Bluetooth 5 Low Power SoC with Integrated Microphone Interface

Dialog Semiconductor recently announced the next generation in its SmartBond family. The DA14586 SoC is the company’s first standalone device qualified to support the latest Bluetooth 5.0 specification. It delivers the lowest power consumption and unrivaled functionality for advanced use cases.DialogDA14586

The DA14586’s features, specs, and benefits:

  • Bluetooth 5 qualified
  • An integrated microphone interface allows manufacturers to add intuitive intelligent voice control to any cloud connected product that has a microphone and speaker
  • Enhancements include an advanced power management setup with both buck and boost converters, which enable support of most primary cell battery types.
  • Double the memory of its predecessor for user applications, making it ideal for adding Bluetooth low energy to proximity tags, beacons, connected medical devices, and smart home applications.
  • Advanced features allow for mesh-based networked applications to be simply supported.
  • Supported by a complete development environment and Dialog’s SmartSnippets software to help engineers optimize software for power consumption.

Source: Dialog Semiconductor

WattUp Wireless Power RF-Transmit IC

Dialog Semiconductor and Energous Corp. recently announced the availability of the DA4100 RF-transmit integrated circuit (IC), which is intended to simplify the implementation of WattUp wireless power transmitter systems. The WattUp wireless power RF-transmit IC integrates the ARM Cortex-M0+, RF transmitter, and power management functionality into a single 7 mm × 7 mm IC. In addition, it features on-chip DC-DC conversion and software, which provides seamless integration to Dialog’s SmartBond family of low-power BLE SoCs. The new IC minimizes required board space, which enables ultra-small charging transmitters and simplifies WattUp’s wireless power transmitter system implementation. DA4100 WattUp wireless power RF-transmit IC evaluation kits are now available.

Source: Dialog Semiconductor

Multiphase 12-A DC-DC Buck Converter

Dialog Semiconductor recently announced the DA9210-A power management IC (PMIC). A multiphase, automotive-grade, 12A DC-DC buck converter, the DA9210-A supplies the high current core rails of microprocessor devices. Designed for automotive applications, the DA9210-A is optimized for the supply of CPUs and GPUs and can support load currents of up to 12 A in single-chip configuration and 24 A in dual parallel configuration.

The PMIC’s features, benefits, and specs:

  • High efficiency over a wide output range
  • Accepts input voltages from 2.8 to 5.5 VDC
  • Delivers an output voltage between 0.3 and 1.57 V, with ±2.5% output voltage accuracy
  • 3-MHz nominal switching frequency
  • Fully AEC-Q100 grade 3 qualified
  • 42 WL-CSP package

Source: Dialog Semiconductor

Simplified Smart Home Device Creation with New Apple HomeKit Bluetooth Dev Kit

Dialog Semicondcutor’s new offering is the first SoC on the market with dedicated hardware acceleration for HomeKit security operations which ensures end-to-end application encryption, safeguarding personal information in transit. With the recent introduction of iOS 10, Apple HomeKit is now an integral part of iOS, including its dedicated app that creates an enhanced user experience. The Apple Home app is compatible not just with iPhone, but is also optimized for iPad and the Apple Watch running watchOS 3. With the app, an Apple TV or iPad can easily act as a smart home hub, enabling home control from anywhere.DialogSemi HomeKit521211

The SmartBond DA14681 supports Bluetooth 4.2 to provide seamless connectivity, and smartly balances power efficiency and performance, with an integrated ARM Cortex M0 processor and expandable flash memory. A Power Management Unit (PMU) provides three independent power rails, in addition to an on-chip charger and fuel gauge, allowing DA14681 to recharge batteries over a USB interface.

Its integrated topology streamlines development, minimizes BOM cost and enables the kit to consume less than five µA on standby. The development kit maximizes application space and flexibility, using a mere 170 KB of flash memory and provides 64 KB of RAM for apps to utilize, even allowing user defined profiles to further customize applications on top of pre-configured HomeKit profiles.

To give developers all of the tools they need to create next-generation IoT applications, the DA14681 development kit consists of the HomeKit SDK, Basic and Pro versions of the kit, and a flexible add-on board to interface with the separately available MFi chip. The new HomeKit development kit and add-on board are now available from Avnet, Digi-Key and Mouser.

Source: Dialog Semiconductor 

Dialog Semiconductor & Energous Announce Wireless Charging Partnership

Dialog Semicondcutor recently announced it will be the exclusive supplier of Energous Corp.’s WattUp RF-based wireless charging ICs. As part of the partnership, Dialog will make a $10 million investment in Energous and work to help drive broader adoption of wireless charging in products such as smartphones, IoT devices, wearables, and more.

The partnership combines Energous’s uncoupled wireless charging technology and Dialog’s power-saving technologies. WattUp technology uses Dialog’s SmartBond Bluetooth low energy solution as the out-of-band communications channel between the wireless transmitter and receiver. Dialog’s power management technology then distributes power from the WattUp receiver IC to the rest of the device. Dialog’s AC/DC Rapid Charge power conversion technology delivers power to the wireless transmitter.

Sources: Dialog Semiconductor and Energous

Dialog Semiconductor Enters Gallium Nitride (GaN) Market

Dialog Semiconductor recently announced the upcoming availability of the DA8801, which is its first gallium nitride (GaN) power IC device, using Taiwan Semiconductor Manufacturing Corporation’s (TSMC) 650-V GaN-on-Silicon process technology. The DA8801 should initially find traction in the the fast-charging smartphone and computing adapter segment.

Along with Dialog’s digital Rapid Charge power conversion controllers, the DA8801 will enable more efficient, smaller, and higher power density adapters compared to FET-based options. The DA8801’s half-bridge integrates building blocks (e.g., gate drives and level shifting circuits) with 650-V power switches. Allows an up to 50% size reduction in power electronics

The DA8801 will be available in sample quantities in Q4 2016.

Source: Dialog Semiconductor

Low-Power 12 DOF Bluetooth Smart Sensor Development Platform

Dialog Semiconductor now offers a small, low-power 12 Degrees-of-Freedom (DOF) wireless smart sensor development kit for Internet of Things (IoT) applications, such as wearables, virtual reality, 3-D indoor mapping, and navigation. The DA14583 SmartBond Bluetooth Smart SoC is combined with Bosch Sensortec’s gyroscope, accelerometer, magnetometer, and environmental sensors. A 16 mm × 15 mm PCB is supplied as a dongle in a plastic housing. Current consumption is only 1.3 mA (typical) when streaming sensor data; it’s less than 110 µA in advertising mode and under 11 µA in power-save mode.Dialog DS025

The complementary software development kit (SDK) includes Dialog’s SmartFusion smart sensor library for data acquisition, auto-calibration, and sensor data fusion. It runs on the DA14583’s embedded Cortex M0 processor. The DA14583 has an ARM Cortex-M0 baseband processor with an integrated ultra-low power Bluetooth Smart radio. The development kit includes the following Bosch sensors: a BMI160 six-axis inertial measurement unit, a BMM150 three-axis geomagnetic field sensor, and a BME280 integrated environmental unit, which measures pressure, temperature, and humidity.

Source: Dialog Semiconductor

New Low-Power Smart Sensor Wireless Platform for IoT Devices

Dialog Semiconductor recently announced that it is collaborating with Bosch Sensortec to develop a low-power smart sensor platform for Internet of Things (IoT) devices. The 12-DOF smart sensor reference platform is intended for gesture recognition in wearable computing devices and immersive gaming, including augmented reality and 3-D indoor mapping and navigation.DS008_bosch-Dialog

The platform comprises Dialog’s DA14580 Bluetooth Smart SoC with three low-power Bosch Sensortecsensors: the BMM150 (for three-axis geo-magnetic field measurement), the BME280 (pressure, humidity, and temperature sensor), and the siz-axis BMI160 (a combination of a three-axis accelerometer and three-axis gyroscope in one chip). The resulting 14 × 14 mm2 unit draws less than 500 µA from a 3-V coin cell when updating and transferring all 12 × 16 bits of data wirelessly to a smartphone.

 

The 2.5 × 2.5 × 0.5 mm DA14580 SmartBond SoC integrates a Bluetooth Smart radio with an ARM Cortex-M0 application processor and intelligent power management. It more than doubles the battery life of an application-enabled smartphone accessory, wearable device, or computer peripheral in comparison with other solutions. The DA14580 includes a variety of analog and digital interfaces and features less than 15 mW power consumption in active mode and 600-nA standby current.

Bosch Sensortec’s BMI160 six-axis Inertial Measurement Unit (IMU) integrates a 16 bit, three-axis, low-g accelerometer and an ultra-low power three-axis gyroscope within a single package. When the accelerometer and gyroscope are in full operation mode, the typical current consumption is 950 µA.

The BMM150 integrates a compact three-axis geo-magnetic field sensor using Bosch Sensortec’s high performance FlipCore technology. The BME280 Integrated Environmental Unit combines sensors for barometric pressure, humidity, and temperature measurement. Its altitude measurement function is a key requirement in applications such as indoor navigation with floor tracking.

Source: Dialog Semiconductor