Intel & Micron Expand Manufacturing Effort

Intel and Micron have announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

Intel-Optane-SSD-900P-Series

The Intel Optane SSD 900P Series half-height half-length add-in card is available in 480 GB and 280 GB capacities.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.

Intel recently announced the Intel Optane SSD 900P Series for use in desktop and workstation PCs. It delivers incredibly low latency and best-in-class random read and write performance at low queue depths. Additionally, Intel expanded the Intel Optane technology offerings for the data center, introducing 750GB capacity and 2.5-inch U.2 form factor versions of the Intel Optane SSD DC P4800X Series. For details on these products and all Intel SSDs, visit Intel’s solid state drives website.

Intel | www.intel.com

Micron Technology | www.micron.com

MCU Delivers Enhanced Security for Connected Devices

Renesas Electronics has announced the expansion of its RX65N/RX651 Group microcontroller lineup that addresses advanced security needs for connected devices operating in industrial automation, building automation, and smart metering systems. The expanded lineup features MCUs with integrated Trusted Secure IP, and enhanced, trusted flash functionality and human-machine interface (HMI) for industrial and network control systems.

2017113-rx65n-rx651-securityThe expansion of devices operating at the edge of the Industrial Internet of Things (IIoT) has increased system manufacturers’ need for secure network connectivity and reliability, including secure on-the-go firmware updates. The expanded RX65N/RX651 devices support these evolving security and reprogrammability needs, offering integrated Trusted Secure IP, enhanced flash protection, and other technology advancements to create a secure and stable integrated solution far above others in the market, as proven by the Cryptographic Algorithm Validation (CAVP) certification. In turn, these security advancements enable seamless flash firmware updates in the field through secure network communications.

The new MCUs expanded with enhanced security features are based on the high-performance RXv2 core and a 40nm process, which provide strong power efficiency for CPU operation at 4.55 Core Mark/MHz. Integrating the Trusted Secure IP into the new MCUs enables system control engineers to realize high root-of-trust levels for device operation through a combination of three new features:

  •    Protect encryption key by Trusted Secure IP
  •    Integration of encryption hardware accelerators including AES, 3DES, SHA, and      TRNG as part of Trusted Secure IP
  •    Protect boot code by area of Flash

The Trusted Secure IP received the CAVP certification, which ensures the customer will use a device with a high security level.

Renesas has optimized the new RX65N/RX651 MCUs for connected industrial environments. The new MCUs offer network connectivity and HMI support that makes it possible to:

  •     Monitor the operating state of machinery from both inside and outside the factory
  •     Exchange data for making changes to production instructions
  •     Reprogram the MCU’s memory to update equipment settings

Design engineers are often asked to integrate small thin-film-transistor (TFT) displays into their IoT edge devices or system control applications. These displays allow users to monitor machine behavior through a modern low-cost HMI solution. The RX65N/RX651 is an ideal solution for controlling these displays as it features an embedded TFT controller and an integrated 2D graphic accelerator to provide advanced graphics features and high-performance applications. Selecting a WQVGA display size allows the large 640 KB of on-chip RAM to be used as display frame buffer, which saves external RAM, ensuring a cost-optimized design.

Compared with other IoT devices, industrial applications are designed for long-term operation, which involves unique and sometimes challenging requirements, such as firmware updates in the field. The new RX65N/RX651 MCUs feature dual bank flash integration supporting both BGO (Back Ground Operation) and the SWAP function, making it easier for system and network control manufacturers to execute in-the-field firmware updates securely and reliably.

Firmware Integration Technology (FIT) is a holistic concept that emphasizes the embedded peripheral function module drivers and portability improvement between the RX65N/RX651 MCUs. The technology aims to lighten the burden of program development and resource management in software development using the entire family of RX MCUs. FIT provides a common application program interface for peripheral drivers and middleware for RX family, based on a solid Board Support Package, which controls the common information for these functions like initial MCU, clock, and board settings. FIT is available for all RX devices and fully integrated into the development environment.

Renesas has expanded its robust RX tool infrastructure to help engineers jump start their development work. The new Envision Kit provides an evaluation environment that allows engineers to easily benchmark MCU performance and start developing their own software. The new RX65N Renesas Starter Kit (RSK) includes a development board with MCU, display, on-chip debugger, trial Renesas C compiler and Integrated Development Environment (IDE), enabling engineers to get their evaluations and development up and running within a matter of minutes. To jumpstart their display designs, RX users can also leverage several ecosystem partner tools, including easy-to-use graphic GUI tools.

The expanded RX65N/RX651 MCUs, Renesas RX65N Starter Kit, and Envision Kit are available now

.Renesas Electronics | www.renesas.com

Xilinx Provides Design Platform for Scalable Storage

At the Flash Memory Summit earlier this month in Santa Clara, CA, leading FPGA vendor Xilinx rolled out the Xilinx NVMe-over-Fabrics reference design. It provides designers a flexible platform to enable scalable storage solutions and integrate custom acceleration functions into their storage arrays. The reference design eliminates the need for a dedicated x86 processor or an external NIC, thus creating a highly integrated, reliable and cost-effective solution. The NVMe-over-Fabrics (NVM-oF) reference platform is implemented on the Fidus Sidewinder card which supports up to 4 NVMe SSDs, and has a Xilinx ZU19EG Ultrascale+ MPSoC device. The reference platform is delivered with the required software drivers.

The Xilinx NVMe-over-Fabric Platform is a single-chip storage solution that integrates NVMe-over-Fabric and target RDMA offloads with a processing subsystem to provide a very power-efficient and low-latency solution compared to existing products that require both an external host chip and a Network Interface Card (NIC). This 2x100Gb Ethernet platform enables customers to implement value-added storage workload acceleration, such as compression and erasure code.

Xilinx | www.xilinx.com

Cypress MCUs Selected for Toyota Camry Instrument Cluster

Cypress Semiconductor has announced that global automotive supplier DENSO has selected Cypress’ Traveo automotive microcontroller (MCU) family and FL-S Serial NOR Flash memory family to drive the advanced graphics in its instrument cluster for the 2017 Toyota Camry. The DENSO instrument cluster uses Traveo devices that Cypress says were the industry’s first 3D-capable ARM Cortex-R5 cluster MCUs.

Denso Instrument Cluster

The FL-S memory in the cluster is based on Cypress’ proprietary MirrorBit NOR Flash process technology, which enables high density serial NOR Flash memory by storing two bits per cell. The DENSO instrument cluster has 4.2- and 7.0-inch screens capable of audio, video and navigation in the center display of the 2017 Toyota Camry.

Cypress works with the world’s top automotive companies to support automotive systems including Advanced Driver Assistance Systems (ADAS), 3-D graphics displays, wireless connectivity, full-featured touchscreens and superior body electronics. Cypress’ automotive portfolio includes the Traveo MCU family, power-management ICs (PMICs), PSoC programmable system-on-chip solutions, CapSense capacitive-sensing solutions, TrueTouch touchscreens, NOR flash, F-RAM and SRAM memories, and USB, Wi-Fi and Bluetooth connectivity solutions. The portfolio is backed by Cypress’ commitment to zero defects, excellent service and adherence to the most stringent industry standards, such as the ISO/TS 16949 quality management system, the Automotive Electronics Council (AEC) guidelines for ICs and the Production Part Approval Process (PPAP).

Cypress Semiconductor | www.cypress.com

New SLC NAND Flash Memory Family for High-Security Apps

Cypress Semiconductor Corp. recently announced a high-endurance, 1-to-4-Gb Single-Level Cell (SLC) SecureNAND family that reduces system costs and improves system security. It does this by providing a single nonvolatile memory with integrated block protection features for a variety of high-security applications, such as point-of-sale systems and wearables.Cypress SecureNAND

The SecureNAND family includes 1-Gb S34SL01G2, 2-Gb S34SL02G2, and 4-Gb S34SL04G2 devices. You can configure each device with nonvolatile block protection to store protected boot code, system firmware, and applications. They provide 100,000 program/erase cycles to ensure more than five years of system life. Their operating voltage range is 2.7  to 3.6 V and they support the industrial temperature range of –40° to 85°C.

The currently sampling 1-Gb S34SL01G2, 2-Gb S34SL02G2, and 4-Gb S34SL04G2 SecureNAND devices are available in a 63-BGA package.

Source: Cypress Semiconductor

Dynamic Efficiency Microcontrollers

STMicroThe STM32F401 Dynamic Efficiency microcontrollers extend battery life and support innovative new features in mobile phones, tablets, and smart watches. They help manage MEMS sensors in smart-connected devices and are well suited for Internet-of-Things (IoT) applications and fieldbus-powered industrial equipment.

The STM32F401 microcontrollers include an ART accelerator, a prefetch queue, and a branch cache. This enables zero-wait-state execution from flash, which boosts performance to 105 DMIPS (285 CoreMark) at 84 MHz. The microcontrollers’ 90-nm process technology boosts performance and reduces dynamic power. Its dynamic voltage scaling optimizes the operating voltage to meet performance demands and minimize leakage.

The STM32F401 microcontrollers integrate up to 512 KB of flash and 96 KB SRAM in a 3.06-mm × 3.06-mm chip-scale package and feature a 9-µA at 1.8 V Stop mode current. The devices’ peripherals include three 1-Mbps I2C ports, three USARTs, four SPI ports, two full-duplex I2S audio interfaces, a USB 2.0 OTG full-speed interface, an SDIO interface, 12-bit 2.4-MSPS 16-channel ADC, and up to 10 timers.

Pricing for the STM32F401 microcontrollers starts at $2.88 in 10,000-unit quantities.

STMicroelectronics
www.st.com

TRACE32 Now Supports Xilinx MicroBlaze 8.50.C

LauterbachThe TRACE32 modular hardware and software supports up to 350 different CPUs. The microprocessor development tools now support the latest version of Xilinx’s MicroBlaze 8.50.c, which is a soft processor core designed for Xilinx FPGAs. The MicroBlaze core is included with Xilinx’s Vivado Design Edition and IDS Embedded Edition.

The TRACE32 tools have supported MicroBlaze for many years by providing efficient and user-friendly debugging at the C or C++ level using the on-chip JTAG interface. This interface also provides code download, flash programming, and quick access to all internal chip peripherals and registers.
Contact Lauterbach for pricing.

Lauterbach GmbH
www.lauterbach.com

Xilinx, Inc.
www.xilinx.com