New USB 3.0 UVC Class Bridge ICs

FTDI Chip recently introduced a new series of USB 3.0 UVC class bridge ICs. The FT602 devices support streaming of video from HD camera equipment. Imaging systems that once could only deliver low-resolution material can now have improved video quality while still running at 60-fps frame rates.FTDIPR74 FTDI

The FT602 devices’ characteristics, benefits, and specs:

  • Improved performance while viewing captured imaging data via standard UVC-enabled hardware and common media player platforms
  • Plug-and-play implementationl; custom drivers aren’t required
  • Complements FTDI’s FT600 and FT601 capable of providing both USB 3.0 SuperSpeed (5 Gbps) and USB 2.0 High Speed (480 Mbps) interfacing
  • Key applications: surveillance/security, machine vision, home/building automation, metrology, and real-time microscopy

Source: FTDI Chip

Dialog Semiconductor & Energous Announce Wireless Charging Partnership

Dialog Semicondcutor recently announced it will be the exclusive supplier of Energous Corp.’s WattUp RF-based wireless charging ICs. As part of the partnership, Dialog will make a $10 million investment in Energous and work to help drive broader adoption of wireless charging in products such as smartphones, IoT devices, wearables, and more.

The partnership combines Energous’s uncoupled wireless charging technology and Dialog’s power-saving technologies. WattUp technology uses Dialog’s SmartBond Bluetooth low energy solution as the out-of-band communications channel between the wireless transmitter and receiver. Dialog’s power management technology then distributes power from the WattUp receiver IC to the rest of the device. Dialog’s AC/DC Rapid Charge power conversion technology delivers power to the wireless transmitter.

Sources: Dialog Semiconductor and Energous

New IC for Real-Time Power Monitoring of Multiple Loads

Microchip Technology recently expanded its power-monitoring IC portfolio with the addition of the MCP39F511N, which provides standard power calculations and event monitoring of two electrical loads. It includes three ADCs for voltage and two current load measurements, a 16-bit calculation engine, EEPROM, and a flexible two-wire interface.Microchip MCP39F511N

An integrated low-drift voltage reference in addition to the 94.5 dB of SINAD performance on each current measurement channel enables the MCP39F511N to monitor two current loads with only 0.5% error across a wide 4000:1 dynamic range.  The ability to measure active, reactive and apparent power, active and reactive energy accumulation, RMS current and RMS voltage, line frequency, and power factor combined with advanced, integrated features enables you to reduce bill of materials and time to market.

The MCP39F511N is supported by Microchip Technology’s $200 MCP39F511N Power Monitor Demonstration Board (ADM00706). The MCP39F511N is available for sampling and volume production in a 28-lead, 5 × 5 mm QFN package. It costs $1.82 in 5,000-unit quantities.

Source: Microchip Technology

NXP Announces Single-Chip, 77-GHz Radar Transceiver

NXP Semiconductors recently announced the availability of small single-chip, 77-GHz radar transceiver (7.5 × 7.5 mm) with high resolution performance. Working prototypes of the RFCMOS IC are in the hands of NXP’s lead customers. In addition, Google engineers are field testing the ICs with the self-driving cars project.NXP Short Range Radar

The chip’s key characteristics, uses, and specs:

  • About the size of a postage stamp
  • You can integrate the chip “invisibly” practically anywhere in a car.
  • Power consumption is 40% lower than traditional radar ICs.
  • Intended for safety applications (e.g., emergency braking and automated parking)

 

Source: NXP Semiconductors www.nxp.com

Infineon Expands Its 200-V Driver IC Portfolio

Infineon Technologies AG has expanded its 200-V driver IC portfolio with the IRS2005(S, M) for high-voltage, high-speed IGBTs and power MOSFETs. The IC features comprehensive protection for motor drive space-constrained applications (e.g., golf carts and power tools).Infineon IOR_PDIO-8

The IRS200x family comprises high-side and low-side and H-bridge drivers utilizing Infineon’s high-voltage junction isolation (HVJI) technology to realize small packages while remaining tolerant to negative transient voltages. Built for  low-voltage (24 V, 36 V, and 48 V) and mid-voltage (60 V, 80 V, and 100 V) applications, the 200-V devices enable high system level efficiency and power density while providing the necessary robustness.

The IRS200x family consists of six devices with a typical sink current of 600 mA and source current of 290 mA. The 200-V devices are compatible with 3.3-, 5-, and 15-V logic components. Across the family, the driver ICs feature V CC Under Voltage Lock Out (UVLO) while the IRS2005 also includes V BS UVLO, further improving system reliability. The 200V driver ICs are intended for use with bootstrap power supplies, which eliminates the need for large auxiliary power supplies. In addition, the devices include integrated deadtime and shoot-through protection. They feature low quiescent currents. The IRS2004 also features a shutdown input pin.

The 200-V IRS200x driver ICs are offered in eight-pin SOIC, eight-pin DIP or 14-pin 4 × 4 mm MLPQ packages with various logic input options and standard pinout configurations. Production samples of the IRS200x devices are now available.

Source: Infineon Technologies

Time-of-Flight IC for Distance Measurement & Object Detection

Intersil Corp.’s low-power ISL29501 time-of-flight (ToF) signal processing IC is an object detection and distance measurement solution when combined with an external emitter (e.g., LED or laser) and photodiode. Intended for Internet of Things (IoT) applications and consumer mobile devices, the ISL29501 offers precision long-range accuracy up to 2 m in both light and dark ambient light conditions. You can select an emitter and photodiode and then configure a custom low-power ToF sensing system. intersil ISL29501

The ISL29501’s on-chip emitter DAC with programmable current up to 255 mA enables you to select the desired current level for driving the external infrared (IR) LED or laser. This feature enables optimization of distance measurement, object detection, and power budget. In addition, the ISL29501 can perform system calibration to accommodate performance variations of the external components across temperature and ambient light conditions.

The ISL29501’s main specs and features:

  • On-chip DSP calculates ToF for accurate proximity detection and distance measurement up to 2 m
  • Modulation frequency of 4.5 MH
  • On-chip emitter DAC with programmable current up to 255 mA a
  • On-chip active ambient light rejection
  • Programmable distance zones
  • Automatic gain control
  • 2.7 to 3.3 V Supply voltage range
  • I2C interface supports 1.8- and 3.3-V bus

The ISL29501 is available in a low profile 4 mm x 5 mm, 24-lead TQFN package for $4.87 USD in 1,000-piece quantities. The ISL29501-ST-EV1Z reference design board costs $250.

http://www.intersil.com/en

RF Direct Conversion Zero-IF, Near Zero-IF and Low-IF Receiver ICs

CML Microcircuits recently released the CMX994A and CMX994E Direct Conversion Receiver (DCRx) ICs. The CMX994A and CMX994E are RF receiver ICs—which feature I/Q demodulators with low-power consumption and high-performance features—are targeted at narrowband and wideband Software Defined Radios (SDR) for wireless data and two-way radio applications. Their design provides the optimum route for high integration, allowing a small RF receiver to be realised with a minimum of external components in zero-IF, near zero-IF and low-IF systems.

The CMX994A and the CMX994E ICs build on the success of the popular CMX994 and are the first devices to use CML’s PowerTrade technology. PowerTrade enables the devices to dynamically balance power consumption and performance characteristics to suit varying operating requirements. Very low power consumption can also be achieved in standby mode whilst looking for an RF signal, using intelligent control of power cycling, phase control and I/Q channel selection.

The CMX994A delivers a very low power DCRx device while the CMX994E also includes the low power mode of the CMX994A but in addition, offers a high performance mode with improved IP3 performance.

The CMX994, CMX994A and CMX994E DCRx ICs offer excellent RF performance, exceptional IP2 from I/Q mixers and are suitable for modulation schemes including: QAM, 4FSK, GMSK and pi/4-DQPSK. Key features of the device include on-chip VCO for VHF applications, on-chip LNA, precision baseband filtering with selectable bandwidths and the smallest PCB area, typically less than 50% of a dual superhet.

The CMX994A and CMX994E are available, operating at 3 to 3.6 V, and come in a Q4 40-pin VQFN package.

Source: CML Microcircuits

New 700-V HVICs Increases System Reliability, Shrink Board Space

Infineon Technologies recently launched a family of rugged, reliable 700-V High-Voltage ICs (HVICs) optimized for solar, power supply, uninterruptible power supplies (UPS), welding, and industrial drive applications. The 700-V offering enables designers of high-voltage power stages to simplify their designs while making them more robust.Infineon-700V-HVIC

The new IR7xxxS series of HVICs feature sink/source ratings from 60 to 2,300 mA and utilize PN junction technology. Available in half bridge and high- and low-side configurations, the new HVICs are optimized for 700-V MOSFETs and 650-V IGBTs and offer full driver capability with extremely fast switching speeds to reduce magnetics component count.

Other key features of the new devices include under-voltage lock-out protection for both channels, lower di/dt gate driver for better noise immunity. In addition, the HVICs are tolerant to negative transient voltage dv/dt, offer matched propagation delay for both channels and are 3.3- and 15-V input logic compatible.

The new IR7xxxS series is available in surface-mount (8-SOIC) packages in high volume. The lead-free devices are RoHS-compliant.

Source: Infineon

Power Monitoring IC for High-Accuracy Power Measurement

Microchip Technology recently expanded its power-monitoring IC portfolio with the addition of the MCP39F511. The highly integrated and accurate single-phase power-monitoring IC is designed for the real-time measurement of AC power. It combines the most popular power calculations with unique advanced features, making it well suited for use in high-performance commercial and industrial products (e.g., lighting systems, smart plugs, power meters, and AC/DC power supplies).

Source: Microchip Technology

Source: Microchip Technology

To address industry requirements for better accuracy across current loads, additional power calculations, and event monitoring of various power conditions, the MCP39F511 power-monitoring IC provides all of the popular standard power calculations combined with advanced features. The import and export of active energy accumulation, four-quadrant reactive energy accumulation, zero-crossing detection and dedicated PWM output have now been integrated on-chip, along with the ability to measure active, reactive and apparent power, RMS current and RMS voltage, line frequency, and power factor.

Allowing for more accurate power measurements, which is critical to higher-performance designs, this new device is capable of just 0.1 % error across a wide 4000:1 dynamic range. Additionally, its 512 bytes of EEPROM allow operating-condition storage. The MCP39F511 also includes two 24-bit delta-sigma ADCs with 94.5 dB of SINAD performance, a 16-bit calculation engine, and a flexible two-wire interface. A low-drift voltage reference, in addition to an internal oscillator, is integrated to reduce implementation costs. This unique combination of features and performance allows designers to add highly accurate power-monitoring functions to their end applications with minimal firmware development, speeding development time.

The MCP39F511 is supported by Microchip’s MCP39F511 Power Monitor Demonstration Board (ADM00667), which costs $150. The MCP39F511 is available now for sampling and volume production, in a 28-lead, 5 × 5 mm QFN package. It costs $1.82 each in 5,000-unit quantities.

Source: Microcchip Technology

Energy-Friendly IC and Evaluation Kit for iOS Accessory Development

Silicon Labs now offers a digital audio bridge chip and evaluation kit designed to simplify the development of accessories for iOS devices. Target applications include audio accessories such as guitar and microphone recording dongles, audio docks, and headphones. The CP2614 IC also provides built-in support for communication between iOS applications and accessory hardware, enabling a broad array of Internet of Things (IoT) accessories that operate with a companion iOS app.Silicon Labs CP2614

The CP2614 bridge chip and MFI-SL-CP2614-EK evaluation kit provide a cost-effective, comprehensive development platform for iOS accessory developers, enabling fast time to market through fixed-function MFi support. The CP2614 solution requires no firmware development, which helps developers get up and running quickly with their MFi accessory designs. Developers simply select their customization options with an easy-to-use GUI-based configuration tool.

The CP2614 bridge chip carefully manages and minimizes power consumption, achieving ultra-low power in both active and idle modes. The CP2614 IC’s energy efficiency makes it good choice for device-powered accessories. In addition, the CP2614 includes an integrated 5-V low drop-out (LDO) regulator, which reduces BOM cost and footprint for self-powered accessories. The CP2614 device operates without an external crystal or EEPROM, storing all configuration options on chip. The crystal-less architecture and integrated EEPROM further reduce BOM cost as well as PCB space, enabling developers to design smaller, more streamlined and cost-effective accessories.

 

The CP2614 audio bridge chip supports 24-bit unidirectional and 16-bit bidirectional digital audio streaming, enabling developers to create high-quality, high-performance “prosumer”-class audio accessories. The CP2614 can establish a communications channel with an iOS application, enabling the app to interact directly with the accessory hardware through general-purpose input/output (GPIO) read/writes and access to the UART for custom data flow. The GPIO can be configured for button input and LED output and accessed remotely from an iOS app or used to control audio playback.

 

The CP2614 audio bridge IC and MFI-SL-CP2614-EK evaluation kit are in full production and available to MFi licensees today. Available in a 5 mm x 5 mm QFN32 package, the CP2614 IC is priced at $2.51 (USD) in 10,000-unit quantities. The MFI-SL-CP2614-EK is priced at $59 (USD MSRP). MFi licensees can order the evaluation kit through the Apple MFi Procurement Portal.

Source: Silicon Labs

27-GHz Bandwidth Socket for Xilinx FLGA2577 BGA Package

Ironwood Electronics recently introduced a new high-performance BGA socket for 1-mm pitch, 2577 pin BGA ICs. The SG-BGA-6422 socket is designed for IC size 52.5 × 52.5 mm and operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. The contact resistance is typically 20 mΩ per pin. The socket connects all pins with 27-GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering and uses industry’s smallest footprint. The socket is constructed with shoulder screw and swivel lid which incorporates a quick insertion method so that ICs can be changed out quickly. The socket comes with ball guide for the precise alignment of BGA balls to PCB pads.Ironwood C14363b

The SG-BGA-6422 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is –35°C to 100°C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 A per pin. It works with ICs such as Xilinx BGA, 52.5-mm square package with 51 × 51 array and 1-mm pitch.

The SG-BGA-6422 is $1805, with reduced pricing available depending on the quantity required.

Source: Ironwood Electronics

H.264 Video I/O Companion Integrated Circuits

Microchip Technology has announced the availability of the OS85621 and OS85623, which are the world’s first H.264 video I/O companion integrated circuits (ICs) optimized for the Media Oriented Systems Transport (MOST) high-speed automotive infotainment and Advanced Driver Assistance Systems (ADAS) network technology. Microchip OS85621

Featuring a low-latency, high-quality H.264 codec and an on-chip Digital Transmission Content Protection (DTCP) coprocessor, the OS85621 enables automotive designers to quickly implement content-protected video transmission solutions. You can now transmit video streams with restricted access from devices (e.g., DIDs, digital media drives, and TV tuners) as encrypted H.264 over a MOST network.

The OS85621’s on-chip DTCP coprocessor accelerates the computation-intensive operations required for DTCP authentication and content protection. You can simultaneously route up to eight independent data streams through the DTCP coprocessor’s cipher engine for M6 or AES-128 encryption/decryption.

The ultra-low-latency mode of the H.264 codec enables single-digit millisecond latency from video input to video output, including encoding, transmission over a MOST network, and decoding. This real-time, high-speed video processing makes the OS85623—which has no DTCP coprocessor—an excellent option for camera-based ADAS applications that are designed to enhance vehicle safety.

The OS85621 and OS85623 H.264 video I/O companion ICs are now available in a BGA 196 package. Volume pricing starts at $8.

Source: Microchip Technology

Radiation-Hardened QDR-II+ SRAMs Achieve QML Class V Certification

Cypress Semiconductor Corp. recently announced its radiation-hardened (RadHard) 72-Mb Quad Data Rate II+ (QDR-II+) SRAMs and 4-Mb fast asynchronous SRAMs have achieved Qualified Manufacturers List Class V and Class Q requirements—the highest standards of quality and reliability for aerospace-grade ICs.CypressSRAM

The 72-Mbit QDR-II+ SRAMs deliver industry-leading throughput performance up to 36 Gbps by leveraging the ability to read and write data simultaneously. This throughput, combined with complete random access of data and free memory controllers for FPGAs, enables reconfigurable computing platforms that allow satellites to be reprogrammed while in space. The devices also feature the industry’s lowest latency and are ideal for radar and networking applications used in space

Both new SRAM families employ Cypress’s patented RadStop technology, which enables uncompromised functionality in the face of radiation up to 300 krads. The devices are manufactured in the Cypress’s fabrication facility in Bloomington, Minnesota, which is Microelectronics Trusted Category 1A accredited.

The radiation-hardened 4-Mbit devices deliver access times of 10 ns at 85°C and 12 ns at 125°C. They are also the first 90-nm, QML-V qualified devices of their kind and are ideal for a wide range of space and military applications.

Cypress’s RadStop technology combines manufacturing process hardening and proprietary design techniques. With RadStop technology, the SRAMs deliver single event latch-up immunity and single event functional interrupt immunity at temperatures as high as 125°C.

The Rad-Hard 72-Mb QDR-II+ SRAMs are available in a 165-column grid array (CGA) package. The devices come in the following four part numbers and configurations with equivalent Defense Supply Center Columbus (DSCC) part numbers:

  • CYRS1542AV18-250GCMB (x18 bus width, burst of 2); Class V part number: 5962F1120101VXA
  • CYRS1543AV18-250GCMB (x18 bus width, burst of 4); Class V part number: 5962F1120102VXA
  • CYRS1544AV18-250GCMB (x36 bus width, burst of 2); Class V part number: 5962F1120201VXA
  • CYRS1545AV18-250GCMB  (x36 bus width, burst of 4); Class V part number: 5962F1120202VXA

The CYRS1049DV33-12FZMB (5962F1123501VXA) 4-Mb fast asynchronous SRAMs are available in a 36-pin ceramic flat package.

Source: Cypress Semiconductor

GestIC Controller Enables One-step Design-in of 3-D Gesture Recognition

Microchip Technology recently announced a new addition to its patented GestIC family. The new MGC3030 3-D gesture controller features simplified user-interface options focused on gesture detection, enabling true one-step design-in of 3-D gesture recognition in consumer and embedded devices. Housed in an easy-to-manufacture SSOP28 package, the MGC3030 expands the use of 3-D gesture control features to high-volume, cost-sensitive applications such as audio, lighting, and toys.GestIC

The simplicity of gesture-detection integration offered by the MGC3030 is also achieved through Microchip’s free, downloadable AUREA graphical user interface (GUI) and easily configurable general-purpose IO ports that even allow for host MCU/processor-free usage. The MGC3030’s on-chip 32-bit digital signal processor executes real-time gesture processing, which eliminates the need for external cameras or controllers for host processing and allows for faster and more natural user interaction with devices.

The MGC3030 makes full use of the GestIC family development tools, such as Microchip’s Colibri Gesture Suite, which is an on-chip software library of gesture features. Intuitive and natural movements of the human hand are recognized, making the operation of a device functional, intuitive, and fun. Without the need to touch the device, features such as Flick Gestures, the Air Wheel, or the proximity detection perform commands such as changing audio tracks, adjusting volume control or backlighting, and many others. All gestures are processed on-chip, allowing manufacturers to realize powerful user interfaces with very low development effort.

Unique to GestIC technology, the programmable Auto Wake-Up On Approach feature begins operating in the range of 100-µW power consumption, enabling always-on gesture sensing in power-constrained applications. If real user interaction is detected, the system automatically switches into full sensing mode and alternates back to auto wake-up mode once the user leaves the sensing area. These combined features and capabilities provide designers with the ability to quickly integrate gesture detection features at price points that are ideal for high-volume devices.

Also available is Microchip’s Woodstar MGC3030 Development Kit (DM160226). The $139 kit is available via any Microchip sales representative, authorized worldwide distributor, or microchipDIRECT (www.microchip.com/Dev-Kit-012015a). The kit comes with the AUREA GUI, the central tool to parameterize the MGC3030 and the Colibri Suite to suit the needs of any design. AUREA is available via a free download at www.microchip.com/AUREA-GUI-012015a. The Colibri Gesture Suite is an extensive library of proven and natural 3-D gestures for hands and fingers that is preprogrammed into the MGC3030.

The MGC3030 featuring GestIC technology is available in a 28-pin SSOP package. Each unit costs under $2 each in high volumes.

Source: Microchip Technology

12-W Receiver IC for Wireless Mobile Device Charging

At CES 2015, Toshiba America Electronic Components introduced its newest IC enabling wireless mobile device charging. The TC7765WBG wireless power receiver controller IC can manage the 12-W power transfer required for the wireless charging of tablet devices. The TC7765WBG is compatible with the Qi low-power specification version 1.1 defined by the Wireless Power Consortium (WPC). It delivers a user experience comparable to that of conventional wired charging for tablets, as well as smartphones and other portable devices.Toshiba TC7765WBG

The TC7765WBG was built with Toshiba’s mixed-signal process using a high-performance MOSFET design that maximizes power efficiency and thermal performance. The IC combines modulation and control circuitry with a rectifier power pickup, I2C interface, and circuit protection functions. Compliance with the “Foreign Object Detection” (FOD) aspect of the Qi specification prevents heating of any metal objects in the path of wireless power transfer between the receiver and the transmitter.

The 12-W TC7765WBG is designed in a compact WCSP-28 2.4 mm × 3.67 mm × 0.5 mm package. This further facilitates design-in and contributes to the new chipset’s backward compatibility with the lower-power receiver IC. Combining the TC7765WBG with a copper coil, charging IC, and peripheral components creates a wireless power receiver. Joining the receiver with a Qi-compliant wireless power transmitter containing a Toshiba wireless power transmitter IC (e.g., TB6865AFG Enhanced version) forms a complete wireless power charging solution.

Toshiba announced that samples of the TC7765WBG wireless power receiver IC will be available at the end of January, with mass production set to begin in Q2 2015.