Automotive Echo Cancellation Available for NXP Processors

NXP Semiconductors has announced a new echo cancellation noise reduction solution (ECNR) that significantly reduces the problem of noisy voice communications and provides carmakers with a consumer pleasing, hands-free calling experience. The cost-effective solution combines innovative ECNR software that can be easily ported onto NXP i.MX processors and NXP’s leading car radio tuners and DSPs. The new NXP ECNR solution is also ITU-T P1110 and CarPlay pre-certified.
Echo and noise can make communication on the road difficult. Echo occurs when the speakers within a car transmit a voice signal from an incoming call, which subsequently ricochets through the vehicle and returns to the microphone. This causes the caller to hear their own voice, which is distracting and can result in broken communications. Additionally, road noise from fans, exhaust, tires, windows and passengers can infiltrate calls and render them unintelligible, ultimately disrupting the driving experience and causing frustration.

The new NXP ECNR solution deals with both problems by removing echoes and filtering out unwanted noise from the cockpit to enhance the sound quality of conversations. Since the ECNR solution can be ported to NXP chipsets and is ITU-T P1110 and CarPlay pre-certified, it can reduce carmakers’ R&D expenses and speed up the design cycle.

NXPs SAF775x integrates up to 2 AM/FM tuners, radio processing, an automotive audio hub and an open HiFi2 core for advanced audio algorithms. SAF775x has rich analog and digital interfaces, flexible audio mixer and filter structure, and core audio processing algorithms. The SAF775x family radio-audio one chip is a market-proven solution and has been successfully designed in major automotive OEM platforms.

i.MX applications processors offer a feature and performance-scalable multicore platform that includes single, dual and quad-core families based on the Arm® v7-A and Arm v8 architecture based solutions with powerful processing for neural networks, advanced graphics, machine vision, video, audio, voice and safety-critical requirements.

The ECNR algorithm is running on the HiFi2 core of SAF775x, ready be activated by a key code.

NXP Semiconductors | www.nxp.com

30 A Encapsulated Digital Power Modules

Renesas Electronics has announced two new fully encapsulated digital DC/DC PMBus power modules that board high power density and efficiency. The dual ISL8274M operates from a 5 V or 12 V power rail, provides two 30 A outputs and up to 95.5% peak efficiency in a compact 18 mm x 23 mm2 footprint. The new ZL9024M operates from a 3.3V rail and outputs 33 A of power in a 17 mm x19 mm2 footprint. They deliver point-of-load (POL) conversions for advanced FPGAs, DSPs, ASICs and memory used in servers, telecom, datacom, optical networking and storage equipment. Both devices are easy-to-use, PMBus-configurable power supplies that include a controller, MOSFETs, inductor and passives encapsulated inside a module that increases available board space and reduces bill of materials (BOM).

The ISL8274M and ZL9024M digital power modules leverage Renesas’ patented ChargeMode control architecture, which provides the highest efficiencies with better than 90% on most conversions. The power modules also provide a single clock cycle fast transient response to output current load steps common in FPGAs and DSPs that process power bursts. Their compensation-free design keeps the modules stable regardless of output capacitor changes due to temperature, variation or aging. Eliminating the need for an external discrete compensation network also saves board space and additional BOM cost. The ISL8274M supports input voltages from 4.5 V to 1 4V, while the ZL9024M accepts input voltages from 2.75 V to 4 V. Both modules offer adjustable output voltages as low as 0.6 V.

The encapsulated modules use Renesas’ proprietary High Density Array (HDA) package, which offers unmatched electrical and thermal performance through a single-layer conductive substrate that reduces lead inductance and dissipates heat primarily through the system board. The HDA’s copper lead-frame structure allows the modules to operate at full load over a wide temperature range with no airflow or heatsinks. The ISL8274M and ZL9024M also provide several protection features that ensure safe operations under abnormal operating conditions, further enhancing their robustness and reliability.

Key Features of the ISL8274M Digital Power Module include:

  • 30 A dual digital switch mode power supply with input voltage range from 4.5 V to 14 V and programmable Vout from 0.6 V to 5 V
  • PMBus-enabled solution for full system configuration, telemetry and monitoring of all conversions and operating parameters
  • Programmable Vout, soft-start, soft-stop, sequencing, margining and under-voltage, over-voltage, under-current, over-current, under temperature and over-temperature
  • Monitors Vin, Vout, Iout, temperature, duty cycle, switching frequency, and faults
  • Power good indicator, and ±1.2% Vout accuracy over line, load, and temperature
  • Pin-strap mode using external resistors for standard settings
  • Internal nonvolatile memory saves module configuration parameters and fault logging

Key Features of the ZL9024M Digital Power Module include:

  • 33 A digital switch mode power supply with input voltage range from 2.75 V to 4 V and programmable Vout from 0.6 V to 1.5 V
  • PMBus-enabled solution for full system configuration, telemetry and monitoring of all conversions and operating parameters
  • Programmable Vout, soft-start, soft-stop, sequencing, margining and under-voltage, over-voltage, under-current, over-current, under temperature and over-temperature
  • Monitors Vin, Vout, Iout, temperature, duty cycle, switching frequency and faults
  • Power good indicator, and ±1.2% Vout accuracy over line, load, and temperature
  • Pin-strap mode using external resistors for standard settings
  • Internal nonvolatile memory saves module configuration parameters and fault logging

 

The ISL8274M is available now in a thermally enhanced 18 mm x 23 mm x 7.5 mm HDA package, and is priced at $39 (1,000). An ISL8274MEVAL1Z evaluation board is available for $150.

The ZL9024M is available now in a thermally enhanced 17 mm x 19 mm x 3.5 mm HDA package, and is priced at $29 (1,000s). The ZL9024MEVAL1Z evaluation board is available for $95.

Renesas Electronics | www.renesas.com