COM-Based SBCs Offer High I/O Density

Diamond Systems has released its ultra-small COM-based ZETA single board computer family. Highlights include interchangeable COM Express COMs for scalability and long product life, ultra- compact size and an rich amount of I/O, including a complete high-quality analog and digital data acquisition subsystem.

Designed in the COM Express Mini Type 10 form factor (84 mm x 55 mm / 3.3 in. x 2.2in.), the Zeta family offers performance scalability due to its use of COM Express CPU modules. Three processor options are currently available: Intel “Bay Trail” E3825 dual-core 1.33 GHz CPU with soldered 2 GB RAM; Intel “Apollo Lake” E3940 quad core 1.60 GHz CPU with soldered 4 GB RAM; and Intel “Apollo Lake” N4200 quad core 1.1 GHz (burstable to 2.5 GHz) CPU with soldered 8 GB RAM.

zeta-enlargedThe use of interchangeable CPU modules in the increasingly popular COM Express Mini Type 10 format enables Zeta to serve applications across a wide spectrum of price and performance needs. It also offers customers the longest possible product lifetime by vastly simplifying migration to a new CPU when the current one reaches its end of life. Zeta is an excellent choice for applications with expected lifetimes of 10 or more years, including military, medical, and transportation.

Zeta’s two-board COM + baseboard construction yields the highest feature density possible in a given footprint. The COM provides the core CPU functions, while the baseboard provides the “final inch” for all the system I/O plus the data acquisition subsystem, power supplies, and expansion sockets. Zeta provides as much as a 60% reduction in size compared to boards in larger form factors offering the same level of I/O.

Zeta’s impressive I/O list includes the following:

  • VGA display and Single-Channel LVDS port
  • Dual Gigabit Ethernet
  • 4 USB 2.0 Ports + 1 USB 3.0 port
  • 4 RS-232/422/485 ports with software-programmable protocol and termination
  • 16 digital IlO lines
  • Optional complete analog and digital data acquisition system
  • Integrated wide-range 6 V to 36 V power input circuit

Zeta is available in two I/O configurations, digital I/O only or digital + analog I/O. The DIO only circuit offers 16 DIO lines with selectable 3.3V/5V logic levels. The full circuit includes 16 channels of 16-bit A/D, 4 channels of 16-bit D/A, 27 digital I/O lines with selectable 3.3V/5V logic levels, and 8 32-bit counter/timers, all supported by Diamond’s free, industry-leading Universal Driver data acquisition programming library. An interactive graphical control panel for Windows and Linux is also provided to control all data acquisition features.

Zeta offers multiple options for system expansion and mass storage. It includes a PCIe Minicard / mSATA socket and a micro-SD socket. A unique expansion connector enables the installation of a daughterboard that contains an M.2 SATA SSD socket, a second PCIe Minicard socket, HD audio and 16 additional GPIO lines.

A built-in heat spreader efficiently removes heat from the SBC to keep the processor and all internal electronics cooler for improved reliability. The bottom-side mounting configuration of the heat spreader provides a secure and convenient mounting system for the board. It also simplifies the installation of I/O expansion modules by eliminating interference or airflow problems that can occur with traditional heat sinks. All three models of Zeta are tested for operation over the full industrial temperature range of -40°C to +85°C, making Zeta well suited for vehicle applications.

Diamond Systems | www.diamondsystems.com

Intel & Micron Expand Manufacturing Effort

Intel and Micron have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

Intel-Optane-SSD-900P-Series

The Intel Optane SSD 900P Series half-height half-length add-in card is available in 480 GB and 280 GB capacities.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.

Intel recently announced the Intel Optane SSD 900P Series for use in desktop and workstation PCs. It delivers incredibly low latency and best-in-class random read and write performance at low queue depths. Additionally, Intel expanded the Intel Optane technology offerings for the data center, introducing 750GB capacity and 2.5-inch U.2 form factor versions of the Intel Optane SSD DC P4800X Series. For details on these products and all Intel SSDs, visit Intel’s solid state drives website.

Intel | www.intel.com

Micron Technology | www.micron.com

COM Express Solution Serves up NVIDIA GPUs

Connect Tech now offers NVIDIA Quadro and Tesla GPUs on its COM Express + GPU Embedded Platform. The platform combines Intel processors with NVIDIA GPUs into a ruggedized small form factor embedded system. This is an ideal platform to enable deployable multi-Teraflop CUDA solutions in a small rugged solution.

Connect Tech VXG006-AngleThis embedded system exposes all of the latest generation interconnect including: Gbit Ethernet, USB 3.0 and 2.0, DisplayPort++, VGA, LVDS, SATA III, GPIO, I2C, mSATA, miniPCIe, PCIe/104 and SD Card Expansion. The system uses all locking ruggedized positive latching connectors. It eases the challenge of cooling multiple processors with the use of the company’s Unified Thermal Extraction Baseplate that can be mounted directly into an enclosure or chassis for further thermal dissipation.

The COM Express + GPU Embedded System from Connect Tech combines Intel Skylake and Kaby Lake x86 processors with high-end NVIDIA GPUs. Users can choose from highest-end, highest-performance models or from low-powered extended temperature models all ideal for high-end encode/decode video applications or GPGPU CUDA processing applications.

Connect Tech | www.connecttech.com

COM Express Card Features Core i7-7600U Processor

ARBOR Technology has expanded its line of modules with the introduction of a 7th generation Intel Core processor platform (formerly codenamed ”Kaby Lake-U”), the EmETXe-i90U0, a Type 6 compact module. The single-chip processors feature a low power consumption of just 15W TDP. Built on Intel’s new 14nm process technology, the 7th generation Intel Core processor is designed to provide excellent graphics and performance.

Arbor_1__EmETXe-i90U0_photo_17071013_436

The new Intel HD Graphics 620 in 7th generation Intel Core processors provide Ultra HD/4K display and additional codec support. Enhanced security and manageability features help to drive down total cost and risk, protecting data and preventing malware threats. The boards allow the connection of up to three independent display interfaces via HDMI 1.4, LVDS and embedded DisplayPort (eDP). When using DisplayPort 1.2, the individual displays can be daisy chained to take advantage of simple wiring. Native USB 3.0 support provides fast data transmission with low power consumption. The two SODIMM sockets can be equipped with up to 32 GB SO-DIMM DDR4 memory.

A total of twelve USB ports are provided, four of them support USB 3.0 SuperSpeed. Eight PCI Express 2.0 lanes, two SATA ports with 6 Gb/s SATA RAID and Gigabit Ethernet support via the Intel i219-LM GbE LAN controller (with AMT 11 support) which enables fast and flexible system extensions, completes the highly flexible design. Extra features included are TPM, up to 32 GB eMMC 5.0, two UART (RX/TX) ports, 8-bit Digital I/O and 5 V – 20 V wide range power input. The EmETXe-i90U0 board can work in temperatures from -40°C to 85°C.

ARBOR Technology | www.arbor-technology.com

Promoter Group Announces USB 3.2 Spec Update

The USB 3.0 Promoter Group has announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices, effectively doubling the bandwidth to extend existing USB Type-C cable performance. During the upcoming USB Developer Days 2017 event, the promoters will provide detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other topics.

20170726120126_USB-Type-cFrontWeb

While USB hosts and devices were originally designed as single-lane solutions, USB Type-C cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C cable that is certified for SuperSpeed USB 10 Gbps.

Key characteristics of the USB 3.2 solution include:

– Two-lane operation using existing USB Type-C cables

– Continued use of existing SuperSpeed USB physical layer data rates and encoding techniques

– Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation

For users to obtain the full benefit of this performance increase, a new USB 3.2 host must be used with a new USB 3.2 device and the appropriate certified USB Type-C cable. This update is part of the USB performance roadmap and is specifically targeted to developers at this time. Branding and marketing guidelines will be established after the final specification is published. The USB 3.2 specification is now in a final draft review phase with a planned formal release in time for the USB Developer Days North America event in September 2017.

The USB 3.0 Promoter Group, comprised of Apple, Hewlett-Packard, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST Microelectronics, and Texas Instruments, continues to develop the USB 3.x family of specifications to meet the market needs for increased functionality and performance in SuperSpeed USB solutions. Additionally, the USB 3.0 Promoter Group develops specification addendums (USB Power Delivery, USB Type-C, and others) to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.x technology will be beneficial in delivering a more ubiquitous, richer user experience.

USB 3.0 Promoter Group | www.usb.org

Qseven Module Sports Apollo Lake Processor

Axiomtek has released the Q7M311, a new Qseven module with Intel Apollo Lake processor, dual display interfaces, 32 Gbytes of eMMC memory, and wide operating temperature supported. The Q7M311 has adopted the 14nm Intel Pentium N4200 and Celeron N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4 Gbytes (or optionally up to 8 Gbytes) of DDR3L memory onboard. With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.

Axiomtek q7m311

Advanced connectivity includes four PCIe x1 ports, two USB 2.0 ports, four USB 3.0 ports, one Gigabit Ethernet (built-in Intel Ethernet controller i211AT), two SATA-600 interfaces, and eight inputs/outputs of general purpose for peripheral devices and data transfer. Also, the LPC bus is available for easy connection of legacy I/O interfaces. This powerful Qseven embedded board runs well with Windows 10 and Linux operating system and supports Axiomtek AXView 2.0 intelligent remote management software.

Axiomtek | www.axiomtek.com

New Intel Core X-Series Processors and Thunderbolt 3

During the annual Computex 2017 event, Intel unveiled its new Intel Core X-series processor family with 4 to 18 cores, which now includes the new Intel Core i9 Extreme Edition processor, the first consumer desktop CPU with 18 cores and 36 threads. Intel announced plans to integrate Thunderbolt 3 into all future Intel CPUs and to release the Thunderbolt protocol specification to the industry.Intel i9 Web

With Intel focusing its attention on competing with ARM and now saying that they want to focus on something else than PC’s, the world of computing has been stalling and no significant gains on processor performance have been announced. The result was disastrous for Windows PC makers, which among other things also failed to evolve to newer standards on connectivity, like Thunderbolt 3 and USB-C. Apple was also affected, with almost three years without a single upgrade on its popular Mac Mini, iMac desktop and Mac Pro computers. The news from Intel that a new generation of processors is finally coming will bring some hope to the industry, including to many audio professionals that use computers and workstations, and need all the memory, storage and power they can get.

Intel introduced the new Intel Core X-series processor family, which they say is the most scalable, accessible and powerful desktop platform they have ever created. Good! The new Intel Core X-series processor family spans from 4 to 18 cores with price points to match, including Intel’s first teraflop desktop CPUs. The family also introduces the new Intel Core i9 processors, representing the highest performance for extreme performance and extreme mega-tasking. Good! The new Intel Core i9 Extreme Edition processor is the first consumer desktop CPU with 18 cores and 36 threads. An industry-first, its performance capabilities will finally enable data-intensive tasks like VR content creation and heavy data visualization.

Another announcement was the Intel Compute Card, a modular computing platform with all the elements of a full computer in a size just larger than a credit card. According to Intel, the Compute Card will start shipping in August 2017 and will allow devices outside of PCs to be connected, integrating compute into everything from smart screens to interactive appliances to VR headsets. Intel Partners who have products showing at Computex include Contec, ECS, Foxconn, LG Display, MoBits Electronics, NexDock, Sharp, Seneca, SMART Technologies, Suzhou Lehui Display and TabletKiosk. Other partners currently working on solutions include Dell, HP and Lenovo.

The Intel Compute Card will initially be available in four versions, with 7th Gen Intel Core i5 vPro or i3 processors, as well as Pentium N4200 and Celeron N3450 processors. All will feature 4-GB DDR3 memory, 128 GB of SSD or 64GB of eMMC storage, and all support Wi-Fi.11ac and Bluetooth 4.2. In addition, HTC announced a Compute Card-based VR device also using Intel WiGig technology.

Thunderbolt 3

On what is possibly the most interesting front for computing, outside of pure processing power, Intel announced plans to integrate Thunderbolt 3 into all future Intel CPUs and to release the Thunderbolt protocol specification to the industry.

Intel has a long history of leading the industry in I/O innovation. In the late 1990s, Intel developed USB, which made it easier and faster to connect external devices to computers, consolidating a multitude of existing connectors. Intel continued this effort with Thunderbolt 3, one of the most significant cable I/O updates since the advent of USB.

Intel’s vision for Thunderbolt was not just to make a faster computer port, but a simpler and more versatile port available to everyone, allowing for single-cable docks with 4K video support, unlimited and faster-than-ever storage, and external graphics accelerator engines. A world where one USB-C connector does it all – today, and for many years to come.

With this vision in mind, Intel now announced that it plans to drive large-scale mainstream adoption of Thunderbolt by integrating Thunderbolt 3 into future Intel CPUs and by releasing the Thunderbolt protocol specification to the industry next year, under a nonexclusive, royalty-free license. Releasing the Thunderbolt protocol specification in this manner is expected to greatly increase Thunderbolt adoption by encouraging third-party chip makers to build Thunderbolt-compatible chips.

Microsoft has also enhanced Thunderbolt 3 device plug-and-play support in the now available Windows 10 Creators Update. Intel and Microsoft plan to continue to work together to enhance the experience in future versions of the Windows operating system.

In addition to support from Apple and Microsoft, Thunderbolt 3 has already gained significant adoption with more than 120 PC designs on systems with 7th Generation Intel Core processors, the latest MacBook Pros and dozens of peripherals – expected to ramp to nearly 150 by the end of 2017.

Source: Intel

 

New Cyclone 10 FPGA Family

Intel recently launched the Intel Cyclone 10 family of FPGAs. Well suited for IoT applications, the new FPGAs are designed to deliver fast and power-efficient processing. They can collect and send data, and make real-time decisions based on the input from IoT devices. You can program the FPGAs  to deliver the specific level of computing and functions required by different IoT applications.Cyclone INTEL

Cyclone 10 GX supports 10G transceivers and hard floating point digital signal processing (DSP). Furthermore, it offers 2× the performance of the previous Cyclone generation. The architectural innovation in the implementation of IEEE 754 single-precision hardened floating-point DSP blocks can enable processing rates up to 134 giga floating-point operations per second (GFLOPs) for applications such as motion or motor control systems.

The Intel Cyclone 10 LP is the perfect solution for applications where cost and power are key factors in the design decision. These systems typically use FPGA densities that are sub 75K LE and chip-to-chip bridging functions between electronic components or I/O expansion for micro-processors. Cyclone 10 LP can also be used for automotive video processing used in rear-view cameras and in sensor fusion, where data gathered while the car is on the road is combined from multiple sensors in the car to provide a more complete view of what is happening.

The Cyclone 10 FPGA family will be available in the second half of 2017, along with evaluation kits, boards, and the latest version of Intel’s Quartus FPGA programming software.

Source: Intel

New Embedded Solution for Debugging FPGAs

Exostiv Labs recently announced that its EXOSTIV solution for Intel FPGAs will be available in December 2016. Providing up to 200,000 times more visibility on an FPGA than other solutions, EXOSTIV enables the debugging and verification of FPGA board prototypes at speed of operation. It provides extended visibility on internal nodes over long periods of time with minimal impact on the FPGA resources. Thus, you can discover issues related to complex interactions between numerous IPs when simulation is impracticable.

EXOSTIV for Intel FPGAs will be released in December 2016 with support for Arria 10 devices first. Pricing starts at $5,100.

Source: Exostiv Labs 

New Embedded Computing Solutions Designed with the Intel Atom x5-E8000 Processor

ADLINK Technology recently released four embedded computing solutions designed with the Intel Atom x5-E8000 processor. The newly-updated COM Express cExpress-BW, SMARC LEC-BW, Qseven Q7-BW modules, and the AmITX-BW-I thin Mini-ITX embedded board offer improved cost-performance ratios.

The latest Intel Atom SoC features 64-bit quad-core processing that is well suited for multitasking applications. The processor offers a configurable TDP (cTDP) of 5 W at 1.04 GHz, enabled by its 14-nm core transistors. With the new processor, ADLINK embedded boards and modules support up to 8 GB of dual-channel DDR3L 1600-MHz memory and up to three independent displays with Intel HD graphics.Adlink

The new COM modules and Mini-ITX board run graphics processing on a base frequency of 320 MHz with eDP/DP/HDMI interfaces for up to three display ports, which is an increase in the number of ports over previous COM Express modules. In addition to 4K resolution, Intel Gen9 Iris Graphics offer excellent 2D/3D hardware acceleration with decoding support for HEVC H.265, MPEG2, MVC, VC-1, WMV9, JPEG, and VP8, and encoding support for HEVC H.265 MVC, and JPEG. Graphics support also includes Open GL for graphics rendering, Intel Quick Sync Video for fast conversion to mobile format, and Intel clear Video HD Technology for better quality video.

ADLINK embedded boards and modules are equipped with ADLINK’s Smart Embedded Management Agent (SEMA), which provides detailed device-level system data including but not limited to temperature, voltage, and power consumption. With access to system activities, you can identify inefficiencies and malfunctions in real-time, thus preventing failures and minimizing downtime. ADLINK’s SEMA-equipped devices connect seamlessly to the SEMA Cloud for remote monitoring. Collected data, including sensor measurements and management commands, are accessible from anywhere at any time via an encrypted connection.

Source: ADLINK Technology

Innovative Tech at Embedded World 2016

Attendance at the recent Embedded World 2016 conference in Nuremberg, Germany, increased 17% (30,063 trade visitors) over 2015. Wisse Hettinga was in attendance and took notes on some of the more interesting technologies on display. He writes:

Controllino: Open-Source PLC

Say “ino” and most engineers and electronics enthusiasts will think, “Arduino.” That also goes for “Controllino,” which is a programmable logic controller (PLC) based on Arduino hardware and software. Marco Riedesser started developing this new product after he repaired a coffee machine with parts he designed. His Controllino is intended for the new generation of automation experts who grew up with the Arduino platform. The Controllino is 100% compatible with the Arduino platform and makes use of the SDK. And, perhaps most importantly, it is an open development system. For more information, visit https://controllino.biz/controllino

Hexiwear

NXP Semiconductors knows that innovative new technologies don’t appearing out of the blue, which is why it created the Hexiwear wearable development platform. Along with MikroElektronika, NXP is promoting this new piece of hardware to the design community via a Kickstarter campaign. hexiwear

Due to its compact design, you can use the Hexiwear as a watch or, if you need more functionality, you can click it onto the developer’s main board. The open-source Hexiwear’s features and specs include:

  • NXP Kinetis K64 MCU (ARM Cortex-M4, 120 MHz, 1M Flash, 256K SRAM)
  • BLE NXP Kinetis KW40Z multimode radio SoC (ARM Cortex-M0+, Bluetooth Low Energy & 802.15.4 Wireless MCU)
  • NXP FXOS8700CQ 3-D accelerometer and 3-D magnetometer
  • NXP FXAS21002 three-axis digital gyroscope
  • NXP MPL3115A2R1 absolute digital pressure sensor
  • NXP MC34671 600-mA, single-cell li-ion/li-polymer battery charger
  • TAOS TSL2561 light-to-digital converter
  • MEAS HTU21D digital humidity and temperature sensor
  • Maxim MAX3010x heart-rate sensor
  • Haptic feedback engine
  • 190-mAh 2C li-po battery
  • Capacitive touch interface
  • 1.1″ full color OLED display
  • RGB LED
  • 8 MB of additional flash memory

Intel Edison, What Did You Make?

When the Edison board was launched in 2014, it drew quite some attention from the community of makers. The board was heavy specified, wearable, and IoT ready. It allowed quick prototyping and the close connections with the Arduino world promised a smooth introduction into the world of designers and entrepreneurs with great ideas for the future. The module also came with seriously high price tag.edison

In the first months after the launch, there was a lot of interest. Some projects made it to the headlines, but things eventually quieted down around the platform. Was it the price, or was it the fact that the world of the x86 is different from the world of AVR or ARM? Or perhaps you need Linux knowledge to dig deeper into the system?

Embedded World 2016 in Nuremberg was a good opportunity to learn about the board’s status. According to Intel’s Ken Caviasca (VP in the IoT Group and GM of platform engineering and development), it is clear that Intel is still serious about addressing the makers community with the Edison module. A new board was announced on the Intel Developers Conference and the initiative is alive and well. Intel’s main objective for the Edison board is to get designers involved and to pick up new interest in the x86. Caviasca  confirmed that the Edison project is on target and many makers are using the platform for their designs. With a confident Intel about the future of  Edison, a big question remains: What will you make with it?

New COM Express Module Supports Intel 6th Generation Core i7/i5/i3 Processors

WIN Enterprises recently launched the MB-73430 COM Express module, which features Type 6 pin-outs and supports Intel’s 6th Generation Core i7/i5/i3 SoC processors. Intended for systems designed for future upgrades, the COM Express modules are well suited for medical, industrial automation, and gaming applications. The MB-73434 offers up to 32-GB dual-channel DDR4 memory. In addition, it enables a variety of voltage inputs for mobile, embedded, counter top, and desktop environments.WIN MB-73430

The MB-73434 delivers enhanced HD graphics. Featuring three DDI channels and a LVDS, it supports up to three independent displays and Intel Gen9 HD Graphics with HEVC (H.265). It can be used for high-density streaming applications and optimized 4K video conferencing with HEVC (8-bit), VP8, VP9, and VDENC encoding, decoding, and transcoding.

Source: WIN Enterprises

Qseven Module with Quad-core Pentium Processor with 4K Resolution

congatec AG recently announced an addition to its Qseven family. The conga-QA4 module includes the new Intel Pentium and Celeron processors based on 14-nm technology and offers increased energy savings and computing power. The optimized Intel Gen8 graphics, with up to 16 graphics execution units (EUs) and 4K (3,840 × 2,160 pixels) resolution, create a high-quality visual experience.conga-QA4_congatec

The module comes in three different processor versions (Intel Braswell) for high scalability. They range from the entry-level, dual-core Intel Celeron N3050 with 1.6/2.08 GHz to the quad-core Intel Pentium N3700 with 1.6/2.4 GHz, each with a power consumption of 4 W for standard applications (Scenario Design Power, SDP).

With the new conga-QA4 module, you can upgrade Qseven applications to the latest processor technology quickly and easily. The Qseven module comes with up to 8-GB, dual-channel DDR3L memory and up to 64-GB eMMC 5.0 for mass storage. The enhanced integrated Intel Gen8 graphics supports DirectX 11.1, OpenGL 4.2, and OpenCL 1.2. The new hardware-accelerated video decoding of H.265/HEVC requires a 50% lower data rate compared to H.264/AVC, so you can stream 4K videos in real time.

You can use the conga-QA4 module for a variety of retail, digital signage, and medical applications, or whenever you need high-performance graphics, outstanding computing power, and passive cooling. With native USB 3.0 support, the conga-QA4 module provides fast data transmission despite low power draw. Six USB 2.0 ports are available, one of which is executed as USB 3.0 SuperSpeed.

Three PCI Express 2.0 lanes and two SATA 3.0 ports with up to 6 Gb/s allow fast and flexible system extensions. The Intel I211 Gigabit Ethernet Controller offers the best software compatibility, while I2C bus, LPC bus for easy integration of legacy I/O interfaces, and Intel High Definition Audio with an 8-channel sound card round off the feature set.

Source: cognatec

Elektor Publishes the Ultimate Intel Edison Manual

Elektor’s latest publication on the Intel Edison is a must have for all those with an active interest in the Internet of Things. The book, Getting Started with the Intel Edison, focuses its attention on the Edison, a tiny computer, the size of a postage stamp, with a  lot of power and built-in wireless communication capabilities. In 128 pages, renowned author Bert van Dam helps readers get up to speed with the Edison by making it accessible and easy to use.  It is not a projects book, but a toolbox and guide that allows you to explore the wonderful world of the Intel Edison.

Source: Elektor

Source: Elektor

This book shows readers how to install the software on the Edison as well as on a Windows PC. The Edison Arduino breakout board is used because it is easy to work with. Linux, Arduino C++ and Python are also used and plenty of examples given as to how the Edison can interface with other software. Covering Wi-Fi and Bluetooth, the book also shows you a trick to program sketches over Wi-Fi. Once you have completed the book, not only will your Edison be up and running with the latest software version, but you will also have sufficient knowledge of both hardware and software to start making your own applications. You will even be able to program the Intel Edison over USB and wirelessly both in Arduino C++ and Python. This book is educational and interesting, and really helps to build your knowledge of all things Intel Edison.

Getting started with the Intel Edison is currently available for $35.

Source: Elektor

Windows-Compatible Dev Board

Intel, Microsoft, and Circuit Co. have teamed up to produce a development board designed for the production of software and drivers used on mobile devices such as phones, tablets and similar System on a Chip (SoC) platforms running Windows and Android operating systems with Intel processors.

Source: SharksCove.org

Source: SharksCove.org

The 6″ × 4″ Sharks Cove board and features a number of interfaces including GPIO, I2C, I2S, UART, SDIO, mini USB, USB, and MIPI for display and camera.

Its main features include:

  • Intel  ATOM Processor Z3735G , 2M Cache, 4 Core, 1.33 GHz up
    to 1.88 GHz
  • Intel HD Graphics
  • 1 GB 1×32 DDR3L-RS-1333, 16-GB EMMC storage, micro SD Card
  • HDMI full size connector, MIPI display connector
  • Twelve (5 × 2) Shrouded pin header connectors, 1 (2 × 10) sensor header, 2 × 60 pin MIPI connector for display, camera and 5 (2 × 2) headers for power
  • One USB 2.0 type A connector
  • One micro USB type A/B for debug
  • Audio Codec Realtek ALC5640, speaker output header and onboard digital mic
  • Ethernet or WiFi via USB
  • Intel UEFI BIOS
  • Power, volume up, volume down, home screen and rotation lock
  • One micro USB type A/B for Power
  • SPI debug programming header

You can preorder the board for $299. It includes a Windows 8.1 image together with all the necessary utilities for it to run on Sharks Cove.