide variety of industries:

  • Computers, blade and servers, memory systems
  • Industrial control, instrumentation, security and medical
  • Military and aerospace
  • Telecom, network controllers, line cards
  • Transportation and automotive

The PCB Technology Leadership Awards contest was open to any designs created with Mentor PCB solutions. Judging is based on design complexity and overcoming associated challenges, such as small form factor, high-speed protocols, multi-discipline team collaboration, advanced PCB fabrication technologies, and design-cycle time reduction.

The expert judges included Michael R. Creeden, San Diego PCB CEO and founder; Gary Ferrari, FTG Circuits technical support director; Rick Hartley, RHartley Enterprises principal engineer; Steve Herbstman, SHLC founder and lead designer; Happy Holden, Gentex Corporation (retired); Andy Kowalewski, Metamelko LP senior interconnect designer; Pete Waddell, president of UP Media and publisher of Printed Circuit Design & Fab/Circuits Assembly Magazine; and Susy Webb, Fairfield Nodal senior PCB designer.

2017 Technology Leadership Award Winners
Category: Best Overall Design

  • Company: Fujitsu Augsburg
  • Design team: Simon Czermak, Michael Schreittmiller, Sergej Beljaev, Andreas Titz, Mario Lanteri, Markus Wicher, Werner Hasubick, Peter Bräu, Nikola Skordev, Dieter Feiger
  • Using: Xpedition Enterprise
The best overall winner of the 2017 Mentor PCB Technology Leadership Awards is the team from Fujitsu Augsburg for their design of a high-performance computing mainboard. (PRNewsfoto/Mentor, a Siemens business)

The best overall winner of the 2017 Mentor PCB Technology Leadership Awards is the team from Fujitsu Augsburg for their design of a high-performance computing mainboard. (PRNewsfoto/Mentor, a Siemens business)

Category:  Computers, Blade & Servers, Memory Systems

  • 1st place: Adcom
  • Design team: Moshe Frid, Alon Kukuliansky, Nitzan Habler, Eli Moshe, Haim Anava, Doron K’Eliyahu, Lior Elgazar
  • Using: Xpedition Enterprise
  • 2nd place: ASELSAN
  • Design team: Ahmet Erol, Fulya Ağirnas, Fatih Say, Emine Özer Türkay, Mustafa Algan
  • Using: Xpedition Enterprise

Category: Industrial Control, Instrumentation, Security & Medical

  • 1st place: Shenzhen Mindray
  • Design team: Hupeng, Ouyangyilong, Zhaoguolong, Yiyong, Suchaoxun
  • Using: Xpedition Enterprise
  • 2nd place: Murrelektronik GmbH
  • Design team: Matthias Haak, Simon De Serra
  • Using: PADS

Category: Military & Aerospace

  • 1st place: Curtiss-Wright
  • Design team: Ashleye Soanes, Pascal Sauvé, Luc Bouchard, Stephen Reich
  • Using: Xpedition Enterprise
  • 2nd place: Thales Alenia Space Italy
  • Design team: Enrico Checchi, Gabriele Rocco, Giovanni Saldi
  • Using: Xpedition Enterprise/li>

Category: Telecom, Network Controllers, Line Cards

  • 1st place: Altice Labs
  • Design team: Alfonso Figueiredo, Carlos Monica, Victor Soares, Luis Tavares
  • Using: Xpedition Enterprise
  • 2nd place: Coriant Oy
  • Design team: Sauli Kunnas, Peter Kokko, Hannu Saarikoski, Paavo Perälä, Sami Jokinen, Juha Sarapelto, Jyrki Vuorinen, Jycke Sulka-aho, Matti Pulkkinen, Jyrki Nyyssönen, Päivi Vallin, Juha Ahvenainen
  • Using: Xpedition Enterprise

Category: Transportation & Automotive

  • 1st place: Yanfeng Visteon Electronics Technology (Shanghai) Co., Ltd
  • Design team: Yuan Li, Yan Xue, Tao Wang, Qin Li
  • Using: Xpedition Enterprise
  • 2nd place: Sienna Ecad Technologies Pvt Ltd
  • Designer: Krishna Murthy BS, Raghava Charyulu V, Savita R Ganjigatti
  • Using: PADS

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