ADLINK has introduced its latest COM Express Type 6 modules. According to the company, Express-CF modules are equipped with the 8th generation Intel Core processor family and Intel Xeon processor E-2100M family, and are the first Type 6 modules to support both Xeon and Core i7 Hexa-core (6-core) CPUs. These Hexa-core processors support up to 12 threads and a turbo boost of up to 4.4 GHz. Compared to earlier mobile quad-core Xeon and Core i7 CPUs, the additional two cores of the new Hexa-core CPUs results in more than 25% performance boost at no significant cost increase.ADLINK’s Express-CF provides standard support for up to 48GB non-ECC DDR4 in three SO-DIMMs (two on the top side, one on the bottom), while complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon Hexa-core processor support both ECC and non-ECC SODIMMs.
With integrated Intel UHD Graphics 630, the Express-CF supports up to three independent 4K displays via DisplayPort, HDMI, DVI and LVDS. ADLINK also offers either eDP or analog VGA as build options by customer request. Additionally, the Express-CF supports Intel Optane memory and NVMe SSDs through high speed PCIe x4 Gen3 interfaces.
Vadatech has announced the FMC155. The FMC155 is an FPGA Mezzanine Card (FMC) per VITA 57.1 standard, offering a small footprint and allowing for general-purpose I/O expansion.
The FMC155 provides sixteen LVDS input/outputs, eight RS-485/422 RX plus eight RS-485/422 TX, and sixteen single-ended +3.3 V input/outputs. LVDS signals go through a Cross Bar Switch (CBS), which allows input/output routing within each group of eight LVDS signals. Each FMC155 CBS port can be individually software-configured for routing, termination, and direction. RS-485/422 can be full duplex or half-duplex depending on ordering option selected.
System integrators will value having a single off the shelf module to provide multiple I/O with standard high density connector for ease of cabling and differential signaling between the transceivers on the FMC and the FPGA on the carrier for optimal signal integrity across the FMC connector. The flexibility provided by the cross bar switch eases integration with programmable LVDS termination and routing.
Winsystems has announced Its new PPM-C412 series for demanding environments and applications. It offers a broad spectrum of I/O features and the ability to expand functionality in a densely populated, standalone SBC solution. The board delivers greater performance and a clear upgrade path for current PPM-LX800 users while providing full ISA-compatible PC/104-Plus expansion.
At the heart of the board is a Vortex DX3 System on Chip (SOC), which offers a 32-bit x86 architecture with a dual-core microprocessor. The PPM-C412 incorporates dual Ethernet ports coupled with four serial ports, four USB channels and an LPT port for myriad communications options. It also includes dual simultaneous display outputs, one LVDS and one VGA, for Human Machine Interface (HMI) displays. Further, It provides 24 GPIO for monitoring and control, resulting in an I/O-rich, rugged SBC occupying minimal space. The PPM-C412 can be used on its own or in combination with the PC/104-Plus bus to expand functionality and capitalize on its full ISA compatibility, averting the need to re-engineer system architectures.
The PPM-C412 is specifically built for rugged industrial environments, with low power requirements, up to 2 GB RAM and an operating temperature range of -40ºC to +85ºC. With a 10-year availability, this new SBC also extends the product life of systems using commercial off the shelf (COTS) and proprietary PC/104 expansion modules.
AAEON has launched the EPIC-BT07W2 SBC that supports the EPIC form factor and features an industrial-grade thermal range of -40°C to 85°C. The EPIC-BT07W2 is a fanless solution like the rest of AAEON’s EPIC line, and provides high environmental resilience with its wide-temperature design. The CPU is located at the solder side of the board to facilitate further thermal solutions, and comes with a rugged aluminum heat spreader that provides maximum airflow and temperature control. A heatsink is also available as an accessory.
PCI-104 architecture expansion enables daughter boards to be stacked atop on the main board, minimizing lateral space and facilitating maximum flexibility, as well as supporting legacy IO. The EPIC-BT07W2 can be seamlessly integrated into pre-existing hardware such as panel screens and mini PCs. It is also ideal for IoT uses, and is designed for minimum maintenance and maximum ruggedness.
Onboard Intel Atom E3845/ Celeron J1900, N2807 Processor SoC
The BIS-3922 improves on HABEY’s BIS-6922 system by offering additional I/O for more applications and solutions. The system is well suited for automation, digital signage, network security, point of sale, transportation, and digital surveillance applications.
The BIS-3922 system includes six DB9 COM ports on the front panel, one of which supports RS-232/-422/-485. HABEY’s proprietary ICEFIN design ensures maximum heat dissipation and a true fanless system.
The BIS-3922 system is built with the Intel QM77 chipset and is compatible with the third-generation Ivy Bridge Core processors. The BIS-3922 system’s additional features include a HM77 chipset that supports third-generation Intel Core i3/i5/i7 processors; dual gigabit Ethernet ports; High-Definition Multimedia Interface (HDMI), video graphics array (VGA), and low-voltage differential signaling (LVDS) display interfaces; one mini-PCI Express (PCIe) and one mSATA expansion; and a 3.5” single-board computer (SBC) form factor.
The ECM-DX2 is a highly integrated, low-power consumption micromodule. Its fanless operation and extended temperature are supported by the DMP Vortex86DX2 system-on-a-chip (SoC) CPU. The micromodule is targeted for industrial automation, transportation/vehicle construction, and aviation applications.
The ECM-DX2 withstands industrial operation environments for –40-to-75°C temperatures and supports 12-to-26-V voltage input. Multiple OSes, including Windows 2000/XP and Linux, can be used in a variety of embedded designs.
The micromodule includes on-board DDR2 memory that supports up to 32-bit, 1-GB, and single-channel 24-bit low-voltage differential signaling (LVDS) as well as video graphics array (VGA) + LVDS or VGA + TTL multi-display configurations. The I/O deployment includes one SATA II interface, four COM ports, two USB 2.0 ports, 8-bit general-purpose input/output (GPIOs), two Ethernet ports, and one PS/2 connector for a keyboard and a mouse. The ECM-DX2 also provides a PC/104 expansion slot and one MiniPCIe card slot.
The CPU-162-14 is a high-performance COM Express module based on the Intel Core i7 Processor. The COM is designed to work in harsh environments. It includes features to provide extra resilience to vibrations, making it well suited for transportation applications.
The CPU-162-14 includes extended temperature versions for –40°-to-85° operation; direct-mounted RAM and a CPU to withstand stress and vibration; up to 8 GB double data rate type three synchronous dynamic RAM (DDR3 SDRAM); and three video ports including video graphics array (VGA), Intel’s Serial Digital Video Out (SDVO), and low-voltage differential signaling (LVDS).
The PDI Model LV5 and PE5 Series of oscillators provide precision timing in a 3.2-mm × 5-mm ceramic hermetically sealed package. The LV5 is a low-voltage differential signaling (LVDS) ocsillator. The PE5 is a PECL oscillator.
These high-performance clock oscillators offer low integrated phase jitter (0.2 pS for the LV5 and 0.3 pS for the PE5). They are available in frequencies up to 200 MHz and feature a –40°C to 85°C industrial temperature range. Stabilities can be held down to ±25 ppm (depending on temperature range).
The M-5360A is an application-ready solution for multimedia and machine-to-machine (M2M) applications. The credit card-size System on Module (SOM) is powered by a Freescale 800-MHz i.MX537 ARM Cortex A8 processor with 1-GB DDR3 RAM and 4-GB eMMC flash.
The M-5360A features two independent low-voltage differential signaling (LVDS) channels for dual LCDs and one VGA port for external monitor connection. The i.MX537’s multimedia and graphic engine supports OpenGLE 2.0, OpenVG 1.1 graphics acceleration, and 1080P video decoding.
The M-5360A also provides powerful communication functionality (e.g., Ethernet, RS-232, RS-485, CAN 2.0, 1-Wire, and USB). This makes the SOM suitable for multimedia applications as well as embedded networking devices.
The M-5360A uses 128-pin 2-mm pin headers, which simplifies application board design. The SOM includes a preinstalled Ubuntu OS. Android and Windows CE are available by request. In addition to the hardware building blocks, software utility and device drivers are available for user applications.