Texas Instruments recently announced the availability of 600-V gallium nitride (GaN) 70-mΩ field-effect transistor (FET) power-stage engineering samples. The 12-A LMG3410 power stage coupled with TI’s analog and digital power-conversion controllers enables you to create smaller, higher-performing designs compared to silicon FET-based solutions. These benefits are especially important in isolated high-voltage industrial, telecom, enterprise computing, and renewable energy applications.
The LMG3410’s features and specifications:
Integrated driver and zero reverse-recovery current
Integrates built-in intelligence for temperature, current, and undervoltage lockout (UVLO) fault protection
Includes GaN FETs
Double the power density
Reduced packaging parasitic inductance
Enables new topologies
To support designers who are taking advantage of GaN technology in their power designs, TI also launched new products to expand its GaN ecosystem. The LMG5200POLEVM-10, a 48-V to 1-V point-of-load (POL) evaluation module, will include the new TPS53632G GaN FET controller, paired with the 80-V LMG5200 GaN FET power stage. The solution allows for efficiency as high as 92% in industrial, telecom, and datacom applications.
TI will offer a development kit that includes a half-bridge daughtercard and four LMG3410 IC samples. A second kit will include a system-level evaluation motherboard. When used together, the two kits enable immediate bench testing and design. The two development kits are available for $299 and $199, respectively.
Infineon Technologies recently introduced its first devices in a family of Gallium Nitride (GaN) on Silicon Carbide (SiC) RF power transistors. The devices enable mobile base station manufacturers to build smaller, more powerful and more flexible transmitters. With higher efficiency, improved power density, and more bandwidth than currently used RF power transistors, the new devices improve the economics of building infrastructure to support today’s cellular networks. Additionally, they will enable the transition to 5G technology with higher data volumes and enhanced user-experience.
The new RF power transistors leverage the performance of GaN technology to achieve ten percent higher efficiency and five times the power density of the LDMOS transistors commonly used today. This translates to smaller footprints and power requirements for the power amplifiers (PA) of base station transmitters in use today, which operate in either the 1.8-2.2 GHz or 2.3-2.7 GHz frequency range. Future GaN on SiC devices will also support 5G cellular bandsup to the 6 GHz frequency range. This roadmap allows Infineon to build on its long-standing expertise and state-of-the-art production technologies for RF transistor technology.
Design flexibility and support for the next-generation of 4G technology are additional benefits of GaN devices for RF power applications. The new devices have twice the RF bandwidth of LDMOS, so that one PA can support multiple operating frequencies. They also have increased instantaneous bandwidth available for transmitters, which lets a carrier offer higher dates using the data aggregation technique specified for 4.5G cellular networks.
The TPH3002LD and the TPH3002LS are 600-V Gallium nitride (GaN)-based, low-profile power quad flat no-lead (PQFN) high electron mobility transistors (HEMTs). The HEMTs utilize Transphorm’s patented, high-performance EZ-GaNTM technology, which combines low switching and conduction losses, reducing the overall system energy dissipation up to 50%.
The TPH3002PD and TPH3002PS HEMTs are designed for use in smaller, lower-power applications (e.g., adapters and all-in-one computer power supplies). The HEMTs feature a Kelvin connection to isolate the gate circuit from the high-current output circuit to further reduce electromagnetic interference (EMI) and high-frequency switching capabilities.
Evaluation boards are available with the devices.