IoT Platform Release Provides Improved Wireless Capabilities

Ayla Networks has announced new capabilities to its IoT platform that will further simplify the ability to gain business value from IoT. This new Ayla IoT platform release overcomes restrictions on choosing wireless modules to connect to the Ayla IoT cloud and streamlines the creation of enterprise applications that use IoT device data.

A new Ayla portable software agent significantly cuts the time needed to get to market with IoT initiatives, by allowing manufacturers to select essentially any cellular or Wi-Fi module and have it connect easily to the Ayla IoT cloud. For makers of IoT solutions and service providers, the Ayla IoT platform has added new application enablement capabilities that make it faster and easier to build both mobile and web-based enterprise applications that take advantage of IoT data.
To connect to an IoT cloud, devices use an embedded cellular or Wi-Fi module, comprising both a hardware chip and a software agent, that provides wireless cloud connectivity. Until now, IoT software agents had to be built and certified to work with a specific chip and module type, an expensive process that could take a year or more and involve significant certification overhead.

The new Ayla portable agent circumvents this problem by enabling connectivity to the Ayla IoT cloud from any cellular or Wi-Fi module—without the lengthy process of certifying a different software agent for each chip or module variation, and without having to generate source code to port the agent to a chosen module. As a result, IoT solution providers that want to connect to the Ayla IoT cloud are no longer restricted to a list of certified cellular or Wi-Fi modules; instead, they can take a bring-your-own (BYO) approach to IoT modules.

The Ayla portable agent includes source code, reference implementation, a porting guide, and a test suite for both cellular and Wi-Fi solutions. In addition, Ayla Networks can recommend development partners able to perform porting work for enterprises that lack in-house IoT firmware development expertise.

The Ayla Web Software Development Kit (SDK) reduces development cycles for applications that leverage IoT device data in conjunction with an enterprise’s other cloud or data integrations. A new product, the Ayla Web SDK makes it easy for developers to create business applications on top of the Ayla IoT platform. It provides pre-packaged functionality for user management, device monitoring, session management and rule-based access control (RBAC) management.

Ayla Networks | www.aylanetworks.com.

Connected Retail IoT System Employs Nordic’s BLE SoC

Nordic Semiconductor has announced that Insigma, a U.S.-based Internet of Things (IoT) solutions company, employs Nordic’s nRF52832 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) in its “Connected Retail” suite of IoT products. Insigma’s Connected Retail solution allows brands to create an intelligent IoT network of smart coolers, shelves, displays, and vending machines with minimal human intervention. The solution employs a proprietary wireless sensor and camera techology to record and report on stock levels, product placement compliance, product consumption trends and consumer engagement.

In operation, the device is equipped with two cameras, which take images of the products in the cooler or on the shelf. This image is then processed via Insigma’s proprietary machine vision technology to detect the products in view. To start collecting data and analytics, Insigma’s customers simply attach the sensor to the inside of an existing cooler, vending machine, or shelf without need for wiring or mains power. The integration of the Nordic SoC establishes ultra low power wireless connectivity, delivering up to seven years battery life thanks in part to the ultra low power characteristics of the Nordic SoC.

The nRF52832 has been engineered to minimize power consumption with features such as the 2.4 GHz radio’s 5.5 mA peak RX/TX currents and a fully-automatic power management system that reduces power consumption by up to 80 percent compared with Nordic’s nRF51 Series SoCs.

The collected data is stored on the device and is then relayed on-site to a sales agent or technician’s Bluetooth 4.0 (and later) smartphone or tablet using Bluetooth LE wireless connectivity. From Insigma’s ‘Virtual Hub’ app, the data can then be uploaded to Insigma’s Cloud servers, or sent directly to an IoT gateway (again via Bluetooth LE), from where it is automatically sent to Insigma’s Cloud servers via a GSM or CDMA cellular network. The secure and scalable Cloud platform features alert and artificial intelligence engines enabling device management and configuration, while providing a reporting dashboard to display complex IoT data with simple visualization.

Nordic’s nRF52832 multiprotocol SoC combines a 64 MHz, 32-bit Arm Cortex M4F processor with a 2.4 GHz multiprotocol radio (supporting Bluetooth 5, ANT and proprietary 2.4 GHz RF protocol software) featuring -96 dBm RX sensitivity, with 512 kB flash memory and 64 kB RAM.

The SoC is supplied with Nordic’s S132 SoftDevice, a Bluetooth 5-certifed RF software protocol stack for building advanced Bluetooth LE applications. The S132 SoftDevice features Central, Peripheral, Broadcaster and Observer Bluetooth LE roles, supports up to twenty connections, and enables concurrent role operation.

Nordic Semiconductor | www.nordicsemi.com

 

Zigbee Certification Transfer Effort Looks to Boost IoT Growth

The Zigbee Alliance has announced a new Certification Program that creates new business opportunities for members, and makes it easy for new entrants to join the growing ecosystem of Certified Products that work with major consumer and commercial IoT platforms. The new program is now open, and permits members — and for the first time, non-members — to quickly adopt, sell, and market Certified Products under their own brand while maintaining those products’ Certified status.

For new entrants to the IoT, or companies looking to fill a gap in their portfolio, this program offers an easy, fast, and affordable avenue to implement Certified Products from Alliance Participant and Promoter member companies, and then market those products under their own brand. Approved products can then carry the Zigbee Certified logo, leveraging the brand recognition and interoperability mark of Zigbee and allowing companies to create products that work with the leading consumer and commercial IoT and smart home platforms, or even create their own from the diverse portfolio of Zigbee Certified Products.

For Zigbee Alliance Participant and Promoter members, this program opens new markets and sales channels by enabling them to offer Certified Products to customers for re-branding and non-functional modification while maintaining those products’ Certified status. Adopter-level members of the Zigbee Alliance are also eligible to receive unlimited Certification Transfers on products from Participant or Promoter companies, and market those products using their own brand.

Industry analysts project Zigbee technology will ship in 3.8 billion (85%) of the 4.5 billion 802.15.4 units predicted to hit the market in 2023. As consumers embrace the smart home, and leading ecosystem providers – such as Amazon, Comcast, Huawei, IKEA, Legrand, Schneider Electric, Signify (formerly Philips Lighting), Somfy, and Samsung SmartThings – continue to create products based on the Zigbee Alliance’s wireless standards, IoT product developers are eager to participate in and build on the network of thousands of Zigbee Alliance Certified products already making meaningful connections between humans and the objects in their environment.

How the Program Works

Participant or Promoter members are now populating the online Certification Transfer Tool with products available for a Certification Transfer. To receive a Certification Transfer, you must be either a Zigbee Alliance Member (in good standing), or be a new company who has never been an Alliance member.

To participate in the program, products for certification transfer must:

  • Be previously Certified by the Zigbee Alliance (Zigbee 3.0, Zigbee Smart Energy, and Green Power devices)
  • Be Certified as an “end product”
  • Be enrolled by a Participant or Promoter Company for certification transfer in the member certification web tool

The new Certification Transfer Program is open now. To share more about the program, the Zigbee Alliance will be holding a public webinar on August 22, 2018 at 7 am to go over the details of the process and the benefits to those who take part in the program. Register here.

The Zigbee Alliance | www.zigbee.org

2G Cellular Module Smooths Upgrade Path to LPWA

U‑blox has announced the SARA‑G450, a cost‑optimized 2G cellular module for machine‑to‑machine (M2M) applications, such as utility metering and tracking systems. Provided in the industry‑proven SARA form factor, the SARA‑G450 quad‑band GSM/GPRS module lets product developers easily migrate their products to 3G, LTE, or LPWA technology to meet a broad range of environmental and technological requirements.

2G cellular technology offers reliable performance for mobile applications and broad geographical coverage. Until recently, this made it the technology of choice for machine type connectivity such as fleet management, metering and tracking. While some regions are currently phasing out their 2G network infrastructure (most notably the USA), 2G continues to be a viable and popular option for M2M solutions in regions still lacking NB‑IoT and LTE Cat M1 networks or where coverage is spotty. The SARA‑G450 is an ideal solution for cost and space‑sensitive applications in these markets.

Thanks to its pin‑compatibility with the entire u‑blox cellular line‑up product designers can use a single platform and PCB design to enable solutions for a variety of air interface technologies, including  2G, 3G, LPWA (LTE Cat M1 and NB1), and high speed LTE. This also means that product developers can anticipate future upgrades of their applications to move to LTE Cat M1 and NB1 connectivity as soon as they become available in their target markets.

SARA‑G450 is a standard grade quad‑band GSM/GPRS module that is power‑optimized for IoT applications. It offers the flexibility to combine with a variety of best‑in‑class u‑blox GNSS or Bluetooth modules for solutions that integrate positioning, short range and cellular communication. An embedded internet suite facilitates the development of a wide range of M2M devices.

Samples will be available at the end of August with production starting end of September.

U-blox | www.u-blox.com

Tuesday’s Newsletter: IoT Tech Focus

Coming to your inbox tomorrow: Circuit Cellar’s IoT Technology Focus newsletter. Tomorrow’s newsletter covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

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Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Embedded Boards.(8/28) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Analog & Power. (9/4) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Microcontroller Watch (9/11) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

Implementing an IoT Edge Device While Minimizing NRE

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Flexible Embedded/IoT OS Targets 8-/16-/32-bit MCUs

Segger has introduced emPack, a complete operating system for IoT devices and embedded systems. It is delivered in source code for all 8-/16-/32-bit microcontrollers and microprocessors. emPack is optimized for high performance, and small memory footprint and easily fits onto typical MCUs without requiring expensive external memory, keeping the cost of the embedded computing system to a minimum.
emPack components are written in plain C and can be compiled by standard ANSI/ISO C compilers. The software package includes embOS, emWin, emFile, embOS/IP, emUSB- Device, emUSB-Host, emModbus, emCompress, emCrypt, emSecure, emSSL, emSSH, and SEGGER’s IoT Toolkit.

All emPack components work seamlessly together and are continuously tested on a variety of microcontrollers from different vendors. According to the company, it is very easy to get started with emPack. And it significantly reduces the time it requires to deliver a product using robust and well tested components that simply work.

Another benefit of using emPack as a platform is portability: Switching to a different microcontroller even with a different core requires minimal changes. Standardizing on emPack enables you to enhance your products when newer, more powerful processors are introduced, or can target a wider customer base with cost-optimized products using less expensive MCUs.

Because all components work together through well-defined interfaces, existing projects that already have a mandated RTOS can use emPack’s components by simply customizing a small number of OS adaptation functions. emPack has been fully tested with Amazon FreeRTOS and example configurations are available upon request.

Segger | www.segger.com

High-Performance MCUs Serve IoT Device Needs

STMicroelectronics has added two new lines to its STM32 MCU family, the STM32F7x0 and H7x0 Value Line. The MCUs are aimed at enabling system designers to create affordable performance-oriented systems including real-time IoT devices, without compromising features or cyber protection.

These new lines trim embedded flash to the essential, still allowing secure boot, sensitive code and real-time routines to run safely on-chip, leveraging access times over 25 times faster than for external Flash (for cache miss). If needed, applications can scale-up either by adding off-chip serial or parallel (up to 32-bit) memories and leveraging the MCUs’ broad external interfaces and eXecute in Place (XiP) capability, or by porting to other pin-to-pin compatible STM32F7 or STM32H7 MCU lines, with up to 2 MB Flash and up to 1 MB RAM, supported by the same ecosystem with the same easy-to-use tools.

The Value Lines retain powerful STM32F7 and H7 features, such as the state-of-the-art peripherals, hardware accelerators, and the real-time architecture with ultra-fast internal buses, short interrupt latency, and fast (approximately 1 ms) boot-up. The MCUs are also energy efficient, with flexible power modes, gated power domains, and on-chip power management that simplify design and reduce BOM cost.

With execution performance up to 2020 CoreMark at the heart of a secure and power-efficient architecture, the new Value Line devices are the entry point to IoT innovation in medical, industrial, and consumer applications. CoreMark is the EEMBC standardized benchmark for embedded-CPU performance. With up to 125°C as the maximum junction temperature, developers can leverage the full core and peripherals performance even when ambient temperature increases.

The entry-level STM32F730 delivers 1082 CoreMark performance running at 216MHz aided by ST’s unique ART Accelerator for zero-wait-state execution from Flash. Features include cryptographic hardware acceleration, a USB 2.0 High Speed port with PHY, and a CAN interface. There is a 64Kbyte Flash, 8KByte Instruction and data caches for high-performance execution from internal or external memories, 256KB of system RAM and 16 KB plus 64 KB of Tightly Coupled Memory (TCM) for the most critical routines and data.

The STM32F750 adds a TFT-LCD controller with ST’s proprietary Chrom-ART Graphics Accelerator. It has hardware acceleration for hash algorithms, two CAN interfaces, an Ethernet MAC, camera interface, and two USB 2.0 interfaces with Full Speed PHY. There are 64Kbytes of Flash, 4Kbyte instruction and 4 KB data caches, 320 KB of system RAM and 16 KB plus 64 KB TCM.

The high-end STM32H750 delivers 2020 CoreMark performance at 400 MHz and adds a hardware JPEG coder/decoder to the TFT controller and Chrom-ART Accelerator for even faster GUI performance. There is also a CANFD port and additional CANFD with time-trigger capability and best-in-class operational amplifiers and 16-bit ADCs running at up to 3.6 Msample/s. The 128 KB flash, 16 KB instruction and data caches, 864 KB system RAM and the 64 KB+128 KB of TCM all feature ECC (Error Correction Code) for safe execution from internal or external memory.

The STM32F730, STM32F750, and STM32H750 Value Line MCUs are in production, in various LQFP and BGA package options from 64-pin to 240-pin. Prices start from $1.64 for the STM32F730, $2.39 for the STM32F750 and $2.69 for the STM32H750 for orders of 1,000 pieces.

STMicroelectronics | www.st.com

Compact MCU Offers Enhanced Security Features

Maxim Integrated Products has announced the MAX32558 “DeepCover” family of secure microcontrollers that provide advanced cryptography, secure key storage and tamper detection in a 50% smaller package. As electronic products become smaller and increasingly connected, there is a growing threat to sensitive information and privacy, requiring manufacturers to keep security top of mind when designing their devices. While designers should prevent security breaches at the device level, they often struggle with the tradeoff of enhanced security with minimized board space, as well as the cost of design complexity and meeting time to market goals.
The MAX32558 DeepCover Arm Cortex-M3 flash-based secure microcontroller solves these challenges by delivering strong security in a small footprint while simplifying design integration and speeding time to market. It integrates several security features into a small package, including secure key storage, a secure bootloader, active tamper detection and secure cryptographic engines. It also supports multiple communications channels such as USB, serial peripheral interface (SPI), universal asynchronous receiver-transmitter (UART) and I2C, making it ideal for a wide range of applications. Maxim’s long-standing reputation and experience in payment terminal certifications as well as its established support and technology can help streamline the certification process for customers, reducing the process up to 6 months’ time (rather than the typical 12 to 18 months).

Security:Features:

  • Shields sensitive data by providing the most secure key storage available
  • Offers secure bootloader, active tamper detection and secure cryptographic engines
  • Compliant with Federal Information Processing Standard (FIPS) 140-2 L3&4 certification

Compared to a secure authenticator, the MAX32558 provides 30x more general-purpose input/output (GPIO) in the same PCB footprint (4.34 mm x 4.34 mm) wafer-level package (WLP). The closest competitor, meanwhile, offers a device with similar features but in a much larger package (8 mm x 9 mm ball-grid array 121 (BGA121)). The devices reduces footprint by embedding a number of security features to address point-of-sale Payment Card Industry (PCI) pin transaction security (PTS) requirements, as well as several analog interfaces. It provides 512 KB of internal flash and 96 KB of internal SRAM

Easy design integration is enabled by a complete software framework including real-time operating system (RTOS) integration and code examples in evaluation kit. Code can be easily ported from one device to another as it shares the same API software library as the rest of the product family. A pre-certified Europay, Mastercard and Visa (EMV)-L1 stack for smartcard interface is provided. Extensive documentation and code is provided for managing the device lifecycle, such as secure firmware signing and device personalization. The MAX32558 is available at Maxim’s website for $3.80 (1,000-up).

Maxim Integrated | www.maximintegrated.com

Tuesday’s Newsletter: Microcontroller Watch

Coming to your inbox tomorrow: Circuit Cellar’s Microcontroller Watch newsletter. Tomorrow’s newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

Already a Circuit Cellar Newsletter subscriber? Great!
You’ll get your Microcontroller Watch newsletter issue tomorrow.

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Don’t be left out! Sign up now:

Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

IoT Technology Focus. (8/21) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Embedded Boards.(8/28) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Analog & Power. (9/4) This newsletter content zeros in on the latest developments in analog and power technologies including DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Tuesday’s Newsletter: Analog & Power

Coming to your inbox tomorrow: Circuit Cellar’s Analog & Power newsletter. Tomorrow’s newsletter content zeros in on the latest developments in analog and power technologies including ADCs, DACs, DC-DC converters, AD-DC converters, power supplies, op amps, batteries and more.

Bonus: We’ve added Drawings for Free Stuff to our weekly newsletters. Make sure you’ve subscribed to the newsletter so you can participate.

Already a Circuit Cellar Newsletter subscriber? Great!
You’ll get your Analog & Power newsletter issue tomorrow.

Not a Circuit Cellar Newsletter subscriber?
Don’t be left out! Sign up now:

Our weekly Circuit Cellar Newsletter will switch its theme each week, so look for these in upcoming weeks:

Microcontroller Watch. (8/14) This newsletter keeps you up-to-date on latest microcontroller news. In this section, we examine the microcontrollers along with their associated tools and support products.

IoT Technology Focus. (8/21) Covers what’s happening with Internet-of-Things (IoT) technology–-from devices to gateway networks to cloud architectures. This newsletter tackles news and trends about the products and technologies needed to build IoT implementations and devices.

Embedded Boards.(8/28) The focus here is on both standard and non-standard embedded computer boards that ease prototyping efforts and let you smoothly scale up to production volumes.

Eurotech IoT Tech Tapped for Smart Agriculture Projects

Eurotech has announced that AVR, a potato harvester manufacturer based in Belgium, has chosen the ReliaGATE family of intelligent edge computers running Eurotech’s Everyware Software Framework and Everyware Cloud to manage the edge devices for its smart agriculture project to connect its harvesting machinery. These IoT building blocks are integrated by AVR partner Delaware Consulting with a Microsoft MS Azure-based IoT platform that gathers, analyzes and visualizes data from sensors on tractors and other farming vehicles.
With a showcase version up and running, AVR plans to release the platform for end users later in 2018, gathering market feedback to drive the development of new capabilities. No financial information has been disclosed. AVR has a decades-long history in the field of potato agriculture, designing and manufacturing harvesters, planters and cultivators. It’s a niche market, but they are one of the world’s biggest players, exporting equipment to every continent. However, even a traditional industry like agriculture is being impacted by emerging IoT innovations.

According to AVR, Agriculture adopts new tech relatively slowly compared to other sectors. But the key words “smart farming: and :precision agriculture” are cropping up more and more often. In the past, AVR focused much more on the mechanical side of agriculture. Now, its goal is to develop smarter machines with many more sensors and use the data its collects to bring value and transparency to stakeholders along the entire value chain.

Eurotech | www.eurotech.com

Cloud-based Eval Service for Nordic BLE SoC-Based Designs

Nordic Semiconductor has launched “nRF Connect for Cloud”, a free service for Cloud-based evaluation, test, and verification of Bluetooth Low Energy (Bluetooth LE) designs employing Nordic’s nRF51 and nRF52 Series multiprotocol Bluetooth LE SoCs. nRF Connect for Cloud features an intuitive workflow and offers much of the functionality of Nordic’s “nRF Connect for Desktop” and “nRF Connect for Mobile” which are popular applications used for building and developing Bluetooth LE products. nRF Connect for Cloud also supports an extensive range of standard Bluetooth services together with proprietary services such as nRF UART.
Operating with all popular browsers, nRF Connect for Cloud uses web Bluetooth application programming interfaces (APIs) to push and extract data to and from the Cloud, enabling the developer to test and modify the behavior and performance of prototypes. By using the front-end and visualization features of nRF Connect for Cloud, historical data can be extracted from databases and analyzed in a browser. The product also allows engineers to monitor and interact with remote wireless IoT designs enabling the collaboration of geographically separate development teams on a single project.

nRF Connect for Cloud is supported by the nRF Gateway App available for iOS and Android-powered mobile devices. The nRF Gateway App enables Nordic Bluetooth LE devices to use a smartphone-enabled Internet gateway to convert Bluetooth LE messages to ReST/MQTT/IP protocols for Cloud interoperability.

The Gateway App communicates with the nRF Connect for Cloud back-end hosted on Amazon Web Services (AWS) and is based on Software as a Service (SaaS) components. By leveraging AWS industry-grade components, the app implements end-to-end data and device connectivity, guarantees reliability, and scales from a few to hundreds of Bluetooth LE devices.

nRF Connect for Cloud currently supports Bluetooth LE solutions but future versions will also support Nordic’s nRF91 Series low power, global multimode LTE-M/NB-IoT System-in-Package (SiP) for cellular IoT.

nRF Connect for Cloud works out-of-the-box with the Nordic Thingy:52 IoT Sensor Kit, Nordic nRF5 development kit (DK), and software development kit (SDK) examples. A quick-start guide is available from www.nrfcloud.com.

Nordic Semiconductor | www.nordicsemi.com

MCUs Bring Enhanced Security to IoT Systems

Microchip has announced its SAM L10 and SAM L11 MCU families addressing the growing need for security in IoT applications. The new MCU families are based on the Arm Cortex-M23 core, with the SAM L11 featuring Arm TrustZone for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. Security features on the MCUs include tamper resistance, secure boot and secure key storage. These, combined with TrustZone technology, protect applications from both remote and physical attacks.

In addition to TrustZone technology, the SAM L11 security features include an on-board cryptographic module supporting Advanced Encryption Standard (AES), Galois Counter Mode (GCM) and Secure Hash Algorithm (SHA). The secure boot and secure key storage with tamper detection capabilities establish a hardware root of trust. It also offers secure bootloader for secure firmware upgrades.

Microchip has partnered with Trustonic, a member of Microchip’s Security Design Partner Program, to offer a comprehensive security solution framework that simplifies implementation of security and enables customers to introduce end products faster. Microchip has also partnered with Secure Thingz and Data I/O Corporation to offer secure provisioning services for SAM L11 customers that have a proven security framework.

Both MCU families offer Microchip’s latest-generation Peripheral Touch Controller (PTC) for capacitive touch capabilities. Designers can easily add touch interfaces that provide an impressively smooth and efficient user experience in the presence of moisture and noise while maintaining low power consumption. The touch interface makes the devices ideal for a myriad of automotive, appliance, medical and consumer Human Machine Interface (HMI) applications.

The SAM L10 and SAM L11 Xplained Pro Evaluation Kits are available to kick-start development. All SAM L10/L11 MCUs are supported by the Atmel Studio 7 Integrated Development Environment (IDE), IAR Embedded Workbench, Arm Keil MDK as well as Atmel START, a free online tool to configure peripherals and software that accelerates development. START also supports TrustZone technology to configure and deploy secure applications. A power debugger and data analyzer tool are available to monitor and analyze power consumption in real time and fine tune the consumption numbers on the fly to meet application needs. Microchip’s QTouch Modular Library, 2D Touch Surface Library and QTouch Configurator are also available to simplify touch development.

Devices in the SAM L10 series are available starting at $1.09 (10,000s). Devices in the SAM L11 series are available starting at $1.22 (10,000s).

Microchip Technology | www.microchip.com

Compact Board-Mount Power Supplies Target IoT Systems

XP Power has launched its low-cost VCE03 and VCE10, 3 W and 10 W series of board-mounted AC-DC power supplies with extended universal input range from 85 VAC to 305 VAC, covering all nominal AC inputs from 100 VAC to 277 VAC in a single ultra-compact design. Both the VCE03 and VCE10 provide a complete AC-DC solution with integrated EMC filter and hold-up capacitor, meaning there are no extra external components required. Their small size, high efficiency and low no load input power consumption makes them well suited for IoT applications.The 3 W parts are available in an ultra-compact encapsulated or open-frame SIP package for maximum flexibility and potential cost and space savings. The compact 10 W parts are offered as encapsulated or open-frame DIP’s. Their high-active efficiency and low no-load input power of less than 0.3 W make these devices suitable for a wide range of applications supporting environmental initiatives for end equipment. The series offer a wide range of outputs covering 3.3 V, 5 V, 9 V, 12 V, 15 V, 24 V and 48 V with over-load, over-voltage and short circuit protection included.

All models are class II, earth-free construction and have 3000 VAC isolation rating with world-wide safety approvals to IEC60950-1 for ITE equipment, IEC/UL/EN62368-1 for ITE and audio-visual equipment and IEC/EN60335-1 for household appliances. The parts comply with EN55032 Level B conducted and radiated emissions.

No external heatsinking is required, with convection cooling giving an operating temperature range for both series from -25°C to +70°C, with full power available up to +50°C. The extended input range up to 305 VAC allows use of the parts in 277 VAC nominal systems, common in lighting applications and in industrial areas generally. The parts will find applications in lighting, automation and process control, instrumentation, set-top boxes, household devices, home automation and test & measurement equipment.

The VCE03 & VCE10 can also be implemented as auxiliary supplies in larger power conversion systems where they can maintain control circuitry powered on standby, allowing main conversion stages to be fully disabled, reducing standby and no-load losses.

XP Power | www.xppower.com